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Evidence of cooperative effect on the enhanced superconducting transition temperature at the FeSe/SrTiO3 interface

Nature communications, 2019-02, Vol.10 (1), p.758-758, Article 758

2019

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Effects of Surface Electron Doping and Substrate on the Superconductivity of Epitaxial FeSe Films

Nano letters, 2016-03, Vol.16 (3), p.1969-1973

2016

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Strong band renormalization and emergent ferromagnetism induced by electron-antiferromagnetic-magnon coupling

Nature communications, 2022-11, Vol.13 (1), p.6560-6560, Article 6560

2022

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Three-Dimensional Fracture Analysis in Functionally Graded Materials Using the Finite Block Method in Strong Form

Materials, 2023-11, Vol.16 (23), p.7301

2023

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Effect of nanoscale amorphization in nanocrystalline bimaterials on dislocation emission from the tip of colinear linear cracks

Acta mechanica, 2022-05, Vol.233 (5), p.2061-2075

2022

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Anomalous correlation effects and unique phase diagram of electron-doped FeSe revealed by photoemission spectroscopy

Nature communications, 2016-03, Vol.7 (1), p.10840-10840, Article 10840

2016

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Extraordinary Doping Effects on Quasiparticle Scattering and Bandwidth in Iron-Based Superconductors

Physical review. X, 2014-09, Vol.4 (3), p.031041, Article 031041

2014

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Layout-Based Soft Error Rate Estimation Framework Considering Multiple Transient Faults-From Device to Circuit Level

IEEE transactions on computer-aided design of integrated circuits and systems, 2016-04, Vol.35 (4), p.586-597

2016

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Prediction of 3D grinding temperature field based on meshless method considering infinite element

International journal of advanced manufacturing technology, 2019-02, Vol.100 (9-12), p.3067-3084

2019

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Dynamic Switch Migration in Distributed Software-Defined Networks to Achieve Controller Load Balance

IEEE journal on selected areas in communications, 2019-03, Vol.37 (3), p.515-529

2019

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Three-dimensional analysis of functionally graded plates

International journal for numerical methods in engineering, 2011-09, Vol.87 (10), p.923-942

2011

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CASSER: A Closed-Form Analysis Framework for Statistical Soft Error Rate

IEEE transactions on very large scale integration (VLSI) systems, 2013-10, Vol.21 (10), p.1837-1848

2013

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Thermal-Constrained Task Scheduling on 3-D Multicore Processors for Throughput-and-Energy Optimization

IEEE transactions on very large scale integration (VLSI) systems, 2015-11, Vol.23 (11), p.2719-2723

2015

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A Numerical Investigation on the Drying Process of Laminated Green Body Manufactured by 3D Gel-Printing of Metal Power

Strength of materials, 2022, Vol.54 (1), p.75-83

2022

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Finite integration method for partial differential equations

Applied mathematical modelling, 2013-12, Vol.37 (24), p.10092-10106

2013

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Frictional contact analysis of functionally graded materials with Lagrange finite block method

International journal for numerical methods in engineering, 2015-08, Vol.103 (6), p.391-412

2015

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Meshfree modeling and homogenization of 3D orthogonal woven composites

Composites science and technology, 2011-10, Vol.71 (15), p.1777-1788

2011

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Hierarchical Cooperation and Load Balancing for Scalable Autonomous Vehicle Routing in Multi-Access Edge Computing Environment

IEEE transactions on vehicular technology, 2023-06, Vol.72 (6), p.1-13

2023

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The method of particular solutions for solving scalar wave equations

International journal for numerical methods in biomedical engineering, 2010-12, Vol.26 (12), p.1878-1889

2010

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Accurate performance evaluation of VLSI designs with selected CMOS process parameters

IET circuits, devices & systems, 2018-01, Vol.12 (1), p.116-123

2018

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Demystifying Iddq Data With Process Variation for Automatic Chip Classification

IEEE transactions on very large scale integration (VLSI) systems, 2015-06, Vol.23 (6), p.1175-1179

2015

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DAD-FF: Hardening Designs by Delay-Adjustable D-Flip-Flop for Soft-Error-Rate Reduction

IEEE transactions on very large scale integration (VLSI) systems, 2020-04, Vol.28 (4), p.1030-1042

2020

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A Delay-Adjustable, Self-Testable Flip-Flop for Soft-Error Tolerability and Delay-Fault Testability

ACM transactions on design automation of electronic systems, 2021-11, Vol.26 (6), p.1-12

2021

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Unleashing Parallelism With Minimal Test Inflation in Multi-Threaded Test Pattern Generation

IEEE access, 2018-01, Vol.6, p.49269-49281

2018

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Rad-Hard Designs by Automated Latching-Delay Assignment and Time-Borrowable D-Flip-Flop

IEEE transactions on computers, 2022-05, Vol.71 (5), p.1008-1020

2022

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Evidence of cooperative effect on the enhanced superconducting transition temperature at the FeSe/SrTiO3 interface

Effects of Surface Electron Doping and Substrate on the Superconductivity of Epitaxial FeSe Films

Strong band renormalization and emergent ferromagnetism induced by electron-antiferromagnetic-magnon coupling

Three-Dimensional Fracture Analysis in Functionally Graded Materials Using the Finite Block Method in Strong Form

Effect of nanoscale amorphization in nanocrystalline bimaterials on dislocation emission from the tip of colinear linear cracks

Anomalous correlation effects and unique phase diagram of electron-doped FeSe revealed by photoemission spectroscopy

Extraordinary Doping Effects on Quasiparticle Scattering and Bandwidth in Iron-Based Superconductors

Layout-Based Soft Error Rate Estimation Framework Considering Multiple Transient Faults-From Device to Circuit Level

Prediction of 3D grinding temperature field based on meshless method considering infinite element

Dynamic Switch Migration in Distributed Software-Defined Networks to Achieve Controller Load Balance

Three-dimensional analysis of functionally graded plates

CASSER: A Closed-Form Analysis Framework for Statistical Soft Error Rate

Thermal-Constrained Task Scheduling on 3-D Multicore Processors for Throughput-and-Energy Optimization

A Numerical Investigation on the Drying Process of Laminated Green Body Manufactured by 3D Gel-Printing of Metal Power

Finite integration method for partial differential equations

Frictional contact analysis of functionally graded materials with Lagrange finite block method

Meshfree modeling and homogenization of 3D orthogonal woven composites

Hierarchical Cooperation and Load Balancing for Scalable Autonomous Vehicle Routing in Multi-Access Edge Computing Environment

The method of particular solutions for solving scalar wave equations

Accurate performance evaluation of VLSI designs with selected CMOS process parameters

Demystifying Iddq Data With Process Variation for Automatic Chip Classification

DAD-FF: Hardening Designs by Delay-Adjustable D-Flip-Flop for Soft-Error-Rate Reduction

A Delay-Adjustable, Self-Testable Flip-Flop for Soft-Error Tolerability and Delay-Fault Testability

Unleashing Parallelism With Minimal Test Inflation in Multi-Threaded Test Pattern Generation

Rad-Hard Designs by Automated Latching-Delay Assignment and Time-Borrowable D-Flip-Flop

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