UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Isolation of Extracellular Vesicles from Cell Culture and Blood Through Nano-Targeted DLD Microfluidic Device

Methods in molecular biology (Clifton, N.J.), 2024, Vol.2804, p.77

2024

Volltextzugriff (PDF)

Fractional Flow Reserve to Guide Treatment of Patients With Multivessel Coronary Artery Disease

Journal of the American College of Cardiology, 2021-11, Vol.78 (19), p.1875-1885

2021

Volltextzugriff (PDF)

Ticagrelor versus clopidogrel in elective percutaneous coronary intervention (ALPHEUS): a randomised, open-label, phase 3b trial

The Lancet (British edition), 2020-11, Vol.396 (10264), p.1737-1744

2020

Volltextzugriff (PDF)

Suspended Nanochannel Resonator Arrays with Piezoresistive Sensors for High-Throughput Weighing of Nanoparticles in Solution

ACS sensors, 2020-04, Vol.5 (4), p.1230-1238

2020

Volltextzugriff (PDF)

Biosensing extracellular vesicles: contribution of biomolecules in affinity-based methods for detection and isolation

Analyst (London), 2020-03, Vol.145 (6), p.1997-213

2020

Volltextzugriff (PDF)

Separation of Biological Particles in a Modular Platform of Cascaded Deterministic Lateral Displacement Modules

Scientific reports, 2018-12, Vol.8 (1), p.17762-10, Article 17762

2018

Volltextzugriff (PDF)

CMOS platform for atomic-scale device fabrication

Nanotechnology, 2018-10, Vol.29 (43), p.435302-435302

2018

Volltextzugriff (PDF)

Purification of complex samples: Implementation of a modular and reconfigurable droplet-based microfluidic platform with cascaded deterministic lateral displacement separation modules

PloS one, 2018-05, Vol.13 (5), p.e0197629-e0197629

2018

Volltextzugriff (PDF)

Particle Separation: Anticipating Cutoff Diameters in Deterministic Lateral Displacement (DLD) Microfluidic Devices for an Optimized Particle Separation (Small 37/2017)

Small (Weinheim an der Bergstrasse, Germany), 2017-10, Vol.13 (37), p.n/a

2017

Volltextzugriff (PDF)

Anticipating Cutoff Diameters in Deterministic Lateral Displacement (DLD) Microfluidic Devices for an Optimized Particle Separation

Small (Weinheim an der Bergstrasse, Germany), 2017-10, Vol.13 (37), p.n/a

2017

Volltextzugriff (PDF)

Metallic Conductive Nanowires Elaborated by PVD Metal Deposition on Suspended DNA Bundles

Small (Weinheim an der Bergstrasse, Germany), 2017-09, Vol.13 (33), p.n/a

2017

Volltextzugriff (PDF)

Deoxyribonucleic Acid for Nanopackaging: A promising bottom-up approach

IEEE nanotechnology magazine, 2017-03, Vol.11 (1), p.12-19

2017

Volltextzugriff (PDF)

Nanopackaging of Si(100)H Wafer for Atomic-Scale Investigations

On-Surface Atomic Wires and Logic Gates, 2017, p.25-51

2017

Volltextzugriff (PDF)

Innovative Solutions for the Nanoscale Packaging of Silicon-Based and Biological Nanowires: Development of a Generic Characterization and Integration Platform

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-12, Vol.6 (12), p.1804-1814

2016

Volltextzugriff (PDF)

Development of Characterization Platform Dedicated to Bio-Inspired Objects at the Nanoscale

ECS transactions, 2016, Vol.72 (4), p.183-190

2016

Volltextzugriff (PDF)

Fine charge sensing using a silicon nanowire for biodetection

2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), 2016, p.1-2

2016

Volltextzugriff (PDF)

Development of Characterization Platform Dedicated to Bio-Inspired Objects at the Nanoscale

Meeting abstracts (Electrochemical Society), 2016-04, Vol.MA2016-01 (23), p.1185-1185

2016

Volltextzugriff (PDF)

First Integration Steps of Cu-based DNA Nanowires for interconnections

IMAPS other content, 2016-01, Vol.2016 (DPC), p.650-679

2016

Volltextzugriff (PDF)

Development of a statistical approach for DNA-based nanowires electrical study

2015 European Microelectronics Packaging Conference (EMPC), 2015, p.1-6

2015

Volltextzugriff (PDF)

