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Simulation of Mechanical Stresses in BaTiO3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

Materials, 2024-06, Vol.17 (11), p.2702

2024

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The Effect of Multiple Solder Reflows on the Formation of Cu6Sn5 Intermetallics and the Decomposition of SnAg3.0Cu0.5 Solder Joints in the Framework of Rework and Reuse of MLCC Components

Metals (Basel ), 2024-08, Vol.14 (9), p.986

2024

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The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes

Applied sciences, 2022-03, Vol.12 (5), p.2397

2022

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Temperature and pH-stability of commercial stationary phases

Journal of separation science, 2009-05, Vol.32 (9), p.1262-1274

2009

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General Strategy for Performing Temperature Programming in High Performance Liquid Chromatography: Prediction of Linear Temperature Gradients

Analytical chemistry (Washington), 2011-03, Vol.83 (6), p.2227-2233

2011

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LTCC With Temperature Sensor Array for Monitoring of Reactive Die Bond Processes-Design Optimization Using CFD

IEEE transactions on components, packaging, and manufacturing technology (2011), 2024-01, Vol.14 (1), p.122-129

2024

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Carbon Isotope Ratio Analysis of Steroids by High-Temperature Liquid Chromatography-Isotope Ratio Mass Spectrometry

Analytical chemistry (Washington), 2014-03, Vol.86 (5), p.2297-2302

2014

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The influence of thermal ageing on the flow-stress of copper traces on PCB's

Microelectronics and reliability, 2019-08, Vol.99, p.197-202

2019

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Reliability testing of solder joints under combined cyclic thermal and bending load for automotive applications

Microelectronics and reliability, 2022-12, Vol.139, p.114751, Article 114751

2022

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Simulation of Mechanical Stresses in BaTiO 3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

Materials, 2024-06, Vol.17 (11)

2024

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Simulation of Mechanical Stresses in BaTiO[sub.3] Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

Materials, 2024-06, Vol.17 (11)

2024

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Verformung und Schädigung von Werkstoffen der Aufbau- und Verbindungstechnik: Das Verhalten im Mikrobereich

Wiese, Steffen

1. Aufl., 2010

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Morphologies of Reactive Nanolayer Stacks Sputtered on Ceramic Low‐Temperature Cofired Ceramic Substrates Having a Micrometer‐Scale Surface Roughness

Advanced engineering materials, 2024-05

2024

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Determination of Melting and Solidification Temperatures of Sn-Ag-Cu Solder Spheres by Infrared Thermography

Thermochimica acta, 2022-08, Vol.714, p.179245, Article 179245

2022

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Morphologies of Primary Cu 6 Sn 5 and Ag 3 Sn Intermetallics in Sn–Ag–Cu Solder Balls

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-01, Vol.10 (1), p.18-29

2020

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Ultra-soft wires for direct soldering on finger grids of solar cells

Energy procedia, 2017, Vol.124, p.478-483

2017

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A general strategy for performing temperature-programming in high performance liquid chromatography—Prediction of segmented temperature gradients

Journal of Chromatography A, 2011-09, Vol.1218 (39), p.6898-6906

2011

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Wave-shaped wires soldered on the finger grid of solar cells: Solder joint stability under thermal cycling

AIP conference proceedings, 2018, Vol.1999 (1)

2018

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A general strategy for performing temperature-programming in high performance liquid chromatography—Further improvements in the accuracy of retention time predictions of segmented temperature gradients

Journal of Chromatography A, 2012-01, Vol.1222 (27), p.71-80

2012

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Mechanical problems of novel back contact solar modules

Microelectronics and reliability, 2013-08, Vol.53 (8), p.1095-1100

2013

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Determination of Suitable Column Geometries by Means of van Deemter and Kinetic Plots for Isothermal and Isocratic Method Development in High-Temperature Liquid Chromatography Isotope Ratio Mass Spectrometry

Analytical chemistry (Washington), 2012-02, Vol.84 (3), p.1565-1571

2012

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Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn-Ag-Cu Solder Balls

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-01, Vol.10 (1), p.18-29

2020

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A Finite Element Modelling Approach of Test Setups for Multilayer Ceramic Capacitors

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, p.1-4

2019

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The use of bending experiments for the efficient characterization of the mechanical functionality of component interconnections

2024 47th International Spring Seminar on Electronics Technology (ISSE), 2024, Vol.2024, p.1-4

2024

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Study of Thermal Loading of Ceramic Capacitors during Reflow Soldering

2024 47th International Spring Seminar on Electronics Technology (ISSE), 2024, Vol.2024, p.1-5

2024

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Simulation of Mechanical Stresses in BaTiO3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

The Effect of Multiple Solder Reflows on the Formation of Cu6Sn5 Intermetallics and the Decomposition of SnAg3.0Cu0.5 Solder Joints in the Framework of Rework and Reuse of MLCC Components

The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes

Temperature and pH-stability of commercial stationary phases

General Strategy for Performing Temperature Programming in High Performance Liquid Chromatography: Prediction of Linear Temperature Gradients

LTCC With Temperature Sensor Array for Monitoring of Reactive Die Bond Processes-Design Optimization Using CFD

Carbon Isotope Ratio Analysis of Steroids by High-Temperature Liquid Chromatography-Isotope Ratio Mass Spectrometry

The influence of thermal ageing on the flow-stress of copper traces on PCB's

Reliability testing of solder joints under combined cyclic thermal and bending load for automotive applications

Simulation of Mechanical Stresses in BaTiO 3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

Simulation of Mechanical Stresses in BaTiO[sub.3] Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

Verformung und Schädigung von Werkstoffen der Aufbau- und Verbindungstechnik: Das Verhalten im Mikrobereich

Morphologies of Reactive Nanolayer Stacks Sputtered on Ceramic Low‐Temperature Cofired Ceramic Substrates Having a Micrometer‐Scale Surface Roughness

Determination of Melting and Solidification Temperatures of Sn-Ag-Cu Solder Spheres by Infrared Thermography

Morphologies of Primary Cu 6 Sn 5 and Ag 3 Sn Intermetallics in Sn–Ag–Cu Solder Balls

Ultra-soft wires for direct soldering on finger grids of solar cells

A general strategy for performing temperature-programming in high performance liquid chromatography—Prediction of segmented temperature gradients

Wave-shaped wires soldered on the finger grid of solar cells: Solder joint stability under thermal cycling

A general strategy for performing temperature-programming in high performance liquid chromatography—Further improvements in the accuracy of retention time predictions of segmented temperature gradients

Mechanical problems of novel back contact solar modules

Determination of Suitable Column Geometries by Means of van Deemter and Kinetic Plots for Isothermal and Isocratic Method Development in High-Temperature Liquid Chromatography Isotope Ratio Mass Spectrometry

Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn-Ag-Cu Solder Balls

A Finite Element Modelling Approach of Test Setups for Multilayer Ceramic Capacitors

The use of bending experiments for the efficient characterization of the mechanical functionality of component interconnections

Study of Thermal Loading of Ceramic Capacitors during Reflow Soldering

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