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Control of Photochemical, Photophysical, Electrochemical, and Photocatalytic Properties of Rhenium(I) Complexes Using Intramolecular Weak Interactions between Ligands

Journal of the American Chemical Society, 2005-11, Vol.127 (44), p.15544-15555

2005

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Challenges for Immersion Lithography Extension based on Negative Tone Imaging (NTI) Process

Journal of Photopolymer Science and Technology, 2016/06/21, Vol.29(1), pp.75-80

2016

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Negative-tone Imaging with EUV Exposure toward 13 nm hp

Journal of photopolymer science and technology, 2016, Vol.29 (3), p.479

2016

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Negative-tone Imaging with EUV Exposure toward 13 nm hp

Journal of Photopolymer Science and Technology, 2016/06/21, Vol.29(3), pp.479-487

2016

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Novel EUV Resist Materials Design for 14 nm Half Pitch and below

Journal of Photopolymer Science and Technology, 2014/07/08, Vol.27(5), pp.645-654

2014

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Characterizing Polymer bound PAG Type EUV Resist

Journal of Photopolymer Science and Technology, 2011/06/21, Vol.24(2), pp.185-191

2011

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EUV Resist Materials for 16 nm And below Half Pitch Applications

Journal of Photopolymer Science and Technology, 2012/06/26, Vol.25(5), pp.597-602

2012

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Negative-tone Imaging with EUV Exposure

Journal of Photopolymer Science and Technology, 2015/05/11, Vol.28(4), pp.489-499

2015

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EUV Resist Materials Design for 15 nm Half Pitch and Below

Journal of Photopolymer Science and Technology, 2013/06/25, Vol.26(5), pp.649-657

2013

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Materials and Processes of Negative Tone Development for Double Patterning Process

Journal of Photopolymer Science and Technology, 2009/06/30, Vol.22(5), pp.635-640

2009

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Study on Approaches for Improvement of EUV-resist Sensitivity

Journal of Photopolymer Science and Technology, 2010/06/22, Vol.23(5), pp.693-698

2010

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Development of Materials and Processes for Double Patterning toward 32 nm Node ArF Immersion Lithography

Journal of Photopolymer Science and Technology, 2008/06/24, Vol.21(5), pp.685-690

2008

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Resist Materials Design to Improve Resolution and Sensitivity in EUV Lithography

Journal of Photopolymer Science and Technology, 2009/06/30, Vol.22(1), pp.77-84

2009

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Photocatalytic reduction of CO2 using cis,trans-[Re(dmbpy)(CO)2(PR3)(PR’3)]+ (dmbpy=4,4′-dimethyl-2,2′-bipyridine)

Research on chemical intermediates, 2007-01, Vol.33 (1-2), p.37-48

2007

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Study on the Material Design for LWR Improvement

Journal of Photopolymer Science and Technology, 2007, Vol.20(3), pp.333-338

2007

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Development of Materials and Processes for Double Patterning toward 32nm Node ArF Immersion Lithography

Journal of photopolymer science and technology, 2008, Vol.21 (5), p.685-690

2008

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Effect of intramolecular pi-pi and CH-pi interactions between ligands on structure, electrochemical and spectroscopic properties of fac-[Re(bpy)(CO)3(PR3)]+(bpy = 2,2'-bipyridine; PR3= trialkyl or triarylphosphines)

Dalton transactions : an international journal of inorganic chemistry, 2005-01 (2), p.385-395

2005

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Structures Paper: Isolation Story Structure of Umeda Tower, Osaka, Japan

Structural engineering international : journal of the International Association for Bridge and Structural Engineering (IABSE), 2003-11, Vol.13 (4), p.225-227

2003

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Mechanism of the Photochemical Ligand Substitution Reactions of fac-[Re(bpy)(CO)3(PR3)]+ Complexes and the Properties of Their Triplet Ligand-Field Excited States

Journal of the American Chemical Society, 2002-09, Vol.124 (38), p.11448-11455

2002

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DEVELOPMENT OF A SHEAR-PIN WITH A GAP RESISTING WIND LOAD FOR BASE ISOLATED HIGH-RISE HOUSING

