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Self-Healing of Precoated AISI 441 for Solid Oxide Fuel Cell Interconnects at Intermediate Temperatures

ECS transactions, 2017-05, Vol.78 (1), p.1599-1605

2017

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On the thermal stability of atomic layer deposited TiN as gate electrode in MOS devices

IEEE electron device letters, 2003-09, Vol.24 (9), p.550-552

2003

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Long-term (4 year) degradation behavior of coated stainless steel 441 used for solid oxide fuel cell interconnect applications

Journal of power sources, 2020-02, Vol.449, p.227480, Article 227480

2020

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Diffusion of Fe and Na in co-evaporated Cu(In,Ga)Se2 devices on steel substrates

Thin solid films, 2013-05, Vol.535, p.188-192

2013

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Development of Robust Metal‐Supported SOFCs and Stack Components in EU METSAPP Consortium

Fuel cells (Weinheim an der Bergstrasse, Germany), 2017-08, Vol.17 (4), p.508-516

2017

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Investigation of the thermal stability of reactively sputter-deposited TiN MOS gate electrodes

IEEE transactions on electron devices, 2005-10, Vol.52 (10), p.2349-2352

2005

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Synthesis of c-axis-oriented AlN thin films on high-conducting layers: Al, Mo, Ti, TiN, and Ni

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2005-07, Vol.52 (7), p.1170-1174

2005

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Novel Multilayered PVD-Coating in a Roll to Roll Mass Production Process

ECS transactions, 2013-01, Vol.57 (1), p.2203-2208

2013

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Precoated AISI441 for SOFC Interconnectors Studied by TEM Methods

ECS transactions, 2013-01, Vol.57 (1), p.2321-2329

2013

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Nano Coated Interconnects for SOFC (NaCoSOFC)

ECS transactions, 2013, Vol.57 (1), p.2187-2193

2013

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Low-resistivity ZrNx metal gate in MOS devices

Solid-state electronics, 2005-08, Vol.49 (8), p.1410-1413

2005

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Electrical characterization of AlN MIS and MIM structures

IEEE transactions on electron devices, 2003-05, Vol.50 (5), p.1214-1219

2003

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The Time for Industrialization Has Come: A Pre-Coated Solution for the GW Scale

ECS transactions, 2021, Vol.103 (1), p.1803-1808

2021

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Experimental and computer simulation studies of the “baffled target” reactive sputtering process

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2003-11, Vol.21 (6), p.1981-1987

2003

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Variable work function in MOS capacitors utilizing nitrogen-controlled TiNx gate electrodes

Microelectronic engineering, 2004-11, Vol.75 (4), p.389-396

2004

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Long Term (4 Years) Performance of Co/Ce Coated 441 for SOFC Interconnect Applications

ECS transactions, 2017, Vol.78 (1), p.1675-1679

2017

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Low-frequency noise and Coulomb scattering in Si0.8Ge0.2 surface channel pMOSFETs with ALD Al2O3 gate dielectrics

Solid-state electronics, 2005-06, Vol.49 (6), p.907-914

2005

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Self Healing of Precoated AISI 441 for Solid Oxide Fuel Cell Interconnects

ECS transactions, 2015, Vol.68 (1), p.1649-1655

2015

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Iodide-Based Atomic Layer Deposition of ZrO2: Aspects of Phase Stability and Dielectric Properties

Chemical vapor deposition, 2002-05, Vol.8 (3), p.105-109

2002

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A Time Resolved Study of Precoated AISI 441 for SOFC Interconnects Using STEM-EELS - Part I

ECS transactions, 2015, Vol.68 (1), p.1657-1665

2015

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A Time Resolved Study of Precoated AISI 441 for SOFC Interconnects Using STEM-EELS - Part II

ECS transactions, 2015, Vol.68 (1), p.1667-1679

2015

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Multilayered Precoated AISI 441 for Solid Oxide Fuel Cell Interconnects

ECS transactions, 2015, Vol.68 (1), p.1681-1689

2015

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Dielectric and Li transport properties of electron conducting and non-conducting sputtered amorphous Ta2O5 films

Electrochimica acta, 2001-04, Vol.46 (13-14), p.2041-2046

2001

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Diffusion of Fe and Na in co-evaporated Cu(In, Ga) Se-2 devices on steel substrates

Thin solid films, 2013, Vol.535, p.188

2013

Volltextzugriff (PDF)

Patterning of tantalum pentoxide, a high epsilon material, by inductively coupled plasma etching

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2000-07, Vol.18 (4), p.1906-1910

2000

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Self-Healing of Precoated AISI 441 for Solid Oxide Fuel Cell Interconnects at Intermediate Temperatures

On the thermal stability of atomic layer deposited TiN as gate electrode in MOS devices

Long-term (4 year) degradation behavior of coated stainless steel 441 used for solid oxide fuel cell interconnect applications

Diffusion of Fe and Na in co-evaporated Cu(In,Ga)Se2 devices on steel substrates

Development of Robust Metal‐Supported SOFCs and Stack Components in EU METSAPP Consortium

Investigation of the thermal stability of reactively sputter-deposited TiN MOS gate electrodes

Synthesis of c-axis-oriented AlN thin films on high-conducting layers: Al, Mo, Ti, TiN, and Ni

Novel Multilayered PVD-Coating in a Roll to Roll Mass Production Process

Precoated AISI441 for SOFC Interconnectors Studied by TEM Methods

Nano Coated Interconnects for SOFC (NaCoSOFC)

Low-resistivity ZrNx metal gate in MOS devices

Electrical characterization of AlN MIS and MIM structures

The Time for Industrialization Has Come: A Pre-Coated Solution for the GW Scale

Experimental and computer simulation studies of the “baffled target” reactive sputtering process

Variable work function in MOS capacitors utilizing nitrogen-controlled TiNx gate electrodes

Long Term (4 Years) Performance of Co/Ce Coated 441 for SOFC Interconnect Applications

Low-frequency noise and Coulomb scattering in Si0.8Ge0.2 surface channel pMOSFETs with ALD Al2O3 gate dielectrics

Self Healing of Precoated AISI 441 for Solid Oxide Fuel Cell Interconnects

Iodide-Based Atomic Layer Deposition of ZrO2: Aspects of Phase Stability and Dielectric Properties

A Time Resolved Study of Precoated AISI 441 for SOFC Interconnects Using STEM-EELS - Part I

A Time Resolved Study of Precoated AISI 441 for SOFC Interconnects Using STEM-EELS - Part II

Multilayered Precoated AISI 441 for Solid Oxide Fuel Cell Interconnects

Dielectric and Li transport properties of electron conducting and non-conducting sputtered amorphous Ta2O5 films

Diffusion of Fe and Na in co-evaporated Cu(In, Ga) Se-2 devices on steel substrates

Patterning of tantalum pentoxide, a high epsilon material, by inductively coupled plasma etching

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