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Novel Cu-to-Cu Bonding With Ti Passivation at 180 ^ in 3-D Integration

IEEE electron device letters, 2013-12, Vol.34 (12), p.1551-1553

2013

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Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

IEEE transactions on electron devices, 2014-04, Vol.61 (4), p.1131-1136

2014

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A TSV-Based Bio-Signal Package With \mu -Probe Array

IEEE electron device letters, 2014-02, Vol.35 (2), p.256-258

2014

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Revealing the beneficial role of K in grain interiors, grain boundaries, and at the buffer interface for highly efficient CuInSe2 solar cells

Progress in photovoltaics, 2018-10, Vol.26 (10), p.825-834

2018

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2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications

IEEE transactions on biomedical circuits and systems, 2014-12, Vol.8 (6), p.810-823

2014

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Reaction Rate Enhancement for Cu(In,Ga)Se2 Absorber Materials Using Ag-Alloying

IEEE journal of photovoltaics, 2019-05, Vol.9 (3), p.898-905

2019

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Single-Walled Aluminosilicate Nanotube/Poly(vinyl alcohol) Nanocomposite Membranes

ACS applied materials & interfaces, 2012-02, Vol.4 (2), p.965-976

2012

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Energy-efficient configurable discrete wavelet transform for neural sensing applications

2014 IEEE International Symposium on Circuits and Systems (ISCAS), 2014, p.1841-1844

2014

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Through-silicon-via-based double-side integrated microsystem for neural sensing applications

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers, 2013, p.102-103

2013

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A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications

Biomedical microdevices, 2015-02, Vol.17 (1), p.11-15, Article 11

2015

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Recent research advances in Pb-free solders

Microelectronics and reliability, 2009-03, Vol.49 (3), p.221-222

2009

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TSV technology for 2.5D IC solution

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.284-288

2012

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A study of chip-last embedded flip-chip package

Journal of the Chinese Institute of Engineers, 2014-08, Vol.37 (6), p.827-832

2014

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Chemistry of K in Cu(In,Ga)Se2 photovoltaic absorbers: Effects of temperature on Cu-K-In-Se films

Journal of alloys and compounds, 2017-12, Vol.726 (C), p.538-546

2017

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Near-/Sub-Vth process, voltage, and temperature (PVT) sensors with dynamic voltage selection

2013 IEEE International Symposium on Circuits and Systems (ISCAS), 2013, p.133-136

2013

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Chemistry of K in Cu(In,Ga)Se^sub 2^ photovoltaic absorbers: Effects of temperature on Cu-K-In-Se films

Journal of alloys and compounds, 2017-12, Vol.726, p.538

2017

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Microelectronics packaging: present and future

Materials Chemistry and Physics, 1995-04, Vol.40 (3), p.147-161

Tong, Ho-Ming

1995

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The effect of Na on Cu-K-In-Se thin film growth

Journal of crystal growth, 2018-04, Vol.488 (C), p.36-42

2018

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Cover Image, Volume 26, Issue 10

Progress in photovoltaics, 2018-10, Vol.26 (10)

2018

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Revealing the beneficial role of K in grain interiors, grain boundaries, and at the buffer interface for highly efficient CuInSe 2 solar cells

Progress in photovoltaics, 2018-10, Vol.26 (10), p.825-834

2018

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Thickness-direction thermal-expansion measurements

Journal of applied polymer science, 1992-11, Vol.46 (8), p.1329-1337

1992

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Reaction Rate Enhancement for Cu(In,Ga)Se 2 Absorber Materials Using Ag-Alloying

IEEE journal of photovoltaics, 2019-05, Vol.9 (3), p.898-905

2019

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Low temperature (<180°C) wafer-level and chip-level In-to-Cu and Cu-to-Cu bonding for 3D integration

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1146-1152

2013

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Integrated microprobe array and CMOS MEMS by TSV technology for bio-signal recording application

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.512-517

2014

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Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.897-903

2013

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Novel Cu-to-Cu Bonding With Ti Passivation at 180 ^ in 3-D Integration

Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

A TSV-Based Bio-Signal Package With \mu -Probe Array

Revealing the beneficial role of K in grain interiors, grain boundaries, and at the buffer interface for highly efficient CuInSe2 solar cells

2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications

Reaction Rate Enhancement for Cu(In,Ga)Se2 Absorber Materials Using Ag-Alloying

Single-Walled Aluminosilicate Nanotube/Poly(vinyl alcohol) Nanocomposite Membranes

Energy-efficient configurable discrete wavelet transform for neural sensing applications

Through-silicon-via-based double-side integrated microsystem for neural sensing applications

A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications

Recent research advances in Pb-free solders

TSV technology for 2.5D IC solution

A study of chip-last embedded flip-chip package

Chemistry of K in Cu(In,Ga)Se2 photovoltaic absorbers: Effects of temperature on Cu-K-In-Se films

Near-/Sub-Vth process, voltage, and temperature (PVT) sensors with dynamic voltage selection

Chemistry of K in Cu(In,Ga)Se^sub 2^ photovoltaic absorbers: Effects of temperature on Cu-K-In-Se films

Microelectronics packaging: present and future

The effect of Na on Cu-K-In-Se thin film growth

Cover Image, Volume 26, Issue 10

Revealing the beneficial role of K in grain interiors, grain boundaries, and at the buffer interface for highly efficient CuInSe 2 solar cells

Thickness-direction thermal-expansion measurements

Reaction Rate Enhancement for Cu(In,Ga)Se 2 Absorber Materials Using Ag-Alloying

Low temperature (<180°C) wafer-level and chip-level In-to-Cu and Cu-to-Cu bonding for 3D integration

Integrated microprobe array and CMOS MEMS by TSV technology for bio-signal recording application

Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies

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