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Plane-strain Bulge Test for Thin Films

Journal of materials research, 2005-09, Vol.20 (9), p.2360-2370

2005

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Plastic deformation of freestanding thin films: Experiments and modeling

Journal of the mechanics and physics of solids, 2006-10, Vol.54 (10), p.2089-2110

2006

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The mechanical properties of freestanding electroplated Cu thin films

Journal of materials research, 2006-06, Vol.21 (6), p.1607-1618

2006

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The indentation modulus of elastically anisotropic materials for indenters of arbitrary shape

Journal of the mechanics and physics of solids, 2003-09, Vol.51 (9), p.1701-1721

2003

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Fracture of organosilicate glass thin films: environmental effects

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2005-01, Vol.391 (1), p.159-174

2005

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Tough adhesives for diverse wet surfaces

Science (American Association for the Advancement of Science), 2017-07, Vol.357 (6349), p.378-381

2017

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A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films

Journal of materials research, 1992-12, Vol.7 (12), p.3242-3249

1992

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Bauschinger and size effects in thin-film plasticity

Acta materialia, 2006-12, Vol.54 (20), p.5449-5460

2006

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Bauschinger effect in thin metal films

Scripta materialia, 2005-07, Vol.53 (2), p.177-182

2005

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On the tip calibration for accurate modulus measurement by contact resonance atomic force microscopy

Ultramicroscopy, 2013-05, Vol.128, p.32-41

2013

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Laser annealing of amorphous NiTi shape memory alloy thin films to locally induce shape memory properties

Acta materialia, 2005-10, Vol.53 (18), p.4955-4961

2005

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A model for chemical–mechanical polishing of a material surface based on contact mechanics

Journal of the mechanics and physics of solids, 2004-04, Vol.52 (4), p.847-873

Vlassak, J.J.

2004

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Stress evolution in copper–silver thin films during thermal-cycling

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012, Vol.532, p.414-419

2012

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Channel cracking in thin films on substrates of finite thickness

International journal of fracture, 2003-01, Vol.119/120 (4-2), p.299-323

Vlassak, J J

2003

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Mechanical properties of porous and fully dense low-κ dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique

Journal of materials research, 2006-02, Vol.21 (2), p.386-395

2006

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Microstructural evolution in electroplated Cu thin films

Scripta materialia, 2002-12, Vol.47 (12), p.817-823

2002

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Stress Evolution in Sputter-deposited Fe–Pd Shape-memory Thin Films

Journal of materials research, 2005-09, Vol.20 (9), p.2279-2287

2005

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Local indentation modulus characterization via two contact resonance frequencies atomic force acoustic microscopy

Microelectronic engineering, 2007-03, Vol.84 (3), p.490-494

2007

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Environmental Effects on Subcritical Delamination of Dielectric and Metal Films from Organosilicate Glass (OSG) Thin Films

MRS proceedings, 2003, Vol.766, Article E9.4

2003

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Measuring the elastic modulus and ultimate strength of low-k dielectric materials by means of the bulge test

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.133-135

2004

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Feasibility of pharmacy-initiated pharmacogenetic screening for CYP2D6 and CYP2C19

European journal of clinical pharmacology, 2012-04, Vol.68 (4), p.363-370

2012

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Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding

MRS proceedings, 2005, Vol.863, Article B10.8

2005

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Plane-strain Bulge Test for Thin Films

Plastic deformation of freestanding thin films: Experiments and modeling

The mechanical properties of freestanding electroplated Cu thin films

The indentation modulus of elastically anisotropic materials for indenters of arbitrary shape

Fracture of organosilicate glass thin films: environmental effects

Tough adhesives for diverse wet surfaces

A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films

Bauschinger and size effects in thin-film plasticity

Bauschinger effect in thin metal films

On the tip calibration for accurate modulus measurement by contact resonance atomic force microscopy

Laser annealing of amorphous NiTi shape memory alloy thin films to locally induce shape memory properties

A model for chemical–mechanical polishing of a material surface based on contact mechanics

Stress evolution in copper–silver thin films during thermal-cycling

Channel cracking in thin films on substrates of finite thickness

Mechanical properties of porous and fully dense low-κ dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique

Microstructural evolution in electroplated Cu thin films

Stress Evolution in Sputter-deposited Fe–Pd Shape-memory Thin Films

Local indentation modulus characterization via two contact resonance frequencies atomic force acoustic microscopy

Environmental Effects on Subcritical Delamination of Dielectric and Metal Films from Organosilicate Glass (OSG) Thin Films

Measuring the elastic modulus and ultimate strength of low-k dielectric materials by means of the bulge test

Feasibility of pharmacy-initiated pharmacogenetic screening for CYP2D6 and CYP2C19

Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding

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