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Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock

Materials & design, 2022-12, Vol.224, p.111389, Article 111389

2022

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Metastable phases of Ag–Si: amorphous Si and Ag-nodule mediated bonding

Scientific reports, 2024-09, Vol.14 (1), p.19618-9, Article 19618

2024

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Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature

Composites. Part B, Engineering, 2023-04, Vol.254, p.110562, Article 110562

2023

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Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C

Nanoscale, 2018-01, Vol.10 (11), p.5254-5263

2018

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Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules

Journal of materials research and technology, 2023-09, Vol.26, p.1079-1093

2023

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Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current

Journal of electronic materials, 2014-12, Vol.43 (12), p.4428-4434

2014

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Enhanced reliability of Sn–Ag–Bi–In joint under electric current stress by adding Co/Ni elements

Journal of materials science. Materials in electronics, 2014-07, Vol.25 (7), p.3090-3095

2014

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Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors

Applied surface science, 2023-01, Vol.608, p.155165, Article 155165

2023

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Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components

Japanese Journal of Applied Physics, 2014-04, Vol.53 (4S), p.4-1-04EB02-5

2014

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Self-assembled layer as an effective way to block copper diffusion into epoxy

Materials letters, 2024-07, Vol.367, p.136589, Article 136589

2024

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Copper diffusion into epoxy under high temperature

Materials letters, 2024-04, Vol.361, p.136157, Article 136157

2024

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Effects of high temperature and high humidity on the reliability of copper/epoxy bond

Applied surface science, 2024-07, Vol.660, p.159970, Article 159970

2024

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Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

Microelectronics and reliability, 2023-10, Vol.149, p.115211, Article 115211

2023

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Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

Composites. Part B, Engineering, 2024-07, Vol.281, p.111519, Article 111519

2024

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Relationship between Reliability and Effect of Solid Solution Hardening at Solder Joints

AIP conference proceedings, 2012-03

Ueshima, Minoru

2012

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Numerical prediction of fraction of eutectic phase in Sn−Ag−Cu soldring using the phase-field method

Journal of electronic materials, 2006-11, Vol.35 (11), p.1969-1974

2006

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Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °CElectronic supplementary information (ESI) available. See DOI: 10.1039/c7nr09225c

2018-03

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Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

Journal of materials research, 2011-02, Vol.26 (3), p.467-474

2011

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Study on Whisker Growth on Solder Joints-Part I: Study on Acceleration Test Method

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-08, Vol.8 (8), p.1477-1486

2018

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Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint

Microelectronics and reliability, 2011-12, Vol.51 (12), p.2290-2297

2011

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Die-bonding performance and mechanism based on the sintering of micro Ag paste for high power devices

2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO), 2016, p.377-380

2016

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Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES

Journal of electronic materials, 2014, Vol.43 (12), p.4428-4434

2014

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Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders

Journal of materials science. Materials in electronics, 2010-10, Vol.21 (10), p.1066-1075

2010

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Comparison of High Temperature Dielectric Properties Between Epoxy Resins with Alicyclic and Bisphenol A

2024 IEEE 5th International Conference on Dielectrics (ICD), 2024, p.1-4

2024

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Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

2023 International Conference on Electronics Packaging (ICEP), 2023, p.91-92

2023

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Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock

Metastable phases of Ag–Si: amorphous Si and Ag-nodule mediated bonding

Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature

Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C

Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules

Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current

Enhanced reliability of Sn–Ag–Bi–In joint under electric current stress by adding Co/Ni elements

Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors

Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components

Self-assembled layer as an effective way to block copper diffusion into epoxy

Copper diffusion into epoxy under high temperature

Effects of high temperature and high humidity on the reliability of copper/epoxy bond

Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

Relationship between Reliability and Effect of Solid Solution Hardening at Solder Joints

Numerical prediction of fraction of eutectic phase in Sn−Ag−Cu soldring using the phase-field method

Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °CElectronic supplementary information (ESI) available. See DOI: 10.1039/c7nr09225c

Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints

Study on Whisker Growth on Solder Joints-Part I: Study on Acceleration Test Method

Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint

Die-bonding performance and mechanism based on the sintering of micro Ag paste for high power devices

Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES

Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders

Comparison of High Temperature Dielectric Properties Between Epoxy Resins with Alicyclic and Bisphenol A

Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

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