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Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2018-01, Vol.709, p.125-133

2018

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Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes

Journal of materials processing technology, 2019-06, Vol.268, p.1-9

2019

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Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock

Journal of materials science. Materials in electronics, 2021-03, Vol.32 (6), p.6890-6899

2021

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Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures

Journal of alloys and compounds, 2019-09, Vol.800, p.180-190

2019

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Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles

Journal of materials research and technology, 2024-03, Vol.29, p.5034-5047

2024

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Influence of shielding gas on microstructure and mechanical properties of laser welded–brazed Al/steel lapped joint

Journal of manufacturing processes, 2020-06, Vol.54, p.347-358

2020

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Isothermal aging and electromigration reliability of Cu pillar bumps interconnections in advanced packages monitored by in-situ dynamic resistance testing

Journal of materials research and technology, 2024-09, Vol.32, p.937-954

2024

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Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

Applied sciences, 2018-11, Vol.8 (11), p.2056

2018

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Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures

Crystals (Basel), 2023-04, Vol.13 (4), p.586

2023

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Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment

Journal of alloys and compounds, 2019-03, Vol.777, p.463-471

2019

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Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-01, Vol.684, p.697-705

2017

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Reliability improvement of SnAgCu interconnections under extreme temperature condition by TiO2 nanoparticles doping: Experiments and first principles calculations

Materials characterization, 2024-01, Vol.207, p.113492, Article 113492

2024

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Effect of TIG remelting on microstructure, corrosion and wear resistance of coating on surface of 4Cr5MoSiV1 (AISI H13)

Surface & coatings technology, 2021-01, Vol.405, p.126547, Article 126547

2021

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SnPbInBiSb high-entropy solder joints with inhibited interfacial IMC growth and high shear strength

Intermetallics, 2025-01, Vol.176, Article 108551

2025

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Experimental study on CFRP drilling with the picosecond laser “double rotation” cutting technique

Optics and laser technology, 2021-10, Vol.142, p.107238, Article 107238

2021

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Mechanical properties degradation of Sn 37Pb solder joints caused by interfacial microstructure evolution under cryogenic temperature storage

Materials characterization, 2023-07, Vol.201, p.112979, Article 112979

2023

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Mechanical properties degradation of Sn37Pb solder joints caused by interfacial microstructure evolution under cryogenic temperature storage

Materials characterization, 2023-07, Vol.201, Article 112979

2023

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Effects of Nanoparticle Addition on the Reliability of Sn-Based Pb-Free Solder Joints Under Various Conditions: A Review

Nano : brief reports and reviews, 2023-01, Vol.18 (1)

2023

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Advanced Anode Materials Based on Iron Oxides for Lithium-Ion Batteries

Nano : brief reports and reviews, 2023-06, Vol.18 (6)

2023

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Elemental diffusion, atomic substitution mechanisms and interfacial fracture behavior in laser welded–brazed Al/Ti

Materials characterization, 2023-08, Vol.202, p.112998, Article 112998

2023

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Low temperature joining of GH3039 for high temperature applications with Au-Si isothermal solidification

Materials letters, 2020-12, Vol.281, p.128668, Article 128668

2020

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Enhancing the (FeMnCrNiCo + TiC) cladding layer by in-situ laser remelting

Surface engineering, 2021-12, Vol.37 (12), p.1496-1502

2021

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In Situ-Polymerized PANI/WS2 Nanocomposites for Highly Sensitive Flexible Ammonia Gas Sensors and Respiration Monitoring Devices

ACS applied nano materials, 2024-02, Vol.7 (3), p.3385-3393

2024

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In Situ-Polymerized PANI/WS 2 Nanocomposites for Highly Sensitive Flexible Ammonia Gas Sensors and Respiration Monitoring Devices

ACS applied nano materials, 2024-02, Vol.7 (3), p.3385-3393

2024

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Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

Microelectronics and reliability, 2015-11, Vol.55 (11), p.2396-2402

2015

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Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes

Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock

Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures

Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles

Influence of shielding gas on microstructure and mechanical properties of laser welded–brazed Al/steel lapped joint

Isothermal aging and electromigration reliability of Cu pillar bumps interconnections in advanced packages monitored by in-situ dynamic resistance testing

Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures

Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment

Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Reliability improvement of SnAgCu interconnections under extreme temperature condition by TiO2 nanoparticles doping: Experiments and first principles calculations

Effect of TIG remelting on microstructure, corrosion and wear resistance of coating on surface of 4Cr5MoSiV1 (AISI H13)

SnPbInBiSb high-entropy solder joints with inhibited interfacial IMC growth and high shear strength

Experimental study on CFRP drilling with the picosecond laser “double rotation” cutting technique

Mechanical properties degradation of Sn 37Pb solder joints caused by interfacial microstructure evolution under cryogenic temperature storage

Mechanical properties degradation of Sn37Pb solder joints caused by interfacial microstructure evolution under cryogenic temperature storage

Effects of Nanoparticle Addition on the Reliability of Sn-Based Pb-Free Solder Joints Under Various Conditions: A Review

Advanced Anode Materials Based on Iron Oxides for Lithium-Ion Batteries

Elemental diffusion, atomic substitution mechanisms and interfacial fracture behavior in laser welded–brazed Al/Ti

Low temperature joining of GH3039 for high temperature applications with Au-Si isothermal solidification

Enhancing the (FeMnCrNiCo + TiC) cladding layer by in-situ laser remelting

In Situ-Polymerized PANI/WS2 Nanocomposites for Highly Sensitive Flexible Ammonia Gas Sensors and Respiration Monitoring Devices

In Situ-Polymerized PANI/WS 2 Nanocomposites for Highly Sensitive Flexible Ammonia Gas Sensors and Respiration Monitoring Devices

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

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