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Guest Editorial Special Section on Materials-Related Manufacturing Issues in the Nanochip Era

IEEE transactions on semiconductor manufacturing, 2005-02, Vol.18 (1), p.1-4

2005

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Guest editorial special section on single-wafer manufacturing in the nanochip era

IEEE transactions on semiconductor manufacturing, 2003-05, Vol.16 (2), p.90-95

2003

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A study of rapid photothermal annealing on the electrical properties and reliability of tantalum pentoxide

IEEE transactions on electron devices, 1999-04, Vol.46 (4), p.814-816

1999

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Process simplification in DRAM manufacturing

IEEE transactions on electron devices, 1998-03, Vol.45 (3), p.609-619

1998

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Changing from rapid thermal processing to rapid photothermal processing: what does it buy for a particular technology?

Materials science in semiconductor processing, 1998, Vol.1 (3), p.219-230

1998

Volltextzugriff (PDF)

High Performance High Dielectric Constant Films Deposited by Dual Spectral Source Rapid Isothermal Assisted Metalorganic Chemical Vapor Deposition (MOCVD)

MRS proceedings, 1997, Vol.470, Article 133

1997

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Effects of surface pretreatment of polysilicon electrode prior to Si/sub 3/N/sub 4/ deposition on the electrical characteristics of Si/sub 3/N/sub 4/ dielectric films

IEEE transactions on electron devices, 1994-03, Vol.41 (3), p.347-351

1994

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Excimer Laser Annealing of Amorphous Silicon Films

MRS proceedings, 1994, Vol.336, Article 61

1994

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Reduced thermal budget processing of Y-Ba-Cu-O films by rapid isothermal processing assisted metalorganic chemical vapor deposition

Journal of applied physics, 1991-02, Vol.69 (4), p.2418-2422

1991

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Low Thermal Budget Processing Of Organic Dielectrics

MRS proceedings, 1995, Vol.381, Article 117

1995

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Analysis of Critical Parameters Affecting the Temperature Uniformity During Rapid Thermal Processing

MRS proceedings, 1994, Vol.342, Article 389

1994

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Integrated Rapid Thermal CVD Processing Solutions for 0.18–0.25μm Technologies

MRS proceedings, 1997, Vol.470, Article 215

1997

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Gate Oxide Integrity as Affected by Hf Last Wafer Treatments and Passivating Techniques

MRS proceedings, 1993, Vol.303, Article 303

1993

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Plasma Doped (PLAD) Deep Sub-Half Micron Buried Channel PMOSFETS and its Application to Next Generation ULSI Circuits

ESSDERC '96: Proceedings of the 26th European Solid State Device Research Conference, 1996, p.357-360

1996

Volltextzugriff (PDF)

Role of Photoeffects in Integrated Rapid Isothermal Processing

MRS proceedings, 1991, Vol.224, Article 197

1991

Volltextzugriff (PDF)

Stress and Warpage Studies of Silicon Based Plain and Patterned Films During Rapid Thermal Processing (RTP)

MRS proceedings, 1993, Vol.303, Article 189

1993

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Ultrathin Gate and Capacitor Dielectric Formation Using Single- Wafer Processing

MRS proceedings, 1993, Vol.303, Article 401

1993

Volltextzugriff (PDF)

Driving 100 nm and below 300 mm manufacturing solutions - an era of single wafer processing, factory efficiencies, and new materials and technology introductions at reduced thermal budget and improved cycle time

9th International Conference on Advanced Thermal Processing of Semiconductors, RTP 2001, 2001, p.28-42

2001

Volltextzugriff (PDF)

In - situ integrated processing of thin films of high temperature superconductors and related materials by MOCVD for device applications

AIP Conference Proceedings (American Institute of Physics); (USA), 1990, Vol.199:1

1990

Volltextzugriff (PDF)

Plasma process induced degradation of thin inter-polysilicon dielectric layers

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395), 1999, p.45-48

1999

Volltextzugriff (PDF)

Gate stack reliability improvements using controlled ambient processing

1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual, 1997, p.7-11

1997

Volltextzugriff (PDF)

In-situ rapid isothermal processing (RIP) of InP based devices

International Conference on Indium Phosphide and Related Materials, 1990, p.207-210

1990

Volltextzugriff (PDF)

Fibrous root distribution in Pineapple orange trees under semi- arid irrigated ecosystem

Advances in horticultural science, 2013-05, Vol.25 (1)

2013

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Prognostic importance of exercise brain natriuretic peptide in asymptomatic chronic organic mitral regurgitation

Indian heart journal, 2015-12, Vol.67 (S1), p.S2-S2

2015

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Triple versus dual antiplatelet therapy in patients with acute coronary syndrome undergoing percutaneous coronary intervention (PCI) – Our hospital experience

Indian heart journal, 2015-12, Vol.67 (S1), p.S28-S28

2015

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Guest Editorial Special Section on Materials-Related Manufacturing Issues in the Nanochip Era

Guest editorial special section on single-wafer manufacturing in the nanochip era

A study of rapid photothermal annealing on the electrical properties and reliability of tantalum pentoxide

Process simplification in DRAM manufacturing

Changing from rapid thermal processing to rapid photothermal processing: what does it buy for a particular technology?

High Performance High Dielectric Constant Films Deposited by Dual Spectral Source Rapid Isothermal Assisted Metalorganic Chemical Vapor Deposition (MOCVD)

Effects of surface pretreatment of polysilicon electrode prior to Si/sub 3/N/sub 4/ deposition on the electrical characteristics of Si/sub 3/N/sub 4/ dielectric films

Excimer Laser Annealing of Amorphous Silicon Films

Reduced thermal budget processing of Y-Ba-Cu-O films by rapid isothermal processing assisted metalorganic chemical vapor deposition

Low Thermal Budget Processing Of Organic Dielectrics

Analysis of Critical Parameters Affecting the Temperature Uniformity During Rapid Thermal Processing

Integrated Rapid Thermal CVD Processing Solutions for 0.18–0.25μm Technologies

Gate Oxide Integrity as Affected by Hf Last Wafer Treatments and Passivating Techniques

Plasma Doped (PLAD) Deep Sub-Half Micron Buried Channel PMOSFETS and its Application to Next Generation ULSI Circuits

Role of Photoeffects in Integrated Rapid Isothermal Processing

Stress and Warpage Studies of Silicon Based Plain and Patterned Films During Rapid Thermal Processing (RTP)

Ultrathin Gate and Capacitor Dielectric Formation Using Single- Wafer Processing

Driving 100 nm and below 300 mm manufacturing solutions - an era of single wafer processing, factory efficiencies, and new materials and technology introductions at reduced thermal budget and improved cycle time

In - situ integrated processing of thin films of high temperature superconductors and related materials by MOCVD for device applications

Plasma process induced degradation of thin inter-polysilicon dielectric layers

Gate stack reliability improvements using controlled ambient processing

In-situ rapid isothermal processing (RIP) of InP based devices

Fibrous root distribution in Pineapple orange trees under semi- arid irrigated ecosystem

Prognostic importance of exercise brain natriuretic peptide in asymptomatic chronic organic mitral regurgitation

Triple versus dual antiplatelet therapy in patients with acute coronary syndrome undergoing percutaneous coronary intervention (PCI) – Our hospital experience

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