UB Paderborn / Katalog / Suche / in CDI

Extraction of elastic modulus of porous ultra-thin low-k films by two-dimensional finite-element simulations of nanoindentation

Journal of applied physics, 2016-01, Vol.119 (2)

2016

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Intrinsic effect of porosity on mechanical and fracture properties of nanoporous ultralow- k dielectrics

Applied physics letters, 2012-09, Vol.101 (12), p.123109

2012

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Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

Applied physics letters, 2017-10, Vol.111 (16)

2017

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Determination of elastic properties of a MnO2 coating by surface acoustic wave velocity dispersion analysis

Journal of applied physics, 2014-07, Vol.116 (2)

2014

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Improving mechanical robustness of ultralow- k SiOCH plasma enhanced chemical vapor deposition glasses by controlled porogen decomposition prior to UV-hardening

Journal of applied physics, 2010-05, Vol.107 (10), p.104122-104122-7

2010

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Cu pumping in TSVs: Effect of pre-CMP thermal budget

Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1856-1859

2011

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In-situ scanning electron microscopy study of fracture events during back-end-of-line microbeam bending tests

Applied physics letters, 2014-11, Vol.105 (21)

2014

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Impact of wavelength of UV light and UV cure time on chemical and mechanical properties of PECVD deposited porous ultra low-k films

Microelectronic engineering, 2013-07, Vol.107, p.134-137

2013

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In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

Journal of applied physics, 2014-02, Vol.115 (7)

2014

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Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.1971-1974

2012

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Improvement of cohesion strength in ULK OSG materials by pore structure adjustment

Microelectronic engineering, 2015-04, Vol.137, p.75-78

2015

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Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling

Microelectronics and reliability, 2014-06, Vol.54 (6-7), p.1200-1205

2014

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Increasing the mean grain size in copper films and features

Journal of materials research, 2008-03, Vol.23 (3), p.642-662

2008

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Mechanical stability of airgaps in nano-interconnects

Microelectronics and reliability, 2020-04, Vol.107, p.113597, Article 113597

2020

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Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

Microelectronic engineering, 2023-03, Vol.271-272, p.111947, Article 111947

2023

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Impact of oxide liner properties on TSV Cu pumping and TSV stress

2015 IEEE International Reliability Physics Symposium, 2015, p.4C.5.1-4C.5.10

2015

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IEEE_Xplore

On the mechanical and electrical properties of self-assembly-based organosilicate porous films

Journal of materials chemistry. C, Materials for optical and electronic devices, 2017, Vol.5 (33), p.8599-8607

2017

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Influence of germanium incorporation on the structural and electrical properties of boron-doped ultrathin poly-Si sub(1-x )Ge sub( x )films deposited by chemical vapour deposition

Applied physics. A, Materials science & processing, 2014-08, Vol.116 (2), p.751-757

2014

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Influence of germanium incorporation on the structural and electrical properties of boron-doped ultrathin poly-Si1−xGex films deposited by chemical vapour deposition

Applied physics. A, Materials science & processing, 2014, Vol.116 (2), p.751-757

2014

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A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure

Microelectronics and reliability, 2005-03, Vol.45 (3), p.753-759

2005

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UV cure of oxycarbosilane low-k films

Microelectronic engineering, 2016-04, Vol.156, p.103-107

2016

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Influence of germanium incorporation on the structural and electrical properties of boron-doped ultrathin poly-Si1−x Ge x films deposited by chemical vapour deposition

Applied physics. A, Materials science & processing, 2014-08, Vol.116 (2), p.751-757

2014

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MTF test system with AC based dynamic joule correction for electromigration tests on interconnects

Microelectronics and reliability, 2004-09, Vol.44 (9), p.1849-1854

2004

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Determination of elastic properties of a MnO{sub 2} coating by surface acoustic wave velocity dispersion analysis

Journal of applied physics, 2014-07, Vol.116 (2)

2014

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On the mechanical and electrical properties of self-assembly-based organosilicate porous filmsElectronic supplementary information (ESI) available: FTIR of pristine films; FTIR after UV cure; RI, YM, k-value, open pore volume and mass density of the reported films. See DOI: 10.1039/c7tc02276j

2017-08

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Extraction of elastic modulus of porous ultra-thin low-k films by two-dimensional finite-element simulations of nanoindentation

Intrinsic effect of porosity on mechanical and fracture properties of nanoporous ultralow- k dielectrics

Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

Determination of elastic properties of a MnO2 coating by surface acoustic wave velocity dispersion analysis

Improving mechanical robustness of ultralow- k SiOCH plasma enhanced chemical vapor deposition glasses by controlled porogen decomposition prior to UV-hardening

Cu pumping in TSVs: Effect of pre-CMP thermal budget

In-situ scanning electron microscopy study of fracture events during back-end-of-line microbeam bending tests

Impact of wavelength of UV light and UV cure time on chemical and mechanical properties of PECVD deposited porous ultra low-k films

In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

Improvement of cohesion strength in ULK OSG materials by pore structure adjustment

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling

Increasing the mean grain size in copper films and features

Mechanical stability of airgaps in nano-interconnects

Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

Impact of oxide liner properties on TSV Cu pumping and TSV stress

On the mechanical and electrical properties of self-assembly-based organosilicate porous films

Influence of germanium incorporation on the structural and electrical properties of boron-doped ultrathin poly-Si sub(1-x )Ge sub( x )films deposited by chemical vapour deposition

Influence of germanium incorporation on the structural and electrical properties of boron-doped ultrathin poly-Si1−xGex films deposited by chemical vapour deposition

A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure

UV cure of oxycarbosilane low-k films

Influence of germanium incorporation on the structural and electrical properties of boron-doped ultrathin poly-Si1−x Ge x films deposited by chemical vapour deposition

MTF test system with AC based dynamic joule correction for electromigration tests on interconnects

Determination of elastic properties of a MnO{sub 2} coating by surface acoustic wave velocity dispersion analysis

On the mechanical and electrical properties of self-assembly-based organosilicate porous filmsElectronic supplementary information (ESI) available: FTIR of pristine films; FTIR after UV cure; RI, YM, k-value, open pore volume and mass density of the reported films. See DOI: 10.1039/c7tc02276j

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