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A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer

Optics express, 2014-05, Vol.22 (10), p.12289-12295

2014

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Chip-level waveguide-mirror-pillar optical interconnect structure

IEEE photonics technology letters, 2006-08, Vol.18 (15), p.1672-1674

2006

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Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI)

IEEE transactions on electron devices, 2003-10, Vol.50 (10), p.2039-2048

2003

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Ultralow Power 80 Gb/s Arrayed CMOS Silicon Photonic Transceivers for WDM Optical Links

Journal of lightwave technology, 2012-02, Vol.30 (4), p.641-650

2012

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2-pJ/bit (On-Chip) 10-Gb/s Digital CMOS Silicon Photonic Link

IEEE photonics technology letters, 2012-07, Vol.24 (14), p.1260-1262

2012

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Silicon Photonic Interconnects for Large-Scale Computer Systems

IEEE MICRO, 2013-01, Vol.33 (1), p.68-78

2013

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Wafer-Testing of Optoelectonic-Gigascale CMOS Integrated Circuits

IEEE journal of selected topics in quantum electronics, 2011-05, Vol.17 (3), p.659-670

2011

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Sea-of-leads MEMS I/O interconnects for low-k IC packaging

Journal of microelectromechanical systems, 2006-06, Vol.15 (3), p.523-530

2006

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Thermal runaway prevention by control of float voltage as a function of a battery temperature

[Proceedings] Fourteenth International Telecommunications Energy Conference - INTELEC '92, 1992, p.47-50

Thacker, H.D.

1992

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Alignment and integration of a hybrid, external-cavity InP-SOI laser

2016 Optical Fiber Communications Conference and Exhibition (OFC), 2016, p.1-3

2016

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Semi-sweet biscuits. Pt.1: the influence of sodium metabisulphite on dough rheology and baking performance

Journal of the science of food and agriculture, 1995-10, Vol.69 (2), p.141-150

1995

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Sea of leads microwave characterization and process integration with FEOL and BEOL

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519), 2002, p.116-118

2002

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Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.329-333

2013

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Assembly and alignment of Proximity Communication enabled multi-chip packages using elastomeric bump interposers

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.2029-2035

2012

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"Dual-purpose" remateable Conductive Ball-in-Pit interconnects for chip powering and passive alignment in Proximity Communication enabled multi-chip packages

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.36-42

2012

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Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.829-835

2011

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Integrating through-silicon vias with solder free, compliant interconnects for novel, large area interposers

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.263-267

2012

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CMOS-photonic "macrochip" packaging

2010 23rd Annual Meeting of the IEEE Photonics Society, 2010, p.485-486

2010

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Polymer Pillars as Optical I/O for Gigascale Chips using Mirror-Terminated Waveguides

2006 International Interconnect Technology Conference, 2006, p.170-172

2006

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High-density probe substrate for testing optical interconnects

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005, 2005, p.159-161

2005

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Compliant probe substrates for testing high pin-count chip scale packages

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.1188-1193

2002

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Enhanced Recovery After Surgery (ERAS) for gastrointestinal surgery, part 2: consensus statement for anaesthesia practice

Acta anaesthesiologica Scandinavica, 2016-03, Vol.60 (3), p.289-334

2016

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Turning up the heat

Food manufacture, 1995-09, Vol.70 (9), p.27-28

1995

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Clinical Pharmacogenetics Implementation Consortium (CPIC) Guideline for CYP2C19 and Proton Pump Inhibitor Dosing

Clinical pharmacology and therapeutics, 2021-06, Vol.109 (6), p.1417-1423

2021

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A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer

Chip-level waveguide-mirror-pillar optical interconnect structure

Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI)

Ultralow Power 80 Gb/s Arrayed CMOS Silicon Photonic Transceivers for WDM Optical Links

2-pJ/bit (On-Chip) 10-Gb/s Digital CMOS Silicon Photonic Link

Silicon Photonic Interconnects for Large-Scale Computer Systems

Wafer-Testing of Optoelectonic-Gigascale CMOS Integrated Circuits

Sea-of-leads MEMS I/O interconnects for low-k IC packaging

Thermal runaway prevention by control of float voltage as a function of a battery temperature

Alignment and integration of a hybrid, external-cavity InP-SOI laser

Semi-sweet biscuits. Pt.1: the influence of sodium metabisulphite on dough rheology and baking performance

Sea of leads microwave characterization and process integration with FEOL and BEOL

Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects

Assembly and alignment of Proximity Communication enabled multi-chip packages using elastomeric bump interposers

"Dual-purpose" remateable Conductive Ball-in-Pit interconnects for chip powering and passive alignment in Proximity Communication enabled multi-chip packages

Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers

Integrating through-silicon vias with solder free, compliant interconnects for novel, large area interposers

CMOS-photonic "macrochip" packaging

Polymer Pillars as Optical I/O for Gigascale Chips using Mirror-Terminated Waveguides

High-density probe substrate for testing optical interconnects

Compliant probe substrates for testing high pin-count chip scale packages

American Society for Enhanced Recovery and Perioperative Quality Initiative Joint Consensus Statement on Nutrition Screening and Therapy Within a Surgical Enhanced Recovery Pathway

Enhanced Recovery After Surgery (ERAS) for gastrointestinal surgery, part 2: consensus statement for anaesthesia practice

Turning up the heat

Clinical Pharmacogenetics Implementation Consortium (CPIC) Guideline for CYP2C19 and Proton Pump Inhibitor Dosing

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