AIJ journal of technology and design, 2007, Vol.13 (26), p.431-434

2007

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Isolation story structure of Umeda Tower, Osaka, Japan

Structural engineering international : journal of the International Association for Bridge and Structural Engineering (IABSE), 2003-11, Vol.13 (4), p.225-227

2003

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Isolation story structure of Umeda Tower, Osaka, Japan : Structures subjected to extreme natural and man-made hazards

Structural engineering international : journal of the International Association for Bridge and Structural Engineering (IABSE), 2003, Vol.13 (4), p.225-227

2003

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Mechanism of the Photochemical Ligand Substitution Reactions of f ac-[Re(bpy)(CO)3(PR3)]+ Complexes and the Properties of Their Triplet Ligand-Field Excited States

Journal of the American Chemical Society, 2002-09, Vol.124 (38), p.11448-11455

2002

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New Synthetic Routes to Biscarbonylbipyridinerhenium(I) Complexes cis,trans-[Re(X2bpy)(CO)2(PR3)(Y)] n + (X2bpy = 4,4‘-X2-2,2‘-bipyridine) via Photochemical Ligand Substitution Reactions, and Their Photophysical and Electrochemical Properties

Inorganic chemistry, 2000-06, Vol.39 (13), p.2777-2783

2000

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Double development offers simpler double patterning

Solid state technology, 2008-05, Vol.51 (5), p.18

Derbyshire, Katherine

2008

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Control of Photochemical, Photophysical, Electrochemical, and Photocatalytic Properties of Rhenium(I) Complexes Using Intramolecular Weak Interactions between Ligands

Challenges for Immersion Lithography Extension based on Negative Tone Imaging (NTI) Process

Negative-tone Imaging with EUV Exposure toward 13 nm hp

Negative-tone Imaging with EUV Exposure toward 13 nm hp

Novel EUV Resist Materials Design for 14 nm Half Pitch and below

Characterizing Polymer bound PAG Type EUV Resist

EUV Resist Materials for 16 nm And below Half Pitch Applications

Negative-tone Imaging with EUV Exposure

EUV Resist Materials Design for 15 nm Half Pitch and Below

Materials and Processes of Negative Tone Development for Double Patterning Process

Study on Approaches for Improvement of EUV-resist Sensitivity

Development of Materials and Processes for Double Patterning toward 32 nm Node ArF Immersion Lithography

Resist Materials Design to Improve Resolution and Sensitivity in EUV Lithography

Photocatalytic reduction of CO2 using cis,trans-[Re(dmbpy)(CO)2(PR3)(PR’3)]+ (dmbpy=4,4′-dimethyl-2,2′-bipyridine)

Study on the Material Design for LWR Improvement

Development of Materials and Processes for Double Patterning toward 32nm Node ArF Immersion Lithography

Effect of intramolecular pi-pi and CH-pi interactions between ligands on structure, electrochemical and spectroscopic properties of fac-[Re(bpy)(CO)3(PR3)]+(bpy = 2,2'-bipyridine; PR3= trialkyl or triarylphosphines)

Structures Paper: Isolation Story Structure of Umeda Tower, Osaka, Japan

Mechanism of the Photochemical Ligand Substitution Reactions of fac-[Re(bpy)(CO)3(PR3)]+ Complexes and the Properties of Their Triplet Ligand-Field Excited States

DEVELOPMENT OF A SHEAR-PIN WITH A GAP RESISTING WIND LOAD FOR BASE ISOLATED HIGH-RISE HOUSING

Isolation story structure of Umeda Tower, Osaka, Japan

Isolation story structure of Umeda Tower, Osaka, Japan : Structures subjected to extreme natural and man-made hazards

Mechanism of the Photochemical Ligand Substitution Reactions of f ac-[Re(bpy)(CO)3(PR3)]+ Complexes and the Properties of Their Triplet Ligand-Field Excited States

New Synthetic Routes to Biscarbonylbipyridinerhenium(I) Complexes cis,trans-[Re(X2bpy)(CO)2(PR3)(Y)] n + (X2bpy = 4,4‘-X2-2,2‘-bipyridine) via Photochemical Ligand Substitution Reactions, and Their Photophysical and Electrochemical Properties

Double development offers simpler double patterning

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