UB Paderborn / Katalog / Suche / in CDI

High-Performance and Low-Cost 10-Gb/s Bidirectional Optical Subassembly Modules

Journal of lightwave technology, 2007-11, Vol.25 (11), p.3488-3494

2007

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Electro-thermal finite element analysis and verification of power module with aluminum wire

Microelectronic engineering, 2014-05, Vol.120, p.114-120

2014

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Light degradation test and design of thermal performance for high-power light-emitting diodes

Microelectronics and reliability, 2012-05, Vol.52 (5), p.794-803

2012

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Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period

Microelectronic engineering, 2013-07, Vol.107, p.125-129

2013

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Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Microelectronics and reliability, 2008-08, Vol.48 (8), p.1149-1154

2008

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Bonding wire life prediction model of the power module under power cycling test

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-6

2013

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Reliability analysis of copper bump interconnection in double-sided power module

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-4

2015

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Investigating the temperature effect of reliability on integration IC 3D packaging under drop test

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.516-519

2013

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Study on configuration design of interconnection in high power module

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-4

2014

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Reliability analysis of 3D IC integration packaging under drop test condition

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.299-302

2012

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Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and explicit time integration methods

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013, p.105-108

2013

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Development of Empirical Equations for Metal Trace Failure Prediction of Wafer Level Package Under Board Level Drop Test

IEEE transactions on advanced packaging, 2010-08, Vol.33 (3), p.681-689

2010

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Laser microprobe and resonance ionization mass spectrometry for the analysis of trace elements in solids

Review of scientific instruments, 1992-11, Vol.63 (11), p.5299-5305

1992

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Thermal design and transient analysis of insulated gate bipolar transistors of power module

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-5

2010

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Electro-thermal analysis of the Insulated Gate Bipolar Transistor module subjected to power cycling test using specified boundary condition technology

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2011, p.1/5-5/5

2011

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Reliability Assessment of Packaging Solder Joints Under Different Thermal Cycle Loading Rates

IEEE transactions on device and materials reliability, 2015-09, Vol.15 (3), p.437-442

2015

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A study on the thermal performance of a chip-in-substrate-type LED package structure

2010 IEEE CPMT Symposium Japan, 2010, p.1-4

2010

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Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test

IEEE transactions on device and materials reliability, 2014-03, Vol.14 (1), p.484-492

2014

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A study of thermal performance for chip-in-substrate package on package

2009 European Microelectronics and Packaging Conference, 2009, p.1-6

2009

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Light degradation test and design of thermal performance for high-power light-emitting diodes: Reliability of High-Power LED Packaging and Assembly

Microelectronics and reliability, 2012, Vol.52 (5), p.794-803

2012

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Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009, p.1-6

2009

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Investigation of Influences of PCB on Board-level Drop Test by Dynamic Simulation and Modal Analysis

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008, p.185-188

2008

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Reliability and parametric study on chip scale package under board-level drop test

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009, p.537-540

2009

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Fused-silica focusing lens for deep UV laser processing

Applied Optics, 1992-08, Vol.31 (22), p.4397

1992

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Investigation of stress-buffer-enhanced package subjected to board-level drop test

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008, p.1-6

2008

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High-Performance and Low-Cost 10-Gb/s Bidirectional Optical Subassembly Modules

Electro-thermal finite element analysis and verification of power module with aluminum wire

Light degradation test and design of thermal performance for high-power light-emitting diodes

Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Bonding wire life prediction model of the power module under power cycling test

Reliability analysis of copper bump interconnection in double-sided power module

Investigating the temperature effect of reliability on integration IC 3D packaging under drop test

Study on configuration design of interconnection in high power module

Reliability analysis of 3D IC integration packaging under drop test condition

Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and explicit time integration methods

Development of Empirical Equations for Metal Trace Failure Prediction of Wafer Level Package Under Board Level Drop Test

Laser microprobe and resonance ionization mass spectrometry for the analysis of trace elements in solids

Thermal design and transient analysis of insulated gate bipolar transistors of power module

Electro-thermal analysis of the Insulated Gate Bipolar Transistor module subjected to power cycling test using specified boundary condition technology

Reliability Assessment of Packaging Solder Joints Under Different Thermal Cycle Loading Rates

A study on the thermal performance of a chip-in-substrate-type LED package structure

Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test

A study of thermal performance for chip-in-substrate package on package

Light degradation test and design of thermal performance for high-power light-emitting diodes: Reliability of High-Power LED Packaging and Assembly

Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test

Investigation of Influences of PCB on Board-level Drop Test by Dynamic Simulation and Modal Analysis

Reliability and parametric study on chip scale package under board-level drop test

Fused-silica focusing lens for deep UV laser processing

Investigation of stress-buffer-enhanced package subjected to board-level drop test

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