Atomic scale fabrication of dangling bond structures on hydrogen passivated Si(001) wafers processed and nanopackaged in a clean room environment

Applied surface science, 2014, Vol.288, p.83-89

2014

Volltextzugriff (PDF)

Electromigration behavior of 3D-IC TSV interconnects

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.326-330

2012

Volltextzugriff (PDF)

Resistance increase due to electromigration induced depletion under TSV

2011 International Reliability Physics Symposium, 2011, p.3F.4.1-3F.4.6

2011

Volltextzugriff (PDF)

Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking

Meeting abstracts (Electrochemical Society), 2010-07, Vol.MA2010-02 (26), p.1670-1670

2010

Volltextzugriff (PDF)

Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking

ECS transactions, 2010, Vol.33 (12), p.1-21

2010

Volltextzugriff (PDF)

A successful implementation of dual damascene architecture to copper TSV for 3D high density applications

2010 IEEE International 3D Systems Integration Conference (3DIC), 2010, p.1-4

2010

Volltextzugriff (PDF)

1 – 25 von 41

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(28)
Mit Volltextzugriff
(33)

Publikationsform

Sprache

Englisch
(41)

Erscheinungsjahr

n.n

Thema

Science & Technology
(26)
Technology
(17)
Materials Science
(16)
Materials Science, Multidisciplinary
(14)
Physical Sciences
(12)
Chemical Sciences
(9)
Material Chemistry
(8)
Science & Technology - Other Topics
(8)
Physics
(7)
Engineering Sciences
(6)
Nanoscience & Nanotechnology
(6)
Engineering
(5)
Engineering, Electrical & Electronic
(5)
Humans
(5)
Nanotechnology
(5)
Physics, Applied
(5)
Resistance
(5)
Silicon
(5)
Chemistry
(4)
Dna
(4)

15 weitere anzeigen...

Weniger anzeigen...

Zeitschrift / Serie

5 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Isolation of Extracellular Vesicles from Cell Culture and Blood Through Nano-Targeted DLD Microfluidic Device

Fractional Flow Reserve to Guide Treatment of Patients With Multivessel Coronary Artery Disease

Ticagrelor versus clopidogrel in elective percutaneous coronary intervention (ALPHEUS): a randomised, open-label, phase 3b trial

Suspended Nanochannel Resonator Arrays with Piezoresistive Sensors for High-Throughput Weighing of Nanoparticles in Solution

Biosensing extracellular vesicles: contribution of biomolecules in affinity-based methods for detection and isolation

Separation of Biological Particles in a Modular Platform of Cascaded Deterministic Lateral Displacement Modules

CMOS platform for atomic-scale device fabrication

Purification of complex samples: Implementation of a modular and reconfigurable droplet-based microfluidic platform with cascaded deterministic lateral displacement separation modules

Particle Separation: Anticipating Cutoff Diameters in Deterministic Lateral Displacement (DLD) Microfluidic Devices for an Optimized Particle Separation (Small 37/2017)

Anticipating Cutoff Diameters in Deterministic Lateral Displacement (DLD) Microfluidic Devices for an Optimized Particle Separation

Metallic Conductive Nanowires Elaborated by PVD Metal Deposition on Suspended DNA Bundles

Deoxyribonucleic Acid for Nanopackaging: A promising bottom-up approach

Nanopackaging of Si(100)H Wafer for Atomic-Scale Investigations

Innovative Solutions for the Nanoscale Packaging of Silicon-Based and Biological Nanowires: Development of a Generic Characterization and Integration Platform

Development of Characterization Platform Dedicated to Bio-Inspired Objects at the Nanoscale

Fine charge sensing using a silicon nanowire for biodetection

Development of Characterization Platform Dedicated to Bio-Inspired Objects at the Nanoscale

First Integration Steps of Cu-based DNA Nanowires for interconnections

Development of a statistical approach for DNA-based nanowires electrical study

Atomic scale fabrication of dangling bond structures on hydrogen passivated Si(001) wafers processed and nanopackaged in a clean room environment

Electromigration behavior of 3D-IC TSV interconnects

Resistance increase due to electromigration induced depletion under TSV

Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking

Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking

A successful implementation of dual damascene architecture to copper TSV for 3D high density applications

Suchergebnisse filtern