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An imaging neutron spectrometer
2010 IEEE International Conference on Technologies for Homeland Security (HST), 2010, p.396-399
2010
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Chip Power-Frequency Scaling in 10/7nm Node
IEEE access, 2020-01, Vol.8, p.1-1
2020
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The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
2015 IEEE International Integrated Reliability Workshop (IIRW), 2015, p.115-118
2015
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The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
2016 IEEE International Reliability Physics Symposium (IRPS), 2016, p.6B-4-1-6B-4-6
2016
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Role of FBEOL Al pads and hard dielectric for improved mechanical performance in lead-free C4 products
2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.2208-2213
2013
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Novel design and integration enhancements in the final polymeric passivation for improved mechanical performance and C4 electromigration in lead-free C4 products
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.571-576
2012
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The application of laser process technology to thin film packaging
IEEE transactions on components, hybrids, and manufacturing technology, 1993-02, Vol.16 (1), p.6-12
1993
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The application of laser process technology to thin film packaging
1992 Proceedings 42nd Electronic Components & Technology Conference, 1992, p.1066-1071
1992
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