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Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material

Materials, 2024-05, Vol.17 (9), p.2158

2024

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Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders

Journal of materials science. Materials in electronics, 2022-05, Vol.33 (15), p.12321-12333

2022

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Minor P Doping to Effectively Suppress IMC Growth in Solder Joints with Electroplated Co(P) Metallization

Journal of electronic materials, 2019-07, Vol.48 (7), p.4552-4561

2019

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Metastable CoSn4 formation induced by minor Ga addition and effective suppression effect on the IMC growth in solid-state Sn–Ga/Co reactions

Journal of materials science, 2016-08, Vol.51 (15), p.7309-7321

2016

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Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder

Metals (Basel ), 2023-04, Vol.13 (4), p.710

2023

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Growth kinetics of the solid-state interfacial reactions in the Sn–Cu/Co and Sn/Co–Cu couples

Materials chemistry and physics, 2011-10, Vol.130 (1), p.651-656

2011

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Effects of Zn and Ga Additions to Suppress PdSn4 Growth at a Solder/Pd Interface Under Current Stressing

Journal of electronic materials, 2018, Vol.47 (1), p.1-8

2018

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Activation of Nrf2-ARE signal pathway in hippocampus of amygdala kindling rats

Neuroscience letters, 2013-05, Vol.543, p.58-63

2013

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Interfacial reactions between eutectic Sn–Pb solder and Co substrate

Journal of materials science, 2011-04, Vol.46 (8), p.2654-2661

2011

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The Effect of Early and Late Tracheotomy on Outcomes in Patients: A Systematic Review and Cumulative Meta-analysis

Otolaryngology-head and neck surgery, 2014-12, Vol.151 (6), p.916-922

2014

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Blind source extraction of rolling bearings' multi-type faults based on self-learned sparse atomics

Proceedings of the Institution of Mechanical Engineers. Part C, Journal of mechanical engineering science, 2019-07, Vol.233 (13), p.4531-4542

Wang, Hong Chao

2019

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Effects of Minor Ga Addition on Interfacial Reactions Between Sn-Ga Solders and Cu

JOM (1989), 2024-06, Vol.76 (6), p.2731-2740

2024

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Strong inhibition of boron dopant on IMC growth between electroplating Co(B) deposits and lead-free solders at 250 °C

Journal of materials science. Materials in electronics, 2023-05, Vol.34 (15), p.1241, Article 1241

2023

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A double-layered nonlinear model predictive control based control algorithm for local trajectory planning for automated trucks under uncertain road adhesion coefficient conditions

Frontiers of information technology & electronic engineering, 2020-07, Vol.21 (7), p.1059-1073

2020

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Selection of prenatal screening with nuchal translucency > 95th centile and below 99th centile: a 4-year observational study with real-world data

Archives of gynecology and obstetrics, 2024-04, Vol.310 (3), p.1779-1785

2024

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Minor Ge Addition to Suppress the IMC Growth in Interfacial Reactions of Co with Sn-Ag-Ge and Sn-Ag-Cu-Ge Solders

Journal of electronic materials, 2022-04, Vol.51 (4), p.1820-1830

2022

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Evaluation of the asynchronization and function of the left ventricle in patients with chronic pulmonary hypertension by velocity vector imaging

Chinese medical journal, 2013-12, Vol.126 (23), p.4457-4462

2013

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Solid-state interfacial reactions of Sn and Sn–Ag–Cu solders with an electroless Co(P) layer deposited on a Cu substrate

Journal of alloys and compounds, 2016-03, Vol.662, p.475-483

2016

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Phase equilibria and solidification properties of Sn-Cu-Ni alloys

Journal of electronic materials, 2002-09, Vol.31 (9), p.907-915

2002

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Interfacial reactions of Sn-Cu/Ni couples at 250 °C

Journal of materials research, 2006-09, Vol.21 (9), p.2270-2277

2006

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Deformation of the left and right ventricular longitudinal myocardium in fetuses with umbilical cord around neck

Chinese medical journal, 2012-05, Vol.125 (9), p.1608-1613

2012

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Cruciform pattern formation in Sn/Co couples

Journal of materials research, 2007-12, Vol.22 (12), p.3404-3409

2007

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Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints

Journal of alloys and compounds, 2016-01, Vol.654, p.546-553

2016

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Strong effects of minor Ga addition on liquid-state Sn–Ga/Co interfacial reactions

Journal of alloys and compounds, 2015-11, Vol.649, p.1197-1204

2015

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Influence of the P content on phase formation in the interfacial reactions between Sn and electroless Co(P) metallization on Cu substrate

Journal of alloys and compounds, 2015-01, Vol.619, p.474-480

2015

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Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material

Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders

Minor P Doping to Effectively Suppress IMC Growth in Solder Joints with Electroplated Co(P) Metallization

Metastable CoSn4 formation induced by minor Ga addition and effective suppression effect on the IMC growth in solid-state Sn–Ga/Co reactions

Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder

Growth kinetics of the solid-state interfacial reactions in the Sn–Cu/Co and Sn/Co–Cu couples

Effects of Zn and Ga Additions to Suppress PdSn4 Growth at a Solder/Pd Interface Under Current Stressing

Activation of Nrf2-ARE signal pathway in hippocampus of amygdala kindling rats

Interfacial reactions between eutectic Sn–Pb solder and Co substrate

The Effect of Early and Late Tracheotomy on Outcomes in Patients: A Systematic Review and Cumulative Meta-analysis

Blind source extraction of rolling bearings' multi-type faults based on self-learned sparse atomics

Effects of Minor Ga Addition on Interfacial Reactions Between Sn-Ga Solders and Cu

Strong inhibition of boron dopant on IMC growth between electroplating Co(B) deposits and lead-free solders at 250 °C

A double-layered nonlinear model predictive control based control algorithm for local trajectory planning for automated trucks under uncertain road adhesion coefficient conditions

Selection of prenatal screening with nuchal translucency > 95th centile and below 99th centile: a 4-year observational study with real-world data

Minor Ge Addition to Suppress the IMC Growth in Interfacial Reactions of Co with Sn-Ag-Ge and Sn-Ag-Cu-Ge Solders

Evaluation of the asynchronization and function of the left ventricle in patients with chronic pulmonary hypertension by velocity vector imaging

Solid-state interfacial reactions of Sn and Sn–Ag–Cu solders with an electroless Co(P) layer deposited on a Cu substrate

Phase equilibria and solidification properties of Sn-Cu-Ni alloys

Interfacial reactions of Sn-Cu/Ni couples at 250 °C

Deformation of the left and right ventricular longitudinal myocardium in fetuses with umbilical cord around neck

Cruciform pattern formation in Sn/Co couples

Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints

Strong effects of minor Ga addition on liquid-state Sn–Ga/Co interfacial reactions

Influence of the P content on phase formation in the interfacial reactions between Sn and electroless Co(P) metallization on Cu substrate

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