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Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn-3.5Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Journal of alloys and compounds, 2011-08, Vol.509 (33), p.8441-8448

TSAO, L. C

2011

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Elotuzumab in Combination With Lenalidomide and Low-Dose Dexamethasone in Relapsed or Refractory Multiple Myeloma

Journal of clinical oncology, 2012-06, Vol.30 (16), p.1953-1959

2012

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Randomized phase 2 study: elotuzumab plus bortezomib/dexamethasone vs bortezomib/dexamethasone for relapsed/refractory MM

Blood, 2016-06, Vol.127 (23), p.2833-2840

2016

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Radio Occultation Observations as Anchor Observations in Numerical Weather Prediction Models and Associated Reduction of Bias Corrections in Microwave and Infrared Satellite Observations

Journal of atmospheric and oceanic technology, 2014-01, Vol.31 (1), p.20-32

2014

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An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu―XTiO2 composite solders as functions of alloy composition and cooling rate

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2011, Vol.529C, p.41-48

TSAO, L. C

2011

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Ibrutinib in combination with nab-paclitaxel and gemcitabine for first-line treatment of patients with metastatic pancreatic adenocarcinoma: phase III RESOLVE study

Annals of oncology, 2021-05, Vol.32 (5), p.600-608

2021

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Prediction of Outcome in Patients With Chronic Lymphocytic Leukemia Treated With Ibrutinib: Development and Validation of a Four-Factor Prognostic Model

Journal of clinical oncology, 2021-02, Vol.39 (6), p.576-585

2021

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Corrosion characterization of Cu―Sn intermetallics in 3.5 wt.% NaCl solution

Corrosion science, 2012-10, Vol.63, p.393-398

2012

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Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012-12, Vol.558, p.478-484

2012

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Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012-05, Vol.545, p.194-200

2012

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Joining of SiO2 glass and substrate using In49Sn active solder in air

Journal of materials science. Materials in electronics, 2024, Vol.35 (1), p.81, Article 81

2024

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Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2013-03, Vol.565, p.63-71

Tsao, L.C.

2013

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An integrated flexible temperature and tactile sensing array using PI-copper films

Sensors and actuators. A. Physical., 2008-05, Vol.143 (1), p.143-153

2008

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Genome-wide association and multi-trait analyses characterize the common genetic architecture of heart failure

Nature communications, 2022-11, Vol.13 (1), p.6914-15, Article 6914

2022

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Major Depressive Disorder Impacts Peripheral Artery Disease Risk Through Intermediary Risk Factors

Journal of the American Heart Association, 2024-02, Vol.13 (4), p.e030233-e030233

2024

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Effects of Cu addition on the microstructure and mechanical properties of Ti15Sn alloys

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-06, Vol.698, p.98-103

Tsao, L.C.

2017

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Microstructural characterization and mechanical properties of microplasma oxidized TiO2/Ti joints soldered using Sn3.5Ag4Ti(Ce) active filler

Journal of materials science. Materials in electronics, 2014, Vol.25 (1), p.233-243

Tsao, L. C.

2014

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Joining 6061 aluminum alloy with Al–Si–Cu filler metals

Journal of alloys and compounds, 2009-11, Vol.488 (1), p.174-180

2009

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MitoScape: A big-data, machine-learning platform for obtaining mitochondrial DNA from next-generation sequencing data

PLoS computational biology, 2021-11, Vol.17 (11), p.e1009594-e1009594

2021

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Phase I Study of Enavatuzumab, a First-in-Class Humanized Monoclonal Antibody Targeting the TWEAK Receptor, in Patients with Advanced Solid Tumors

Molecular cancer therapeutics, 2018-01, Vol.17 (1), p.215-221

2018

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ST-Segment Elevation Myocardial Infarction Due to Right Coronary Artery Compression by Cardiac Synovial Sarcoma

JACC. Cardiovascular interventions, 2019-09, Vol.12 (17), p.e145-e147

2019

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Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders

Journal of materials science. Materials in electronics, 2018-03, Vol.29 (5), p.4096-4105

2018

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Brazing of 6061 aluminum alloy/Ti–6Al–4V using Al–Si–Cu–Ge filler metals

Journal of materials processing technology, 2012-01, Vol.212 (1), p.8-14

2012

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Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate

Microelectronic engineering, 2011-09, Vol.88 (9), p.2964-2969

2011

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Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn-3.5Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Elotuzumab in Combination With Lenalidomide and Low-Dose Dexamethasone in Relapsed or Refractory Multiple Myeloma

Randomized phase 2 study: elotuzumab plus bortezomib/dexamethasone vs bortezomib/dexamethasone for relapsed/refractory MM

Radio Occultation Observations as Anchor Observations in Numerical Weather Prediction Models and Associated Reduction of Bias Corrections in Microwave and Infrared Satellite Observations

An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu―XTiO2 composite solders as functions of alloy composition and cooling rate

Ibrutinib in combination with nab-paclitaxel and gemcitabine for first-line treatment of patients with metastatic pancreatic adenocarcinoma: phase III RESOLVE study

Prediction of Outcome in Patients With Chronic Lymphocytic Leukemia Treated With Ibrutinib: Development and Validation of a Four-Factor Prognostic Model

Corrosion characterization of Cu―Sn intermetallics in 3.5 wt.% NaCl solution

Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

Joining of SiO2 glass and substrate using In49Sn active solder in air

Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler

An integrated flexible temperature and tactile sensing array using PI-copper films

Genome-wide association and multi-trait analyses characterize the common genetic architecture of heart failure

Major Depressive Disorder Impacts Peripheral Artery Disease Risk Through Intermediary Risk Factors

Elotuzumab in combination with lenalidomide and dexamethasone in patients with relapsed multiple myeloma: final phase 2 results from the randomised, open-label, phase 1b–2 dose-escalation study

Effects of Cu addition on the microstructure and mechanical properties of Ti15Sn alloys

Microstructural characterization and mechanical properties of microplasma oxidized TiO2/Ti joints soldered using Sn3.5Ag4Ti(Ce) active filler

Joining 6061 aluminum alloy with Al–Si–Cu filler metals

MitoScape: A big-data, machine-learning platform for obtaining mitochondrial DNA from next-generation sequencing data

Phase I Study of Enavatuzumab, a First-in-Class Humanized Monoclonal Antibody Targeting the TWEAK Receptor, in Patients with Advanced Solid Tumors

ST-Segment Elevation Myocardial Infarction Due to Right Coronary Artery Compression by Cardiac Synovial Sarcoma

Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders

Brazing of 6061 aluminum alloy/Ti–6Al–4V using Al–Si–Cu–Ge filler metals

Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate

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