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Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue
IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-02, Vol.10 (2), p.288-295
2020
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Effects of Thermal Cycling on Creep of SnAgCu Solder Joints
IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-05, Vol.9 (5), p.888-894
2019
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Nanocopper Based Solder-Free Electronic Assembly
Journal of electronic materials, 2014-12, Vol.43 (12), p.4515-4521
2014
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Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue
Journal of electronic materials, 2012-02, Vol.41 (2), p.241-252
2012
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Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.392-398
2012
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A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes
Microelectronics and reliability, 2019-04, Vol.95, p.65-73
2019
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Interpreting accelerated test results for lead free solder joints
2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 2016, p.1-9
2016
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Nanocopper Based Solder-Free Electronic Assembly : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES
Journal of electronic materials, 2014, Vol.43 (12), p.4515-4521
2014
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Effects of variable amplitude loading on lead-free solder joint propoerties and damage accumulation
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.740-744
2012
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Challenges for the prediction of solder joint life in long term vibration
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.1553-1559
2015
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Effects of solder joint dimensions and assembly process on acceleration factors and life in thermal cycling of SnAgCu solder joints
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.92-98
2015
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Towards a quantitative mechanistic understanding of the thermal cycling of SnAgCu solder joints
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.371-378
2014
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A mechanistic model for the life of solder joints under realistic long-term service conditions
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018, p.1-11
2018
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Effect of microstructure evolution on Pb-free solder joint reliability in thermomechanical fatigue
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.493-499
2012
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Recrystallization behavior of lead free and lead containing solder in cycling
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1775-1781
2011
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Dependence of SnAgCu solder joint properties on solder microstructure
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.125-132
2011
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