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Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

Nanoscale research letters, 2017-01, Vol.12 (1), p.56-56, Article 56

2017

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High-entropy transition metal disulfide colloid clusters: synergistic atomic scale interaction and interconnected network for ultra-stable potassium ion storage

Chemical engineering journal (Lausanne, Switzerland : 1996), 2023-08, Vol.469, p.143942, Article 143942

2023

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Identification of electron and hole trap based on isothermal surface potential decay model

Journal of applied physics, 2013-02, Vol.113 (8)

2013

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Aging characterization of high temperature vulcanized silicone rubber housing material used for outdoor insulation

IEEE transactions on dielectrics and electrical insulation, 2015-04, Vol.22 (2), p.961-969

2015

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IEEE_Xplore

Thermodynamic Origin‐Based In Situ Electrochemical Construction of Reversible p‐n Heterojunctions for Optimal Stability in Potassium Ion Storage

Advanced science, 2024-05, Vol.11 (19), p.e2308582-n/a

2024

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3D space-confined Co0.85Se architecture with effective interfacial stress relaxation as anode material reveals robust and highly loading potassium-ion batteries

Journal of colloid and interface science, 2023-08, Vol.643, p.626-639

2023

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3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)

IEEE journal of the Electron Devices Society, 2018-01, Vol.6, p.396-402

2018

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Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-02, Vol.8 (2), p.310-316

2018

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IEEE_Xplore

2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications

IEEE transactions on biomedical circuits and systems, 2014-12, Vol.8 (6), p.810-823

2014

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IEEE_Xplore

Measurements of Secondary Electron Emission From Dielectric Window Materials

IEEE transactions on plasma science, 2013-08, Vol.41 (8), p.2117-2122

2013

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IEEE_Xplore

Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1824-1829

2018

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IEEE_Xplore

An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.349-354

2018

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IEEE_Xplore

Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.35-40

2017

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IEEE_Xplore

Reliability evaluation of glass interposer module

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016, p.337-340

2016

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IEEE_Xplore

Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.1652-1657

2015

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IEEE_Xplore

3D space-confined Co 0.85 Se architecture with effective interfacial stress relaxation as anode material reveals robust and highly loading potassium-ion batteries

Journal of colloid and interface science, 2023-08, Vol.643, p.626

2023

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Process, assembly and electromigration characteristics of glass interposer for 3D integration

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1891-1895

2014

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IEEE_Xplore

Reliability test for integrated Glass interposer

2016 International Conference on Electronics Packaging (ICEP), 2016, p.48-51

2016

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Performance and process characteristic of glass interposer with through-glass-via(TGV)

2013 IEEE International 3D Systems Integration Conference (3DIC), 2013, p.1-7

2013

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IEEE_Xplore

Surface Charge Accumulation on Silicon Rubber Material under DC Voltage in Atmosphere

2013 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 2013, p.456-459

2013

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Surface trapping parameters of solid dielectrics: Novel measurement method and insulation condition characterization

2012 IEEE International Conference on Condition Monitoring and Diagnosis, 2012, p.480-484

2012

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IEEE_Xplore

Investigation of the process for glass interposer

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013, p.194-197

2013

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IEEE_Xplore

Process integration of 3D stacking for backside illuminated image sensor

2014 International Conference on Electronics Packaging (ICEP), 2014, p.82-85

2014

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Analysis on surface characteristics of composite insulator materials after corona discharge

Proceedings of 2011 International Conference on Electrical Insulating Materials (ISEIM), 2011, p.325-328

2011

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IEEE_Xplore

Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology

2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015, p.834-837

2015

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Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

High-entropy transition metal disulfide colloid clusters: synergistic atomic scale interaction and interconnected network for ultra-stable potassium ion storage

Identification of electron and hole trap based on isothermal surface potential decay model

Aging characterization of high temperature vulcanized silicone rubber housing material used for outdoor insulation

Thermodynamic Origin‐Based In Situ Electrochemical Construction of Reversible p‐n Heterojunctions for Optimal Stability in Potassium Ion Storage

3D space-confined Co0.85Se architecture with effective interfacial stress relaxation as anode material reveals robust and highly loading potassium-ion batteries

3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)

Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration

2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications

Measurements of Secondary Electron Emission From Dielectric Window Materials

Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging

An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications

Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP

Reliability evaluation of glass interposer module

Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication

3D space-confined Co 0.85 Se architecture with effective interfacial stress relaxation as anode material reveals robust and highly loading potassium-ion batteries

Process, assembly and electromigration characteristics of glass interposer for 3D integration

Reliability test for integrated Glass interposer

Performance and process characteristic of glass interposer with through-glass-via(TGV)

Surface Charge Accumulation on Silicon Rubber Material under DC Voltage in Atmosphere

Surface trapping parameters of solid dielectrics: Novel measurement method and insulation condition characterization

Investigation of the process for glass interposer

Process integration of 3D stacking for backside illuminated image sensor

Analysis on surface characteristics of composite insulator materials after corona discharge

Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology

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