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Separation of Biological Particles in a Modular Platform of Cascaded Deterministic Lateral Displacement Modules

Scientific reports, 2018-12, Vol.8 (1), p.17762-10, Article 17762

2018

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Anticipating Cutoff Diameters in Deterministic Lateral Displacement (DLD) Microfluidic Devices for an Optimized Particle Separation

Small (Weinheim an der Bergstrasse, Germany), 2017-10, Vol.13 (37), p.n/a

2017

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CMOS platform for atomic-scale device fabrication

Nanotechnology, 2018-10, Vol.29 (43), p.435302-435302

2018

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Purification of complex samples: Implementation of a modular and reconfigurable droplet-based microfluidic platform with cascaded deterministic lateral displacement separation modules

PloS one, 2018-05, Vol.13 (5), p.e0197629-e0197629

2018

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Suspended Nanochannel Resonator Arrays with Piezoresistive Sensors for High-Throughput Weighing of Nanoparticles in Solution

ACS sensors, 2020-04, Vol.5 (4), p.1230-1238

2020

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Atomic scale fabrication of dangling bond structures on hydrogen passivated Si(001) wafers processed and nanopackaged in a clean room environment

Applied surface science, 2014, Vol.288, p.83-89

2014

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Metallic Conductive Nanowires Elaborated by PVD Metal Deposition on Suspended DNA Bundles

Small (Weinheim an der Bergstrasse, Germany), 2017-09, Vol.13 (33), p.n/a

2017

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Innovative Solutions for the Nanoscale Packaging of Silicon-Based and Biological Nanowires: Development of a Generic Characterization and Integration Platform

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-12, Vol.6 (12), p.1804-1814

2016

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IEEE_Xplore

The electrochemical signature of functionalized single-walled carbon nanotubes bearing electroactive groups

Nanotechnology, 2009-04, Vol.20 (14), p.145705-145705

2009

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Biosensing extracellular vesicles: contribution of biomolecules in affinity-based methods for detection and isolation

Analyst (London), 2020-03, Vol.145 (6), p.1997-213

2020

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Isolation of Extracellular Vesicles from Cell Culture and Blood Through Nano-Targeted DLD Microfluidic Device

Methods in molecular biology (Clifton, N.J.), 2024, Vol.2804, p.77

2024

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Particle Separation: Anticipating Cutoff Diameters in Deterministic Lateral Displacement (DLD) Microfluidic Devices for an Optimized Particle Separation (Small 37/2017)

Small (Weinheim an der Bergstrasse, Germany), 2017-10, Vol.13 (37), p.n/a

2017

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Nanopackaging of Si(100)H Wafer for Atomic-Scale Investigations

On-Surface Atomic Wires and Logic Gates, 2017, p.25-51

2017

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Investigation of the Electronic Structure of the UD-4 Defect in 4H-SiC by Optical Techniques

Materials science forum, 2006-01, Vol.527-529, p.461-464

2006

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Resistance increase due to electromigration induced depletion under TSV

2011 International Reliability Physics Symposium, 2011, p.3F.4.1-3F.4.6

2011

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IEEE_Xplore

Reliability approach of high density Through Silicon Via (TSV)

2010 12th Electronics Packaging Technology Conference, 2010, p.321-324

2010

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IEEE_Xplore

Forward-Bias Degradation in 4H-SiC p+nn+ Diodes: Influence of the Mesa Etching

Materials Science Forum, 2005-05, Vol.483-485, p.773-776

2005

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Coupling between the Raman Spectroscopy and Photoemission Microscopy Techniques: Investigation of Defects in Biased 4H-SiC pin Diodes

Materials science forum, 2007, Vol.556-557

2007

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Investigation of the charge carrier concentration in highly aluminum doped SiC using Raman scattering

Physica status solidi. C, 2006-03, Vol.3 (3), p.558-561

2006

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Micro-Optical Characterization Study of Highly p-Type Doped SiC:Al Wafers

Materials science forum, 2005, Vol.483?485

2005

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Optical mapping of aluminum doped p-type SiC wafers

Physica status solidi. A, Applications and materials science, 2005-03, Vol.202 (4), p.598-601

2005

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Study on the Fabrication of Aluminum Matrix Nanocomposites Reinforced with Carbon Nanotubes

Microscopy and microanalysis, 2004-08, Vol.10 (S02), p.574-575

2004

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Electromigration behavior of 3D-IC TSV interconnects

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.326-330

2012

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IEEE_Xplore

Investigation of the charge carrier concentration in highly aluminium doped SiC using Raman scattering

Physica status solidi. C, 2006, Vol.3, p.558-561

2006

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The Electronic Structure of the UD-4 Defect in 4H, 6H and 15R SiC

Materials science forum, 2009, Vol.600-603, p.397-400

2009

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Separation of Biological Particles in a Modular Platform of Cascaded Deterministic Lateral Displacement Modules

Anticipating Cutoff Diameters in Deterministic Lateral Displacement (DLD) Microfluidic Devices for an Optimized Particle Separation

CMOS platform for atomic-scale device fabrication

Purification of complex samples: Implementation of a modular and reconfigurable droplet-based microfluidic platform with cascaded deterministic lateral displacement separation modules

Suspended Nanochannel Resonator Arrays with Piezoresistive Sensors for High-Throughput Weighing of Nanoparticles in Solution

Atomic scale fabrication of dangling bond structures on hydrogen passivated Si(001) wafers processed and nanopackaged in a clean room environment

Metallic Conductive Nanowires Elaborated by PVD Metal Deposition on Suspended DNA Bundles

Innovative Solutions for the Nanoscale Packaging of Silicon-Based and Biological Nanowires: Development of a Generic Characterization and Integration Platform

The electrochemical signature of functionalized single-walled carbon nanotubes bearing electroactive groups

Biosensing extracellular vesicles: contribution of biomolecules in affinity-based methods for detection and isolation

Isolation of Extracellular Vesicles from Cell Culture and Blood Through Nano-Targeted DLD Microfluidic Device

Particle Separation: Anticipating Cutoff Diameters in Deterministic Lateral Displacement (DLD) Microfluidic Devices for an Optimized Particle Separation (Small 37/2017)

Nanopackaging of Si(100)H Wafer for Atomic-Scale Investigations

Investigation of the Electronic Structure of the UD-4 Defect in 4H-SiC by Optical Techniques

Resistance increase due to electromigration induced depletion under TSV

Reliability approach of high density Through Silicon Via (TSV)

Forward-Bias Degradation in 4H-SiC p+nn+ Diodes: Influence of the Mesa Etching

Coupling between the Raman Spectroscopy and Photoemission Microscopy Techniques: Investigation of Defects in Biased 4H-SiC pin Diodes

Investigation of the charge carrier concentration in highly aluminum doped SiC using Raman scattering

Micro-Optical Characterization Study of Highly p-Type Doped SiC:Al Wafers

Optical mapping of aluminum doped p-type SiC wafers

Study on the Fabrication of Aluminum Matrix Nanocomposites Reinforced with Carbon Nanotubes

Electromigration behavior of 3D-IC TSV interconnects

Investigation of the charge carrier concentration in highly aluminium doped SiC using Raman scattering

The Electronic Structure of the UD-4 Defect in 4H, 6H and 15R SiC

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