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A highly efficient thermally controlled loss-tunable long-period fiber grating on corrugated metal substrate

IEEE photonics technology letters, 2005-03, Vol.17 (3), p.612-614

2005

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Mechanical Properties of Ni Sn and Cu Sn Determined by Inverse Method

IEEE transactions on components and packaging technologies, 2008-06, Vol.31 (2), p.503-508

2008

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Mechanical properties of intermetallic compounds on lead-free solder by Moiré techniques

Journal of electronic materials, 2006-05, Vol.35 (5), p.1059-1066

2006

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Strain-induced thermally tuned long-period fiber gratings fabricated on a periodically corrugated substrate

Journal of lightwave technology, 2004-07, Vol.22 (7), p.1818-1827

2004

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Behavior of Stitched Laminates under In-Plane Tensile and Transverse Impact Loading

Journal of composite materials, 1995-11, Vol.29 (17), p.2254-2279

1995

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On the Inverse Problem of Rectangular Plates Subjected to Elastic Impact, Part I: Method Development and Numerical Verification

Journal of applied mechanics, 1995-09, Vol.62 (3), p.692-698

1995

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Identification of impact forces at multiple locations on laminated plates

AIAA journal, 1994-12, Vol.32 (12), p.2433-2439

1994

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On the Inverse Problem of Rectangular Plates Subjected to Elastic Impact, Part II: Experimental Verification and Further Applications

Journal of applied mechanics, 1995-09, Vol.62 (3), p.699-705

1995

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Response of Composite Laminates to Contact Loads and Relationship to Low-Velocity Impact

Journal of composite materials, 1993-01, Vol.27 (15), p.1443-1464

1993

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Forward and Inverse Analysis for Impact on Sandwich Panels

AIAA journal, 1998-11, Vol.36 (11), p.2130-2136

1998

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The Contact Behavior Between Laminated Composite Plates and Rigid Spheres

Journal of applied mechanics, 1994-03, Vol.61 (1), p.60-66

1994

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Axial crush of metallic honeycombs

International journal of impact engineering, 1997-05, Vol.19 (5-6), p.439-456

1997

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Woven glass/epoxy laminates subject to projectile impact

International journal of impact engineering, 1995-08, Vol.16 (4), p.607-619

1995

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Wafer-level LED-SiP based mobile flash module and characterization

Microelectronics and reliability, 2012-05, Vol.52 (5), p.916-921

2012

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Loading Rate Effect on Woven Glass Laminated Plates by Penetration Force

Journal of composite materials, 1998-01, Vol.32 (8), p.702-721

1998

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Microchip Self-Assembly on a Substrate Using Plasma Treatment

IEEE transactions on advanced packaging, 2008-05, Vol.31 (2), p.404-409

2008

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Impact on composite laminated plates: An inverse method

International journal of impact engineering, 1994-08, Vol.15 (4), p.417-433

1994

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Impact of Unstitched and Stitched Laminates by Line Loading

Journal of composite materials, 1994-11, Vol.28 (17), p.1640-1658

1994

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Penetration into Glass/Epoxy Composite Laminates

Journal of composite materials, 1994-12, Vol.28 (18), p.1783-1802

1994

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Recent advances in optoelectronic technologies in ASTRI

2009 14th OptoElectronics and Communications Conference, 2009, p.1-3

2009

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Smooth contact of orthotropic laminates by rigid cylinders

AIAA journal, 1993-10, Vol.31 (10), p.1916-1921

1993

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Study on the effects of wafer thinning and dicing on chip strength

IEEE transactions on advanced packaging, 2006-02, Vol.29 (1), p.149-157

2006

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Development of Star-Shaped Four-Channel CWDM Optical-Subassembly Module

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1343-1348

2005

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Mechanical behavior of flip chip packages under thermal loading

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1677-1682 Vol. 2

2005

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Self-assembly of microchips on substrates

56th Electronic Components and Technology Conference 2006, 2006, p.6 pp.

2006

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A highly efficient thermally controlled loss-tunable long-period fiber grating on corrugated metal substrate

Mechanical Properties of Ni Sn and Cu Sn Determined by Inverse Method

Mechanical properties of intermetallic compounds on lead-free solder by Moiré techniques

Strain-induced thermally tuned long-period fiber gratings fabricated on a periodically corrugated substrate

Behavior of Stitched Laminates under In-Plane Tensile and Transverse Impact Loading

On the Inverse Problem of Rectangular Plates Subjected to Elastic Impact, Part I: Method Development and Numerical Verification

Identification of impact forces at multiple locations on laminated plates

On the Inverse Problem of Rectangular Plates Subjected to Elastic Impact, Part II: Experimental Verification and Further Applications

Response of Composite Laminates to Contact Loads and Relationship to Low-Velocity Impact

Forward and Inverse Analysis for Impact on Sandwich Panels

The Contact Behavior Between Laminated Composite Plates and Rigid Spheres

Axial crush of metallic honeycombs

Woven glass/epoxy laminates subject to projectile impact

Wafer-level LED-SiP based mobile flash module and characterization

Loading Rate Effect on Woven Glass Laminated Plates by Penetration Force

Microchip Self-Assembly on a Substrate Using Plasma Treatment

Impact on composite laminated plates: An inverse method

Impact of Unstitched and Stitched Laminates by Line Loading

Penetration into Glass/Epoxy Composite Laminates

Recent advances in optoelectronic technologies in ASTRI

Smooth contact of orthotropic laminates by rigid cylinders

Study on the effects of wafer thinning and dicing on chip strength

Development of Star-Shaped Four-Channel CWDM Optical-Subassembly Module

Mechanical behavior of flip chip packages under thermal loading

Self-assembly of microchips on substrates

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