Sortiert nach
Journal of electronic materials, 2012-02, Vol.41 (2), p.241-252
2012
Link zum Volltext
IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-09, Vol.5 (9), p.1284-1291
2015
- Link zum Volltext
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.425-433
2018
- Link zum Volltext
Journal of electronic materials, 2018-05, Vol.47 (5), p.2752-2760
2018
Link zum Volltext
Journal of electronic materials, 2018-05, Vol.47 (5), p.2526-2544
2018
Link zum Volltext
TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings, p.717-732
Link zum Volltext
Journal of electronic materials, 2012, Vol.41 (2), p.241-252
2012
Link zum Volltext
International Symposium on Microelectronics, 2019-10, Vol.2019 (1), p.480-487
2019
Link zum Volltext
International Symposium on Microelectronics, 2018-10, Vol.2018 (1), p.741-747
2018
Link zum Volltext
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.948-953
2018
- Link zum Volltext
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.493-499
2012
- Link zum Volltext
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1775-1781
2011
- Link zum Volltext
Suchergebnisse filtern
Filter anzeigenNur zeigen
Publikationsform
Erscheinungsjahr
n.n
n.n
Thema
- Science & Technology
- Technology
- Engineering
- Engineering, Electrical & Electronic
- Materials Science
- Soldering
- Materials Science, Multidisciplinary
- Fatigue
- Microstructure
- Physical Sciences
- Physics
- Characterization And Evaluation Of Materials
- Chemistry And Materials Science
- Damage Accumulation
- Electronics And Microelectronics
- Fatigue Failure
- Instrumentation
- Mechanical Engineering
- Optical And Electronic Materials
- Physics, Applied
Kollektion