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2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.318-324
2015
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Microelectronics and reliability, 2010-12, Vol.50 (12), p.2026-2036
2010
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.118-125
2024
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IEEE transactions on components and packaging technologies, 2010-03, Vol.33 (1), p.84-97
2010
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Journal of microelectronics and electronic packaging, 2006-10, Vol.3 (4), p.177-193
2006
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2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.1121-1129
2019
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2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018, p.1169-1176
2018
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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.43-50
2016
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2017 IFIP/IEEE Symposium on Integrated Network and Service Management (IM), 2017, p.720-725
2017
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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.51-57
2016
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2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.430-435
2012
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2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.667-673
2013
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2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1579-1585 Vol.2
2004
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53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.182-188
2003
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IEEE transactions on advanced packaging, 2004-05, Vol.27 (2), p.438-452
2004
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System-level reliability assessment of mixed-signal convergent microsystems: System-On-Package (SOP)
2004
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