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LED degradation monitoring using a multi-channel spectral sensor

IEEE access, 2024-01, Vol.12, p.1-1

2024

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Advancements in Spectral Power Distribution Modeling of Light-Emitting Diodes

IEEE access, 2022, Vol.10, p.83612-83619

2022

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Lifetime prediction of current- and temperature-induced degradation in silicone-encapsulated 365 nm high-power light-emitting diodes

IEEE access, 2023-01, Vol.11, p.1-1

2023

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Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment

IEEE transactions on power electronics, 2024-04, Vol.39 (4), p.4725-4734

2024

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Long-Term Temperature-Dependent Degradation of 175 W Chip-on-Board LED Modules

IEEE transactions on electron devices, 2022-12, Vol.69 (12), p.6830-6836

2022

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Towards a System Level Reliability Approach for Solid State Lighting

Journal of Light & Visual Environment, 2011, Vol.35(3), pp.267-273

2011

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Exploring the process-microstructure-thermal properties relationship of resin-reinforced Ag sintering material for high-power applications via 3D FIB-SEM nanotomography

Materials & design, 2024-08, Vol.244, p.113185, Article 113185

2024

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Challenges in the assembly and handling of thin film capped MEMS devices

Sensors, 2010-04, Vol.10 (4), p.3989-4001

2010

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High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout

Microsystems & nanoengineering, 2019-12, Vol.5 (1), p.1-14, Article 60

2019

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AI-assisted Design for Reliability: Review and Perspectives

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-12

2024

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A Review on Gate Oxide Failure Mechanisms of Silicon Carbide Semiconductor Devices

IEEE transactions on electron devices, 2024-10, p.1-14

2024

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A Fully Integrated Electrostatic Charge Boosting Rectifier for Triboelectric Energy Harvesting

IEEE journal of solid-state circuits, 2024-10, p.1-12

2024

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Reliability of LED-based systems

Microelectronics and reliability, 2022-02, Vol.129, p.114477, Article 114477

2022

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Towards a digital twin architecture for the lighting industry

Future generation computer systems, 2024-06, Vol.155, p.80-95

2024

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Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]

Microelectronics and reliability, 2018-08, Vol.87, p.321-321

2018

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ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-6

2024

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Investigating Sintering Mechanism of 100 nm Ag Nanoparticles via In-situ SEM Observation and Phase Field Simulation

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1236-1240

2024

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Prediction of software reliability

Microelectronics and reliability, 2021-04, Vol.119, p.114074, Article 114074

2021

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Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-6

2024

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Prognostic Monitoring of Power QFN Packages with Silver Sintered Die-Attach Materials

IEEE transactions on components, packaging, and manufacturing technology (2011), 2024-08, p.1-1

2024

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Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-7

2024

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Characterization of a Piezoresistive Sensor for In-Situ Health Monitoring of Solder Bumps

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.157-163

2024

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Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application

2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), 2023, p.621-624

2023

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Molecular simulation on the material/interfacial strength of the low-dielectric materials

Microelectronics and reliability, 2007-09, Vol.47 (9), p.1483-1491

2007

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Reliability of LED-based Systems

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, p.1-4

2021

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LED degradation monitoring using a multi-channel spectral sensor

Advancements in Spectral Power Distribution Modeling of Light-Emitting Diodes

Lifetime prediction of current- and temperature-induced degradation in silicone-encapsulated 365 nm high-power light-emitting diodes

Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment

Long-Term Temperature-Dependent Degradation of 175 W Chip-on-Board LED Modules

Towards a System Level Reliability Approach for Solid State Lighting

Exploring the process-microstructure-thermal properties relationship of resin-reinforced Ag sintering material for high-power applications via 3D FIB-SEM nanotomography

Challenges in the assembly and handling of thin film capped MEMS devices

High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout

AI-assisted Design for Reliability: Review and Perspectives

A Review on Gate Oxide Failure Mechanisms of Silicon Carbide Semiconductor Devices

A Fully Integrated Electrostatic Charge Boosting Rectifier for Triboelectric Energy Harvesting

Reliability of LED-based systems

Towards a digital twin architecture for the lighting industry

Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]

ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

Investigating Sintering Mechanism of 100 nm Ag Nanoparticles via In-situ SEM Observation and Phase Field Simulation

Prediction of software reliability

Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

Prognostic Monitoring of Power QFN Packages with Silver Sintered Die-Attach Materials

Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification

Characterization of a Piezoresistive Sensor for In-Situ Health Monitoring of Solder Bumps

Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application

Molecular simulation on the material/interfacial strength of the low-dielectric materials

Reliability of LED-based Systems

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