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Biobased Copolyamides 56/66: Synthesis, Characterization and Crystallization Kinetics

Polymers, 2022-09, Vol.14 (18), p.3879

2022

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The Isothermal and Nonisothermal Crystallization Kinetics and Morphology of Solvent-Precipitated Nylon 66

Polymers, 2022-01, Vol.14 (3), p.442

2022

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Performance Enhancement of Flip-Chip Packaged AlGaN/GaN HEMTs by Strain Engineering Design

IEEE transactions on electron devices, 2016-10, Vol.63 (10), p.3876-3881

2016

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Fabrication of Robust and Effective Oil/Water Separating Superhydrophobic Textile Coatings

Membranes (Basel), 2023-03, Vol.13 (4), p.401

2023

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Fabrication of Hydrophobic Surfaces by Coupling of Langmuir−Blodgett Deposition and a Self-Assembled Monolayer

Langmuir, 2006-06, Vol.22 (13), p.5660-5665

2006

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Investigation of electrical and thermal properties of multiple AlGaN/GaN high-electron-mobility transistors flip-chip packaged in parallel for power electronics

Applied physics express, 2015-03, Vol.8 (3), p.34101

2015

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Fabrication and characterization of transparent superhydrophilic/superhydrophobic silica nanoparticulate thin films

Thin solid films, 2011-06, Vol.519 (16), p.5450-5455

2011

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Performance Enhancement of Flip-Chip Packaged AlGaN/GaN HEMTs Using Active-Region Bumps-Induced Piezoelectric Effect

IEEE electron device letters, 2014-07, Vol.35 (7), p.735-737

2014

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Effective Passivation With High-Density Positive Fixed Charges for GaN MIS-HEMTs

IEEE journal of the Electron Devices Society, 2017-05, Vol.5 (3), p.170-174

2017

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Synthesis and characterization of CdSxSe1−x alloy quantum dots with composition-dependent band gaps and paramagnetic properties

RSC advances, 2018-08, Vol.8 (52), p.32-311

2018

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Preparation and characterization of thermal-sensitive ferrofluids for drug delivery application

Journal of magnetism and magnetic materials, 2007-03, Vol.310 (2), p.2850-2852

2007

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A novel and facile antibacterial sponge for effective demulsification and oil/water emulsions separation

Desalination and water treatment, 2020-02, Vol.178, p.387-395

2020

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Hierarchically structured superhydrophobic coatings fabricated by successive Langmuir–Blodgett deposition of micro-/nano-sized particles and surface silanization

Nanotechnology, 2007-11, Vol.18 (46), p.465604-465604 (7)

2007

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Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V -Band Frequencies With Excellent Reliability

IEEE transactions on microwave theory and techniques, 2010-08, Vol.58 (8), p.2244-2250

2010

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A study on combining natural dyes and environmentally-friendly mordant to improve color strength and ultraviolet protection of textiles

Fibers and polymers, 2017-08, Vol.18 (8), p.1523-1530

2017

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Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-03, Vol.2 (3), p.402-409

2012

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An 80 nm In0.7Ga0.3As MHEMT with flip-chip packaging for W-band low noise applications

2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM), 2010, p.1-4

2010

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Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications

IEEE microwave and wireless components letters, 2014-01, Vol.24 (1), p.11-13

2014

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A flip-chip packaged 80-nm In0.7Ga0.3As MHEMT for millimeter-wave low-noise applications

Microelectronic engineering, 2011-02, Vol.88 (2), p.183-186

2011

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Preparation of poly[3-(methacryloylamino) propyl] trimethylammonium chloride coated mesh for oil–water separation

Desalination and water treatment, 2019-08, Vol.158, p.301-308

2019

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Synthesis and characterization of CdS x Se1-x alloy quantum dots with composition-dependent band gaps and paramagnetic properties

RSC advances, 2018-08, Vol.8 (52), p.30002

2018

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Synthesis and characterization of CdS x Se 1- x alloy quantum dots with composition-dependent band gaps and paramagnetic properties

RSC advances, 2018-08, Vol.8 (52), p.30002-30011

2018

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Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to [Formula Omitted]-Band Frequencies With Excellent Reliability

IEEE transactions on microwave theory and techniques, 2010-08, Vol.58 (8), p.2244-2250

2010

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Logic performance of 40 nm InAs/InxGa1−xAs composite channel HEMTs

2010 International Conference on Enabling Science and Nanotechnology (ESciNano), 2010, p.1-2

2010

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A flip-chip packaged 80-nm In sub(0.7)Ga sub(0.3)As MHEMT for millimeter-wave low-noise applications

Microelectronic engineering, 2011-02, Vol.88 (2), p.183-186

2011

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Biobased Copolyamides 56/66: Synthesis, Characterization and Crystallization Kinetics

The Isothermal and Nonisothermal Crystallization Kinetics and Morphology of Solvent-Precipitated Nylon 66

Performance Enhancement of Flip-Chip Packaged AlGaN/GaN HEMTs by Strain Engineering Design

Fabrication of Robust and Effective Oil/Water Separating Superhydrophobic Textile Coatings

Fabrication of Hydrophobic Surfaces by Coupling of Langmuir−Blodgett Deposition and a Self-Assembled Monolayer

Investigation of electrical and thermal properties of multiple AlGaN/GaN high-electron-mobility transistors flip-chip packaged in parallel for power electronics

Fabrication and characterization of transparent superhydrophilic/superhydrophobic silica nanoparticulate thin films

Performance Enhancement of Flip-Chip Packaged AlGaN/GaN HEMTs Using Active-Region Bumps-Induced Piezoelectric Effect

Effective Passivation With High-Density Positive Fixed Charges for GaN MIS-HEMTs

Synthesis and characterization of CdSxSe1−x alloy quantum dots with composition-dependent band gaps and paramagnetic properties

Preparation and characterization of thermal-sensitive ferrofluids for drug delivery application

A novel and facile antibacterial sponge for effective demulsification and oil/water emulsions separation

Hierarchically structured superhydrophobic coatings fabricated by successive Langmuir–Blodgett deposition of micro-/nano-sized particles and surface silanization

Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V -Band Frequencies With Excellent Reliability

A study on combining natural dyes and environmentally-friendly mordant to improve color strength and ultraviolet protection of textiles

Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

An 80 nm In0.7Ga0.3As MHEMT with flip-chip packaging for W-band low noise applications

Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications

A flip-chip packaged 80-nm In0.7Ga0.3As MHEMT for millimeter-wave low-noise applications

Preparation of poly[3-(methacryloylamino) propyl] trimethylammonium chloride coated mesh for oil–water separation

Synthesis and characterization of CdS x Se1-x alloy quantum dots with composition-dependent band gaps and paramagnetic properties

Synthesis and characterization of CdS x Se 1- x alloy quantum dots with composition-dependent band gaps and paramagnetic properties

Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to [Formula Omitted]-Band Frequencies With Excellent Reliability

Logic performance of 40 nm InAs/InxGa1−xAs composite channel HEMTs

A flip-chip packaged 80-nm In sub(0.7)Ga sub(0.3)As MHEMT for millimeter-wave low-noise applications

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