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Study on the Mechanism of Silicon Etching in HNO3-Rich HF/HNO3 Mixtures

Journal of physical chemistry. C, 2007-02, Vol.111 (5), p.2133-2140

2007

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Extraction of EELS white-line intensities of manganese compounds: Methods, accuracy, and valence sensitivity

Ultramicroscopy, 2006-03, Vol.106 (4), p.284-291

2006

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New Aspects on the Reduction of Nitric Acid during Wet Chemical Etching of Silicon in Concentrated HF/HNO3 Mixtures

Journal of physical chemistry. C, 2008-09, Vol.112 (36), p.14139-14144

2008

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Influence of initial microstructure and impurities on Cu room-temperature recrystallization (self-annealing)

Microelectronic engineering, 2008-03, Vol.85 (3), p.534-541

2008

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Electrical properties of electroplated Cu(Ag) thin films

Thin solid films, 2009-04, Vol.517 (11), p.3320-3325

2009

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Electroplating of Cu(Ag) thin films for interconnect applications

Microelectronic engineering, 2010-02, Vol.87 (2), p.180-186

2010

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Incorporation of sulfur, chlorine, and carbon into electroplated Cu thin films

Microelectronic engineering, 2007, Vol.84 (1), p.54-59

2007

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XPS investigations of surface segregation of doping elements in SnO2

Applied surface science, 2001-07, Vol.179 (1-4), p.301-306

2001

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Thermodynamic Reassessment of the Cu-O Phase Diagram

Journal of phase equilibria and diffusion, 2005-12, Vol.26 (6), p.605-612

2005

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XPS and ARXPS investigations of ultra thin TaN films deposited on SiO2 and Si

Applied surface science, 2005-09, Vol.252 (1), p.234-239

2005

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Microstructure of electroplated Cu(Ag) alloy thin films

Thin solid films, 2011-03, Vol.519 (11), p.3522-3529

2011

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Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures

Microelectronic engineering, 2009-12, Vol.86 (12), p.2396-2403

2009

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Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2

Thin solid films, 2003-08, Vol.437 (1-2), p.248-256

2003

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Microstructure and Giant Magnetoresistance of Electrodeposited Co-Cu/Cu Multilayers

Journal of the Electrochemical Society, 2001, Vol.148 (3), p.C168

2001

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Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction

Thin solid films, 2006-02, Vol.496 (2), p.703-717

2006

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Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines

Thin solid films, 2009-02, Vol.517 (8), p.2687-2690

2009

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Angle-resolved XPS: a critical evaluation for various applications

Surface and interface analysis, 2006-04, Vol.38 (4), p.590-594

2006

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Effect of nitrogen content on the degradation mechanisms of thin Ta–Si–N diffusion barriers for Cu metallization

Thin solid films, 2006-04, Vol.500 (1), p.259-267

2006

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Characterization of electroplated copper self-annealing with investigations focused on incorporated impurities

Microelectronic engineering, 2005-10, Vol.82 (2), p.189-195

2005

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Depth profile and interface analysis in the nm-range

Applied surface science, 2005-09, Vol.252 (1), p.3-10

2005

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Determination of manganese valency in La1-xSrxMnO3 using ELNES in the (S)TEM

Micron (Oxford, England : 1993), 2007-01, Vol.38 (3), p.224-230

2007

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Interface formation and reactions at Ta–Si and Ta–SiO2 interfaces studied by XPS and ARXPS

Journal of electron spectroscopy and related phenomena, 2004-07, Vol.137-140, p.229-233

2004

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XPS investigations of thin tantalum films on a silicon surface

Analytical and bioanalytical chemistry, 2003-04, Vol.375 (7), p.902-905

2003

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Age of Red Cells for Transfusion and Outcomes in Critically Ill Adults

The New England journal of medicine, 2017-11, Vol.377 (19), p.1858-1867

2017

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Application of FTIR spectra for evaluating interfacial reactions in metal matrix composites

Analytical and bioanalytical chemistry, 2008-03, Vol.390 (6), p.1477-1486

2008

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Study on the Mechanism of Silicon Etching in HNO3-Rich HF/HNO3 Mixtures

Extraction of EELS white-line intensities of manganese compounds: Methods, accuracy, and valence sensitivity

New Aspects on the Reduction of Nitric Acid during Wet Chemical Etching of Silicon in Concentrated HF/HNO3 Mixtures

Influence of initial microstructure and impurities on Cu room-temperature recrystallization (self-annealing)

Electrical properties of electroplated Cu(Ag) thin films

Electroplating of Cu(Ag) thin films for interconnect applications

Incorporation of sulfur, chlorine, and carbon into electroplated Cu thin films

XPS investigations of surface segregation of doping elements in SnO2

Thermodynamic Reassessment of the Cu-O Phase Diagram

XPS and ARXPS investigations of ultra thin TaN films deposited on SiO2 and Si

Microstructure of electroplated Cu(Ag) alloy thin films

Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures

Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2

Microstructure and Giant Magnetoresistance of Electrodeposited Co-Cu/Cu Multilayers

Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction

Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines

Angle-resolved XPS: a critical evaluation for various applications

Effect of nitrogen content on the degradation mechanisms of thin Ta–Si–N diffusion barriers for Cu metallization

Characterization of electroplated copper self-annealing with investigations focused on incorporated impurities

Depth profile and interface analysis in the nm-range

Determination of manganese valency in La1-xSrxMnO3 using ELNES in the (S)TEM

Interface formation and reactions at Ta–Si and Ta–SiO2 interfaces studied by XPS and ARXPS

XPS investigations of thin tantalum films on a silicon surface

Age of Red Cells for Transfusion and Outcomes in Critically Ill Adults

Application of FTIR spectra for evaluating interfacial reactions in metal matrix composites

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