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Challenges in the implementation of low-k dielectrics in the back-end of line

Microelectronic engineering, 2005-06, Vol.80, p.337-344

2005

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The evolution of multi-level air gap integration towards 32 nm node interconnects

Microelectronic engineering, 2007-09, Vol.84 (9), p.2177-2183

2007

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Preclinical profile of the HER2-targeting ADC SYD983/SYD985: introduction of a new duocarmycin-based linker-drug platform

Molecular cancer therapeutics, 2014-11, Vol.13 (11), p.2618-2629

2014

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129P BYON4228 is a pan-allelic SIRPα antibody that potentiates killing of antibody-opsonized tumor cells and lacks binding to T-cells

Annals of oncology, 2021-12, Vol.32, p.S1433-S1434

2021

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Optimizing heterologous expression in dictyostelium: importance of 5' codon adaptation

Nucleic acids research, 2000-05, Vol.28 (10), p.2069

2000

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Selection of Self-reactive Peptides Within Human Aggrecan by use of a HLA-DRB10401 Peptide Binding Motif

Journal of autoimmunity, 1997-12, Vol.10 (6), p.569-578

1997

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Q enhancement with cross-connected coplanar waveguides in thick dual damascene Cu

IEEE MTT-S International Microwave Symposium Digest, 2005, 2005, p.1823-1826

2005

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Retention of epidermal growth factor receptors in the endoplasmic reticulum of adenovirus-infected cells

Biochemical journal, 1992-02, Vol.282 (1), p.115-121

1992

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Scalable 1.1 GHz fundamental mode piezo-resistive silicon MEMS resonator

2007 IEEE International Electron Devices Meeting, 2007, p.411-414

2007

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RF-performance of thick damascene Cu interconnect on silicon

2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535), 2004, Vol.3, p.1643-1646 Vol.3

2004

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Human cartilage gp‐39+,CD16+ monocytes in peripheral blood and synovium: Correlation with joint destruction in rheumatoid arthritis

Arthritis and rheumatism, 2000-06, Vol.43 (6), p.1233-1243

2000

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Human cartilage glycoprotein‐39 as a candidate autoantigen in rheumatoid arthritis

Arthritis and rheumatism, 1997-06, Vol.40 (6), p.1115-1125

1997

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Wafer level encapsulation technology for MEMS devices using an HF-permeable PECVD SIOC capping layer

2008 IEEE 21st International Conference on Micro Electro Mechanical Systems, 2008, p.798-801

2008

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Second messenger modulation of epidermal growth factor receptor function does not occur at the level of receptor dimerization

Biochemical journal, 1990-10, Vol.271 (1), p.215-221

1990

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T cell responses to a human cartilage autoantigen in the context of rheumatoid arthritis–associated and nonassociated HLA–DR4 alleles

Arthritis and rheumatism, 1999-07, Vol.42 (7), p.1497-1507

1999

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Characterization of adenovirus type 5 insertion and deletion mutants encoding altered DNA binding proteins

Virology (New York, N.Y.), 1989-10, Vol.172 (2), p.634-642

1989

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Epidermal growth factor-induced phosphoinositide hydrolysis in permeabilized 3T3 cells: lack of guanosine triphosphate dependence and inhibition by tyrosine-containing peptides

Cell regulation, 1990-08, Vol.1 (9), p.615

1990

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General review of issues and perspectives for advanced copper interconnections using air gap as ultra-low K material

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695), 2003, p.65-67

2003

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Process optimisation and dual damascene integration of porous CVD SiOC dielectric at 2.4 and 2.2 k-values for 45 nm CMOS technology

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.202-240

2004

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A piezo-resistive resonant MEMS amplifier

2008 IEEE International Electron Devices Meeting, 2008, p.1-4

2008

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Reliability of wafer level thin film MEMS packages during wafer backgrinding

2009 International Conference on Electronic Packaging Technology & High Density Packaging, 2009, p.679-683

2009

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Air gap integration for the 45nm node and beyond

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005, 2005, p.240-242

2005

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Multi-Level Air Gap Integration for 32/22nm nodes using a Spin-on Thermal Degradable Polymer and a SiOC CVD Hard Mask

2007 IEEE International Interconnect Technology Conferencee, 2007, p.61-63

2007

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Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005, 2005, p.85-87

2005

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Design, Synthesis, and Evaluation of Linker-Duocarmycin Payloads: Toward Selection of HER2-Targeting Antibody–Drug Conjugate SYD985

Molecular pharmaceutics, 2015-06, Vol.12 (6), p.1813-1835

2015

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Challenges in the implementation of low-k dielectrics in the back-end of line

The evolution of multi-level air gap integration towards 32 nm node interconnects

Preclinical profile of the HER2-targeting ADC SYD983/SYD985: introduction of a new duocarmycin-based linker-drug platform

129P BYON4228 is a pan-allelic SIRPα antibody that potentiates killing of antibody-opsonized tumor cells and lacks binding to T-cells

Optimizing heterologous expression in dictyostelium: importance of 5' codon adaptation

Selection of Self-reactive Peptides Within Human Aggrecan by use of a HLA-DRB10401 Peptide Binding Motif

Q enhancement with cross-connected coplanar waveguides in thick dual damascene Cu

Retention of epidermal growth factor receptors in the endoplasmic reticulum of adenovirus-infected cells

Scalable 1.1 GHz fundamental mode piezo-resistive silicon MEMS resonator

RF-performance of thick damascene Cu interconnect on silicon

Human cartilage gp‐39+,CD16+ monocytes in peripheral blood and synovium: Correlation with joint destruction in rheumatoid arthritis

Human cartilage glycoprotein‐39 as a candidate autoantigen in rheumatoid arthritis

Wafer level encapsulation technology for MEMS devices using an HF-permeable PECVD SIOC capping layer

Second messenger modulation of epidermal growth factor receptor function does not occur at the level of receptor dimerization

T cell responses to a human cartilage autoantigen in the context of rheumatoid arthritis–associated and nonassociated HLA–DR4 alleles

Characterization of adenovirus type 5 insertion and deletion mutants encoding altered DNA binding proteins

Epidermal growth factor-induced phosphoinositide hydrolysis in permeabilized 3T3 cells: lack of guanosine triphosphate dependence and inhibition by tyrosine-containing peptides

General review of issues and perspectives for advanced copper interconnections using air gap as ultra-low K material

Process optimisation and dual damascene integration of porous CVD SiOC dielectric at 2.4 and 2.2 k-values for 45 nm CMOS technology

A piezo-resistive resonant MEMS amplifier

Reliability of wafer level thin film MEMS packages during wafer backgrinding

Air gap integration for the 45nm node and beyond

Multi-Level Air Gap Integration for 32/22nm nodes using a Spin-on Thermal Degradable Polymer and a SiOC CVD Hard Mask

Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics

Design, Synthesis, and Evaluation of Linker-Duocarmycin Payloads: Toward Selection of HER2-Targeting Antibody–Drug Conjugate SYD985

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