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Waste heat recovery from a data centre and 5G smart poles for low-temperature district heating network

Energy (Oxford), 2021-03, Vol.218, p.119468, Article 119468

2021

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Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

Materials science & engineering. R, Reports : a review journal, 2010-03, Vol.68 (1), p.1-38

2010

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Interfacial reactions between lead-free solders and common base materials

Materials science & engineering. R, Reports : a review journal, 2005-03, Vol.49 (1), p.1-60

2005

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Efficient two-dimensional simulation of primary reference fuel ignition under engine-relevant thermal stratification

Physics of fluids (1994), 2023-12, Vol.35 (12)

2023

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Large-eddy simulation of highly underexpanded transient gas jets

Physics of fluids (1994), 2013-01, Vol.25 (1)

2013

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Analysis of viscous fluid flow in a pressure-swirl atomizer using large-eddy simulation

International journal of multiphase flow, 2019-04, Vol.113, p.371-388

2019

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DNSLab: A gateway to turbulent flow simulation in Matlab

Computer physics communications, 2016-06, Vol.203, p.278-289

2016

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A large-eddy simulation study on the influence of diesel pilot spray quantity on methane-air flame initiation

Combustion and flame, 2019-08, Vol.206, p.506-521

2019

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Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

Journal of alloys and compounds, 2022-12, Vol.929, p.167228, Article 167228

2022

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Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding

Journal of alloys and compounds, 2022-01, Vol.890, p.161852, Article 161852

2022

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Comparative study on chemical kinetic schemes for dual-fuel combustion of n-dodecane/methane blends

Fuel (Guildford), 2017-03, Vol.191, p.62-76

2017

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Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects

Applied physics letters, 2017-01, Vol.110 (5)

2017

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Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

Journal of electronic materials, 2021-03, Vol.50 (3), p.818-824

2021

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Large-eddy simulation on the effect of injection pressure and density on fuel jet mixing in gas engines

Fuel (Guildford), 2014-08, Vol.130, p.241-250

2014

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An artificial intelligence based-model for heat transfer modeling of 5G smart poles

Case studies in thermal engineering, 2021-12, Vol.28, p.101613, Article 101613

2021

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Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

Journal of alloys and compounds, 2015-01, Vol.619, p.325-331

2015

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Presenting symptoms of glioma in adults

Acta neurologica Scandinavica, 2015-02, Vol.131 (2), p.88-93

2015

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On the implementation of low-dissipative Runge–Kutta projection methods for time dependent flows using OpenFOAM

Computers & fluids, 2014-04, Vol.93, p.153-163

2014

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Debulking or biopsy of malignant glioma in elderly people - a randomised study

Acta neurochirurgica, 2003, Vol.145 (1), p.5-10

2003

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Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers

Microelectronics and reliability, 2009-03, Vol.49 (3), p.242-247

2009

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Microstructural Evolution and Mechanical Properties of Au-20wt.%Sn|Ni Interconnection

Journal of electronic materials, 2016-01, Vol.45 (1), p.566-575

2016

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Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations

Journal of electronic materials, 2008-06, Vol.37 (6), p.792-805

2008

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Diffusion and growth mechanism of Nb3Sn superconductor grown by bronze technique

Applied physics letters, 2010-06, Vol.96 (23)

2010

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A low-dissipative, scale-selective discretization scheme for the Navier–Stokes equations

Computers & fluids, 2012-11, Vol.70, p.195-205

2012

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Thermodynamic reassessment of Au–Cu–Sn ternary system

Journal of alloys and compounds, 2014-03, Vol.588, p.449-460

2014

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Waste heat recovery from a data centre and 5G smart poles for low-temperature district heating network

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

Interfacial reactions between lead-free solders and common base materials

Efficient two-dimensional simulation of primary reference fuel ignition under engine-relevant thermal stratification

Large-eddy simulation of highly underexpanded transient gas jets

Analysis of viscous fluid flow in a pressure-swirl atomizer using large-eddy simulation

DNSLab: A gateway to turbulent flow simulation in Matlab

A large-eddy simulation study on the influence of diesel pilot spray quantity on methane-air flame initiation

Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding

Comparative study on chemical kinetic schemes for dual-fuel combustion of n-dodecane/methane blends

Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects

Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

Large-eddy simulation on the effect of injection pressure and density on fuel jet mixing in gas engines

An artificial intelligence based-model for heat transfer modeling of 5G smart poles

Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

Presenting symptoms of glioma in adults

On the implementation of low-dissipative Runge–Kutta projection methods for time dependent flows using OpenFOAM

Debulking or biopsy of malignant glioma in elderly people - a randomised study

Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers

Microstructural Evolution and Mechanical Properties of Au-20wt.%Sn|Ni Interconnection

Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations

Diffusion and growth mechanism of Nb3Sn superconductor grown by bronze technique

A low-dissipative, scale-selective discretization scheme for the Navier–Stokes equations

Thermodynamic reassessment of Au–Cu–Sn ternary system

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