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Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Microelectronic engineering, 2015-04, Vol.137, p.101-104

2015

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Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Journal of electronic packaging, 2018-03, Vol.140 (1)

2018

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Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation

Microsystem technologies : sensors, actuators, systems integration, 2016-03, Vol.22 (3), p.569-575

2016

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Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques

AIP Conference Proceedings, 2014, Vol.1601 (1), p.147

2014

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Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution

Journal of microelectromechanical systems, 2007-04, Vol.16 (2), p.365-372

2007

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Quantitative Determination of the Mechanical Stresses in BEoL Films and Structures on Si Wafers with Sub-micron Spatial Resolution by fibDAC

MRS proceedings, 2012, Vol.1428 (1), p.76-81, Article mrss12-1428-c08-02

2012

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Advanced Experimental and Simulation Approaches to Meet Reliability Challenges of New Electronics Systems

Advanced engineering materials, 2009-04, Vol.11 (4), p.309-315

2009

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Image Correlation Techniques for Microsystems Inspection

Optical Inspection of Microsystems, 2020, p.93-138

2, 2020

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BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, p.1-3

2019

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FibDAC - Residual Stress Determination by Combination of Focused Ion Beam Technique and Digital Image Correlation

Materials science forum, 2006-09, Vol.524-525, p.121-126

2006

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Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components

2016 6th Electronic System-Integration Technology Conference (ESTC), 2016, p.1-5

2016

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Stress measurements on TSVs and BEoL structures with high spatial resolution

2015 China Semiconductor Technology International Conference, 2015, p.1-3

2015

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Untersuchungen zur Schmelzreduktion von eisen-, chrom-, vanadium- und titanhaltigen Osidschmelzen mit ubertragenem Gleichstrom-Plasmabogen in kohlenwasserstoffhaltigen Reduktionsatmospharen

Vogel, Dietmar

1988

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Experiences with the DGPS-based Tramway Location System in Mannheim

Journal of Navigation, 1998-09, Vol.51 (3), p.336-344

Vogel, Dietmar

1998

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Experimental analysis of mechanical stresses and material properties in multi-layer interconnect systems by fibDAC

2013 IEEE International Interconnect Technology Conference - IITC, 2013, p.1-3

2013

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Microscale Deformation Analysis

Handbook of Silicon Based MEMS Materials and Technologies, 2020, p.1-1

3rd Edition, 2020

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Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints

IEEE transactions on components and packaging technologies, 2000-09, Vol.23 (3), p.447-451

2000

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Der Einfluss von Guanylhydrazonen auf die positiv inotropen Wirkungen von Digitoxigenin und eines herzglykosidartig wirkenden Guanylhydrazons

Vogel, Dietmar

1971

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Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments

IEEE transactions on electronics packaging manufacturing, 2003-07, Vol.26 (3), p.239-244

2003

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Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique

2011 Semiconductor Conference Dresden, 2011, p.1-3

2011

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Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up

2011 IEEE 13th Electronics Packaging Technology Conference, 2011, p.29-33

2011

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Local stress measurement methods for packaging purposes- A comparison

3rd Electronics System Integration Technology Conference ESTC, 2010, p.1-4

2010

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fibDAC stress relief - A novel stress measurement approach with high spatial resolution

3rd Electronics System Integration Technology Conference ESTC, 2010, p.1-5

2010

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DGPS Emergency Location System for Vehicles

Journal of navigation, 1994-09, Vol.47 (3), p.349-360

1994

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Localized Stress Measurements - A New Approach Covering Needs for Advanced Micro and Nanoscale System Development

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.1490-1497

2007

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Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation

Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques

Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution

Quantitative Determination of the Mechanical Stresses in BEoL Films and Structures on Si Wafers with Sub-micron Spatial Resolution by fibDAC

Advanced Experimental and Simulation Approaches to Meet Reliability Challenges of New Electronics Systems

Image Correlation Techniques for Microsystems Inspection

BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses

FibDAC - Residual Stress Determination by Combination of Focused Ion Beam Technique and Digital Image Correlation

Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components

Stress measurements on TSVs and BEoL structures with high spatial resolution

Untersuchungen zur Schmelzreduktion von eisen-, chrom-, vanadium- und titanhaltigen Osidschmelzen mit ubertragenem Gleichstrom-Plasmabogen in kohlenwasserstoffhaltigen Reduktionsatmospharen

Experiences with the DGPS-based Tramway Location System in Mannheim

Experimental analysis of mechanical stresses and material properties in multi-layer interconnect systems by fibDAC

Microscale Deformation Analysis

Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints

Der Einfluss von Guanylhydrazonen auf die positiv inotropen Wirkungen von Digitoxigenin und eines herzglykosidartig wirkenden Guanylhydrazons

Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments

Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique

Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up

Local stress measurement methods for packaging purposes- A comparison

fibDAC stress relief - A novel stress measurement approach with high spatial resolution

DGPS Emergency Location System for Vehicles

Localized Stress Measurements - A New Approach Covering Needs for Advanced Micro and Nanoscale System Development

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