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Wetting of deep hydrophilic nanoholes by aqueous solutions

Microelectronic engineering, 2021-02, Vol.239-240, p.111515, Article 111515

2021

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Impact of La–OH bonds on the retention of Co/LaSiO CBRAM

Applied physics letters, 2020-10, Vol.117 (15)

2020

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Fundamental study of the removal mechanisms of nano-sized particles using brush scrubber cleaning

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2005-09, Vol.23 (5), p.2160-2175

2005

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Particle adhesion and removal mechanisms during brush scrubber cleaning

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2004-11, Vol.22 (6), p.2844-2852

2004

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Chemical and structural modifications in a 193-nm photoresist after low- k dry etch

Thin solid films, 2008-04, Vol.516 (11), p.3454-3459

2008

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UV-induced modification of fluorocarbon for improvement of subsequent wet removal

Microelectronic engineering, 2014-02, Vol.114, p.136-140

2014

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Removal of post-etch 193 nm photoresist in porous low- k dielectric patterning using UV irradiation and ozonated water

Microelectronic engineering, 2010-11, Vol.87 (9), p.1674-1679

2010

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Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces

Microelectronic engineering, 2009-02, Vol.86 (2), p.181-185

2009

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An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications

Microelectronic engineering, 2013-05, Vol.105, p.119-123

2013

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Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1878-1881

2011

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Characterization of post-etched photoresist and residues by various analytical techniques

Applied surface science, 2008-12, Vol.255 (4), p.1408-1411

2008

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ToF–SIMS and XPS study of ion implanted 248nm deep ultraviolet (DUV) photoresist

Microelectronic engineering, 2011-05, Vol.88 (5), p.677-679

2011

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ToF–SIMS and XPS study of ion implanted 248 nm deep ultraviolet (DUV) photoresist

Microelectronic engineering, 2011-05, Vol.88 (5), p.677-679

2011

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Selection of ESH solvents for the wet removal of post-etch photoresists in low- k dielectrics integration

Microelectronic engineering, 2009-02, Vol.86 (2), p.160-164

2009

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Hypercalcemia induced pancreatitis as a rare presentation of primary hyperparathyroidism

Acta gastro-enterologica belgica, 2021-06, Vol.84 (2), p.367-370

2021

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Surface properties restoration and passivation of high porosity ultra low- k dielectric ( k ∼ 2.3) after direct-CMP

Microelectronic engineering, 2007-11, Vol.84 (11), p.2620-2623

2007

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Materials characterization of WNxCy, WNx and WCx films for advanced barriers

Microelectronic engineering, 2007-11, Vol.84 (11), p.2460-2465

2007

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Surface charging of insulating samples in x-ray photoelectron spectroscopy

Surface and interface analysis, 1998-06, Vol.26 (7), p.490-497

1998

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New method to correct for the influence of organic contamination on intensity ratios in quantitative XPS

Surface and interface analysis, 1999-08, Vol.27 (8), p.761-769

1999

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On the blistering of atomic layer deposited Al2O3 as Si surface passivation

2011 37th IEEE Photovoltaic Specialists Conference, 2011, p.003562-003567

2011

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Stabilization of ambient sensitive atomic layer deposited lanthanum aluminates by annealing and in situ capping

Applied physics letters, 2011-03, Vol.98 (10), p.102904-102904-3

2011

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Influence of beam incidence angle on dry laser cleaning of surface particles

Applied surface science, 2000-03, Vol.157 (1), p.67-73

2000

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An environment friendly wet strip process for 193nm lithography patterning in BEOL applications

Microelectronic engineering, 2013-05, Vol.105, p.119-123

2013

Volltextzugriff (PDF)

Poly-SiGe-Based MEMS Thin-Film Encapsulation

Journal of microelectromechanical systems, 2012-02, Vol.21 (1), p.110-120

2012

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Removal of post-etch 193nm photoresist in porous low-k dielectric patterning using UV irradiation and ozonated water

Microelectronic engineering, 2010-11, Vol.87 (9), p.1674-1679

2010

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Wetting of deep hydrophilic nanoholes by aqueous solutions

Impact of La–OH bonds on the retention of Co/LaSiO CBRAM

Fundamental study of the removal mechanisms of nano-sized particles using brush scrubber cleaning

Particle adhesion and removal mechanisms during brush scrubber cleaning

Chemical and structural modifications in a 193-nm photoresist after low- k dry etch

UV-induced modification of fluorocarbon for improvement of subsequent wet removal

Removal of post-etch 193 nm photoresist in porous low- k dielectric patterning using UV irradiation and ozonated water

Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces

An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications

Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

Characterization of post-etched photoresist and residues by various analytical techniques

ToF–SIMS and XPS study of ion implanted 248nm deep ultraviolet (DUV) photoresist

ToF–SIMS and XPS study of ion implanted 248 nm deep ultraviolet (DUV) photoresist

Selection of ESH solvents for the wet removal of post-etch photoresists in low- k dielectrics integration

Hypercalcemia induced pancreatitis as a rare presentation of primary hyperparathyroidism

Surface properties restoration and passivation of high porosity ultra low- k dielectric ( k ∼ 2.3) after direct-CMP

Materials characterization of WNxCy, WNx and WCx films for advanced barriers

Surface charging of insulating samples in x-ray photoelectron spectroscopy

New method to correct for the influence of organic contamination on intensity ratios in quantitative XPS

On the blistering of atomic layer deposited Al2O3 as Si surface passivation

Stabilization of ambient sensitive atomic layer deposited lanthanum aluminates by annealing and in situ capping

Influence of beam incidence angle on dry laser cleaning of surface particles

An environment friendly wet strip process for 193nm lithography patterning in BEOL applications

Poly-SiGe-Based MEMS Thin-Film Encapsulation

Removal of post-etch 193nm photoresist in porous low-k dielectric patterning using UV irradiation and ozonated water

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