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A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1298-1305
2024
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Non-Formaldehyde based electroless Cu deposition for Advanced Packaging
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 2020, p.32-35
2020
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Forming of advanced THT-interconnects using SB2 laser solder jetting process
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.643-650
2023
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Vertical Laser Assisted Bonding for Advanced "3.5D" Chip Packaging
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.210-217
2019
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Study of solder interconnect configurations and performance of vertical laser assisted assembled "3.5D" packages
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1936-1942
2020
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A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.2089-2096
2021
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Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1016-1024
2020
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Wafer Level Packaging of Compound Semiconductors
Journal of microelectronics and electronic packaging, 2010-07, Vol.7 (3), p.152-159
2010
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A Study About Facile Interconnect Formations Involving SB2-JET Solder Ball Stacking and Colonnade Patterning in Hybrid Package Architectures
2020 International Wafer Level Packaging Conference (IWLPC), 2020, p.1-8
2020
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Laser assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.462-469
2021
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Wafer Level Packaging of Compound Semiconductors: Revised and selected papers from the IMAPS 6th Annual International Conference on Device Packaging, Fountain Hills, Arizona, March 2010
Journal of microelectronics and electronic packaging, 2010, Vol.7 (3), p.152-159
2010
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Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1430-1441
2022
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A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1928-1934
2020
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Highly Customizable RDL Combined with UBM for Various Solder Applications in Wafer Level Packaging
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 2019, p.360-367
2019
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SB²-WB: A New Process Solution for Advanced Wire-Bonding
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.47-54
2019
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Solder Sphere Transfer for Wafer Level Packaging
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.948-953
2018
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Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2012, p.1-6
2012
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WLCSP and Flip Chip bumping technologies
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008, p.1-9
2008
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Wafer Bumping & Wafer Level Packaging for 300mm Wafer
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2006, p.42-42
2006
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Lead-free Impact on Wafer Bumping & Wafer-level Packaging
Advanced packaging, 2005-11, Vol.14 (11), p.14
2005
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Wafer level CSP using low cost electroless redistribution layer
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, p.107-113
2000
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Lead-free solder bumping process for high temperature automotive application
53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1468-1471
2003
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Low cost flip chip bumping
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458), 2000, p.72-78
2000
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The Electrochemical Effects of Immersion Au on Electroless Nickel and Its Consequences on the Hermetic Reliability of a Semiconductor Device
IEEE transactions on device and materials reliability, 2012-06, Vol.12 (2), p.317-322
2012
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Pulsed-laser Heating for Flip Chip Assembly
Advanced packaging, 2006-05, Vol.15 (5), p.40
2006
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