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A Review of Interface Microstructures in Electronic Packaging Applications: Brazing and Welding Technologies

JOM (1989), 2022-09, Vol.74 (9), p.3557-3577

Vianco, Paul T.

2022

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A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology

JOM (1989), 2019-01, Vol.71 (1), p.158-177

Vianco, Paul T.

2019

Volltextzugriff (PDF)

Optimum Thickness of Sn Film for Whisker Growth

Journal of electronic materials, 2011-10, Vol.40 (10), p.2069-2075

2011

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Elastic Modulus and Coefficient of Thermal Expansion of 91.84Sn-3.33Ag-4.83Bi Pb-Free Solder

Journal of electronic materials, 2023-03, Vol.52 (3), p.2116-2138

2023

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Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder-Part I: As-cast condition

Journal of electronic materials, 2004-11, Vol.33 (11), p.1389-1400

2004

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Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties

Journal of electronic materials, 2020, Vol.49 (1), p.152-172

2020

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Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to a Ag-Pd-Pt Thick Film Metallization: Part 2—Isothermal Aging Effects

Journal of microelectronics and electronic packaging, 2021-07, Vol.18 (3), p.97-112

2021

Volltextzugriff (PDF)

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Journal of electronic materials, 2004-09, Vol.33 (9), p.991-1004

2004

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An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis

Journal of materials science, 2011, Vol.46 (1), p.263-274

2011

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Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2010-12, Vol.41 (12), p.3042-3052

2010

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Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II: Aged condition

Journal of electronic materials, 2004-12, Vol.33 (12), p.1473-1484

2004

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Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Journal of electronic materials, 2003-03, Vol.32 (3), p.142-151

2003

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Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Journal of electronic materials, 2010, Vol.39 (1), p.97-104

2010

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Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2010-12, Vol.41 (12), p.3053-3064

2010

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The compression stress-strain behavior of Sn-Ag-Cu solder

JOM (1989), 2003-06, Vol.55 (6), p.50-55

2003

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Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.93-119

2007

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Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2006-05, Vol.37 (5), p.1551-1561

2006

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An overview of surface finishes and their role in printed circuit board solderability and solder joint performance

Circuit world, 1999-03, Vol.25 (1), p.6-24

Vianco, Paul T.

1999

Volltextzugriff (PDF)

Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated Kovar substrates

Journal of electronic materials, 2005-03, Vol.34 (3), p.299-310

2005

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Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn 100Sn, and 63Sn-37Pb coatings

Journal of electronic materials, 1994-07, Vol.23 (7), p.583-594

1994

Volltextzugriff (PDF)

Solid-state interface reactions between silver and 95.5sn-3.9ag-0.6cu and 63sn-37pb solders

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2007-10, Vol.38 (10), p.2488-2502

2007

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Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-plated Kovar

Journal of electronic materials, 2003-04, Vol.32 (4), p.254-260

2003

Volltextzugriff (PDF)

Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1—Processing Effects

Journal of microelectronics and electronic packaging, 2021-07, Vol.18 (3), p.81-96

2021

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Nucleation and growth of tin whiskers

Applied physics letters, 2011-06, Vol.98 (24), p.241910-241910-3

2011

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Hollow tin/chromium whiskers

Applied physics letters, 2010-05, Vol.96 (18), p.184102-184102-3

2010

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A Review of Interface Microstructures in Electronic Packaging Applications: Brazing and Welding Technologies

A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology

Optimum Thickness of Sn Film for Whisker Growth

Elastic Modulus and Coefficient of Thermal Expansion of 91.84Sn-3.33Ag-4.83Bi Pb-Free Solder

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder-Part I: As-cast condition

Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties

Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to a Ag-Pd-Pt Thick Film Metallization: Part 2—Isothermal Aging Effects

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis

Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II: Aged condition

Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

The compression stress-strain behavior of Sn-Ag-Cu solder

Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

An overview of surface finishes and their role in printed circuit board solderability and solder joint performance

Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated Kovar substrates

Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn 100Sn, and 63Sn-37Pb coatings

Solid-state interface reactions between silver and 95.5sn-3.9ag-0.6cu and 63sn-37pb solders

Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-plated Kovar

Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1—Processing Effects

Nucleation and growth of tin whiskers

Hollow tin/chromium whiskers

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