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Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

Materials in engineering, 2010-02, Vol.31 (2), p.990-993

2010

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Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012-05, Vol.545, p.194-200

2012

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An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu―XTiO2 composite solders as functions of alloy composition and cooling rate

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2011, Vol.529C, p.41-48

TSAO, L. C

2011

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Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

Materials in engineering, 2010-12, Vol.31 (10), p.4831-4835

2010

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Age hardening reaction of the Al0.3CrFe1.5MnNi0.5 high entropy alloy

Materials in engineering, 2012-04, Vol.36, p.854-858

2012

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Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

Materials in engineering, 2013-09, Vol.50, p.774-781

2013

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Brazing of 6061 aluminum alloy/Ti–6Al–4V using Al–Si–Cu–Ge filler metals

Journal of materials processing technology, 2012-01, Vol.212 (1), p.8-14

2012

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Flow stress behavior of commercial pure titanium sheet during warm tensile deformation

Materials in engineering, 2012-02, Vol.34, p.179-184

2012

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Flow stress behavior of AZ61 magnesium alloy during hot compression deformation

Materials in engineering, 2014-01, Vol.53, p.865-869

2014

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Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

Journal of alloys and compounds, 2011-02, Vol.509 (5), p.2326-2333

Tsao, L.C.

2011

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Effect of Sn addition on the corrosion behavior of Ti–7Cu–Sn cast alloys for biomedical applications

Materials Science & Engineering C, 2015-01, Vol.46, p.246-252

Tsao, L.C.

2015

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Interfacial structure and fracture behavior of 6061 Al and MAO-6061 Al direct active soldered with Sn–Ag–Ti active solder

Materials in engineering, 2014-04, Vol.56, p.318-324

Tsao, L.C.

2014

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Effects of Cu addition on the microstructure and mechanical properties of Ti15Sn alloys

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-06, Vol.698, p.98-103

Tsao, L.C.

2017

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Ibrutinib in combination with nab-paclitaxel and gemcitabine for first-line treatment of patients with metastatic pancreatic adenocarcinoma: phase III RESOLVE study

Annals of oncology, 2021-05, Vol.32 (5), p.600-608

2021

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Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Journal of alloys and compounds, 2011-08, Vol.509 (33), p.8441-8448

Tsao, L.C.

2011

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An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu– XTiO 2 composite solders as functions of alloy composition and cooling rate

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2011, Vol.529, p.41-48

Tsao, L.C.

2011

Volltextzugriff (PDF)

Evolution of nano-Ag 3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

Journal of alloys and compounds, 2011, Vol.509 (5), p.2326-2333

Tsao, L.C.

2011

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Suppressing effect of 0.5 wt.% nano-TiO 2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Journal of alloys and compounds, 2011, Vol.509 (33), p.8441-8448

Tsao, L.C.

2011

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Corrosion characterization of Cu–Sn intermetallics in 3.5wt.% NaCl solution

Corrosion science, 2012-10, Vol.63, p.393-398

2012

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Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2013-03, Vol.565, p.63-71

Tsao, L.C.

2013

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Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Materials in engineering, 2011-12, Vol.32 (10), p.4720-4727

2011

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Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012-12, Vol.558, p.478-484

2012

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Basic Electrochemical Behavior of Ti-7Cu Alloys for Medical Applications

Acta physica Polonica, A, 2012-09, Vol.122 (3), p.561-564

Tsao, L.C.

2012

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Direct active soldering of Al 0.3 CrFe 1.5 MnNi 0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder

Transactions of Nonferrous Metals Society of China, 2018-04, Vol.28 (4), p.748-756

2018

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Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging

Materials in engineering, 2012-08, Vol.39, p.475-483

2012

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Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu―XTiO2 composite solders as functions of alloy composition and cooling rate

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

Age hardening reaction of the Al0.3CrFe1.5MnNi0.5 high entropy alloy

Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

Brazing of 6061 aluminum alloy/Ti–6Al–4V using Al–Si–Cu–Ge filler metals

Flow stress behavior of commercial pure titanium sheet during warm tensile deformation

Flow stress behavior of AZ61 magnesium alloy during hot compression deformation

Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

Effect of Sn addition on the corrosion behavior of Ti–7Cu–Sn cast alloys for biomedical applications

Interfacial structure and fracture behavior of 6061 Al and MAO-6061 Al direct active soldered with Sn–Ag–Ti active solder

Effects of Cu addition on the microstructure and mechanical properties of Ti15Sn alloys

Ibrutinib in combination with nab-paclitaxel and gemcitabine for first-line treatment of patients with metastatic pancreatic adenocarcinoma: phase III RESOLVE study

Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu– XTiO 2 composite solders as functions of alloy composition and cooling rate

Evolution of nano-Ag 3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

Suppressing effect of 0.5 wt.% nano-TiO 2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Corrosion characterization of Cu–Sn intermetallics in 3.5wt.% NaCl solution

Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler

Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

Basic Electrochemical Behavior of Ti-7Cu Alloys for Medical Applications

Direct active soldering of Al 0.3 CrFe 1.5 MnNi 0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder

Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging

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