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Combined treatments for producing 5-hydroxymethylfurfural (HMF) from lignocellulosic biomass

Catalysis today, 2016-12, Vol.278, p.344-349

2016

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Influence of structural defect on thermal–mechanical properties of phosphorene sheets

Journal of materials science, 2017-03, Vol.52 (6), p.3225-3232

2017

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A Layer-Arranged Meshless Method for the Simulation of Additive Manufacturing with Irregular Shapes

Micromachines (Basel), 2021-06, Vol.12 (6), p.674

2021

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Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing

Journal of electronic materials, 2018-03, Vol.47 (3), p.1832-1846

2018

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A Layer-Based Mesh Generator and Scheme for 3D Printing Simulation

Computer modeling in engineering & sciences, 2019-01, Vol.120 (2), p.363-374

2019

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On the Simulation of 3D Printing Process by a Novel Meshless Analysis Procedure

Journal of mechanics, 2020-06, Vol.36 (3), p.285-294

2020

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IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

Microelectronics and reliability, 2013-01, Vol.53 (1), p.30-40

2013

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Hydrogen-doped high conductivity ZnO films deposited by radio-frequency magnetron sputtering

Applied physics letters, 2004-12, Vol.85 (23), p.5628-5630

2004

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Characterization of the Flexural Strength and Fatigue Life of Ultrathin Glass After Dicing

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-12, Vol.8 (12), p.2213-2221

2018

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Board-Level Drop Impact Reliability of Silicon Interposer-Based 2.5-D IC Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-10, Vol.6 (10), p.1493-1504

2016

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Macroscopic Mechanical Constitutive Characterization of Through-Silicon-via-Based 3-D Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-03, Vol.6 (3), p.432-446

2016

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First-principles density functional calculation of mechanical, thermodynamic and electronic properties of CuIn and Cu2In crystals

Journal of alloys and compounds, 2013-01, Vol.546, p.286-295

2013

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The mechanical, thermodynamic, and electronic properties of cubic Au4Al crystal via first-principles calculations

Journal of alloys and compounds, 2016-12, Vol.689, p.857-864

2016

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Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation

Journal of materials science, 2012-04, Vol.47 (7), p.3103-3114

2012

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Bending Characteristics of Foldable Touch Display Panel with a Protection Structure Design

Advances in materials science and engineering, 2015-01, Vol.2015 (2015), p.1-16

2015

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Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz communication

Applied thermal engineering, 2013-04, Vol.53 (1), p.78-88

2013

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A Novel Meshless Analysis Procedure for Three-dimensional Structural Problems with Complicated Geometry

Computer modeling in engineering & sciences, 2013-01, Vol.93 (2), p.149-166

2013

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Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-12, Vol.3 (12), p.2037-2047

2013

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On the First-principles Density Functional Theory Calculation of Electromigration Resistance Ability for Sn-based Intermetallic Compounds

Computer modeling in engineering & sciences, 2014, Vol.100 (2), p.119-131

2014

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An Ab-initio study of structural, elastic, electronic and thermodynamic properties of triclinic Cu7In3

Materials chemistry and physics, 2016-05, Vol.174, p.70-80

2016

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Thermal Chip Placement in MCMs Using a Novel Hybrid Optimization Algorithm

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-05, Vol.2 (5), p.764-774

2012

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Mechanical property assessment of black phosphorene nanotube using molecular dynamics simulation

Computational materials science, 2017-06, Vol.133, p.35-44

2017

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Atomistic-continuum modeling for mechanical properties of single-walled carbon nanotubes

International journal of solids and structures, 2009-04, Vol.46 (7), p.1695-1704

2009

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A study of mechanical properties of multi-layered graphene using modified Nosé–Hoover based molecular dynamics

Computational materials science, 2016-05, Vol.117, p.127-138

2016

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First-principles density functional calculations of physical properties of orthorhombic Au2Al crystal

Intermetallics, 2015-07, Vol.62, p.60-68

2015

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Combined treatments for producing 5-hydroxymethylfurfural (HMF) from lignocellulosic biomass

Influence of structural defect on thermal–mechanical properties of phosphorene sheets

A Layer-Arranged Meshless Method for the Simulation of Additive Manufacturing with Irregular Shapes

Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing

A Layer-Based Mesh Generator and Scheme for 3D Printing Simulation

On the Simulation of 3D Printing Process by a Novel Meshless Analysis Procedure

IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

Hydrogen-doped high conductivity ZnO films deposited by radio-frequency magnetron sputtering

Characterization of the Flexural Strength and Fatigue Life of Ultrathin Glass After Dicing

Board-Level Drop Impact Reliability of Silicon Interposer-Based 2.5-D IC Integration

Macroscopic Mechanical Constitutive Characterization of Through-Silicon-via-Based 3-D Integration

First-principles density functional calculation of mechanical, thermodynamic and electronic properties of CuIn and Cu2In crystals

The mechanical, thermodynamic, and electronic properties of cubic Au4Al crystal via first-principles calculations

Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation

Bending Characteristics of Foldable Touch Display Panel with a Protection Structure Design

Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz communication

A Novel Meshless Analysis Procedure for Three-dimensional Structural Problems with Complicated Geometry

Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology

On the First-principles Density Functional Theory Calculation of Electromigration Resistance Ability for Sn-based Intermetallic Compounds

An Ab-initio study of structural, elastic, electronic and thermodynamic properties of triclinic Cu7In3

Thermal Chip Placement in MCMs Using a Novel Hybrid Optimization Algorithm

Mechanical property assessment of black phosphorene nanotube using molecular dynamics simulation

Atomistic-continuum modeling for mechanical properties of single-walled carbon nanotubes

A study of mechanical properties of multi-layered graphene using modified Nosé–Hoover based molecular dynamics

First-principles density functional calculations of physical properties of orthorhombic Au2Al crystal

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