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Tunable thermal transport and reversible thermal conductivity switching in topologically networked bio-inspired materials

Nature nanotechnology, 2018-10, Vol.13 (10), p.959-964

2018

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Suppressed electronic contribution in thermal conductivity of Ge2Sb2Se4Te

Nature communications, 2021-12, Vol.12 (1), p.7187-7187, Article 7187

2021

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Observation of solid-state bidirectional thermal conductivity switching in antiferroelectric lead zirconate (PbZrO3)

Nature communications, 2022-03, Vol.13 (1), p.1573-9, Article 1573

2022

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Evaluating size effects on the thermal conductivity and electron-phonon scattering rates of copper thin films for experimental validation of Matthiessen’s rule

Nature communications, 2024-10, Vol.15 (1), p.9167-9, Article 9167

2024

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Plasma-induced surface cooling

Nature communications, 2022-05, Vol.13 (1), p.2623-2623, Article 2623

2022

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Thermal Conductivity Reduction at Inorganic–Organic Interfaces: From Regular Superlattices to Irregular Gradient Layer Sequences

Advanced materials interfaces, 2018-06, Vol.5 (11), p.n/a

2018

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Thermal conductivity and hardness of three single-phase high-entropy metal diborides fabricated by borocarbothermal reduction and spark plasma sintering

Ceramics international, 2020-04, Vol.46 (5), p.6906-6913

2020

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Quasi-harmonic theory for phonon thermal boundary conductance at high temperatures

Journal of applied physics, 2022-01, Vol.131 (1)

2022

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Temperature dependent electron–phonon coupling of Au resolved via lattice dynamics measured with sub-picosecond infrared pulses

Journal of applied physics, 2021-05, Vol.129 (19)

2021

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High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films

ACS nano, 2021-06, Vol.15 (6), p.9588-9599

2021

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Emergent interface vibrational structure of oxide superlattices

Nature (London), 2022-01, Vol.601 (7894), p.556-561

2022

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Detection of sub-micrometer thermomechanical and thermochemical failure mechanisms in titanium with a laser-based thermoreflectance technique

Journal of applied physics, 2022-02, Vol.131 (5)

2022

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Long-lived modulation of plasmonic absorption by ballistic thermal injection

Nature nanotechnology, 2021-01, Vol.16 (1), p.47-51

2021

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Measuring sub-surface spatially varying thermal conductivity of silicon implanted with krypton

Journal of applied physics, 2022-08, Vol.132 (7)

2022

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Hybridization from Guest–Host Interactions Reduces the Thermal Conductivity of Metal–Organic Frameworks

Journal of the American Chemical Society, 2022-03, Vol.144 (8), p.3603-3613

2022

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Electron–phonon relaxation at the Au/WSe2 interface is significantly accelerated by a Ti adhesion layer: time-domain ab initio analysis

Nanoscale, 2022-07, Vol.14 (29), p.10514-10523

2022

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A New Polystyrene–Poly(vinylpyridinium) Ionic Copolymer Dopant for n‐Type All‐Polymer Thermoelectrics with High and Stable Conductivity Relative to the Seebeck Coefficient giving High Power Factor

Advanced materials (Weinheim), 2022-07, Vol.34 (27), p.e2201062-n/a

2022

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Electron–Phonon Relaxation at Au/Ti Interfaces Is Robust to Alloying: Ab Initio Nonadiabatic Molecular Dynamics

Journal of physical chemistry. C, 2019-09, Vol.123 (37), p.22842-22850

2019

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Control of Charge Carrier Dynamics in Plasmonic Au Films by TiOx Substrate Stoichiometry

The journal of physical chemistry letters, 2020-02, Vol.11 (4), p.1419-1427

2020

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Thin Ti adhesion layer breaks bottleneck to hot hole relaxation in Au films

The Journal of chemical physics, 2019-05, Vol.150 (18), p.184701-184701

2019

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Thermal conductance of aluminum oxy-fluoride passivation layers

Applied physics letters, 2019-11, Vol.115 (19)

2019

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Nanoscale Wetting and Energy Transmission at Solid/Liquid Interfaces

Langmuir, 2019-02, Vol.35 (6), p.2106-2114

2019

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Band alignment and defects influence the electron–phonon heat transport mechanisms across metal interfaces

Applied physics letters, 2021-04, Vol.118 (16)

2021

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Vacancy-Induced Temperature-Dependent Thermal and Magnetic Properties of Holmium-Substituted Bismuth Ferrite Nanoparticle Compacts

ACS applied materials & interfaces, 2022-06, Vol.14 (22), p.25886-25897

2022

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Control of Charge Carrier Dynamics in Plasmonic Au Films by TiO x Substrate Stoichiometry

The journal of physical chemistry letters, 2020-02, Vol.11 (4), p.1419-1427

2020

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Tunable thermal transport and reversible thermal conductivity switching in topologically networked bio-inspired materials

Suppressed electronic contribution in thermal conductivity of Ge2Sb2Se4Te

Observation of solid-state bidirectional thermal conductivity switching in antiferroelectric lead zirconate (PbZrO3)

Evaluating size effects on the thermal conductivity and electron-phonon scattering rates of copper thin films for experimental validation of Matthiessen’s rule

Plasma-induced surface cooling

Thermal Conductivity Reduction at Inorganic–Organic Interfaces: From Regular Superlattices to Irregular Gradient Layer Sequences

Thermal conductivity and hardness of three single-phase high-entropy metal diborides fabricated by borocarbothermal reduction and spark plasma sintering

Quasi-harmonic theory for phonon thermal boundary conductance at high temperatures

Temperature dependent electron–phonon coupling of Au resolved via lattice dynamics measured with sub-picosecond infrared pulses

High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films

Emergent interface vibrational structure of oxide superlattices

Detection of sub-micrometer thermomechanical and thermochemical failure mechanisms in titanium with a laser-based thermoreflectance technique

Long-lived modulation of plasmonic absorption by ballistic thermal injection

Measuring sub-surface spatially varying thermal conductivity of silicon implanted with krypton

Hybridization from Guest–Host Interactions Reduces the Thermal Conductivity of Metal–Organic Frameworks

Electron–phonon relaxation at the Au/WSe2 interface is significantly accelerated by a Ti adhesion layer: time-domain ab initio analysis

A New Polystyrene–Poly(vinylpyridinium) Ionic Copolymer Dopant for n‐Type All‐Polymer Thermoelectrics with High and Stable Conductivity Relative to the Seebeck Coefficient giving High Power Factor

Electron–Phonon Relaxation at Au/Ti Interfaces Is Robust to Alloying: Ab Initio Nonadiabatic Molecular Dynamics

Control of Charge Carrier Dynamics in Plasmonic Au Films by TiOx Substrate Stoichiometry

Thin Ti adhesion layer breaks bottleneck to hot hole relaxation in Au films

Thermal conductance of aluminum oxy-fluoride passivation layers

Nanoscale Wetting and Energy Transmission at Solid/Liquid Interfaces

Band alignment and defects influence the electron–phonon heat transport mechanisms across metal interfaces

Vacancy-Induced Temperature-Dependent Thermal and Magnetic Properties of Holmium-Substituted Bismuth Ferrite Nanoparticle Compacts

Control of Charge Carrier Dynamics in Plasmonic Au Films by TiO x Substrate Stoichiometry

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