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Cross-linked PMMA as a low-dimensional dielectric sacrificial layer

Journal of microelectromechanical systems, 2003-10, Vol.12 (5), p.641-648

2003

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Evaluation of corneal sensitivity to mechanical and chemical stimuli after LASIK: a pilot study

Eye & contact lens, 2006-03, Vol.32 (2), p.88-93

2006

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Effect of low numerical-aperture femtosecond two-photon absorption on (SU-8) resist for ultrahigh-aspect-ratio microstereolithography

Journal of applied physics, 2005-03, Vol.97 (5)

2005

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Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks

Thin solid films, 2006-05, Vol.504 (1-2), p.252-256

2006

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Corrections to "200-mm Wafer Scale Transfer of 0.18$mu$m Dual-Damascene Cu/SiO$_2$Interconnection System to Plastic Substrates"

IEEE electron device letters, 2006-03, Vol.27 (3), p.198-198

2006

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Corrections to "200-mm Wafer Scale Transfer of 0.18 m Dual-Damascene Cu/SiO Interconnection System to Plastic Substrates"

IEEE electron device letters, 2006-03, Vol.27 (3), p.198

2006

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Corrections to "200-mm Wafer Scale Transfer of 0.18 mum Dual-Damascene Cu/SiO 2Interconnection System to Plastic Substrates"

IEEE electron device letters, 2006-03, Vol.27 (3), p.198-198

2006

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200-mm wafer-scale transfer of 0.18-[micro]m dual-damascene Cu/SiO2 interconnection system to plastic substrates

IEEE electron device letters, 2005-11, Vol.26 (11), p.802

2005

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200-mm wafer-scale transfer of 0.18-/spl mu/m dual-damascene Cu/SiO/sub 2/ interconnection system to plastic substrates

IEEE electron device letters, 2005-11, Vol.26 (11), p.802-804

2005

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200 mm wafer-scale epitaxial transfer of single crystal Si on glass by anodic bonding of silicon-on-insulator wafers

Applied physics letters, 2005-08, Vol.87 (7)

2005

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200-mm wafer-scale transfer of 0.18-μm dual-damascene Cu/SiO2 interconnection system to plastic substrates

IEEE electron device letters, 2005-11, Vol.26 (11), p.802-804

2005

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Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature

Microelectronics, 2001-07, Vol.32 (7), p.579-585

2001

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Etching control of benzocyclobutene in CF 4 / O 2 and SF 6 / O 2 plasmas with thick photoresist and titanium masks

Thin solid films, 2006, Vol.504 (1), p.252-256

2006

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Investigation into performance of TaN diffusion barrier against copper diffusion using XRD

Electronics letters, 2000-12, Vol.36 (25), p.2105-2106

Teh, W.H.

2000

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Evaluation of the performance of TaN diffusion barrier against copper diffusion using SIMS and AFM

Electronics letters, 2001-05, Vol.37 (10), p.660-661

2001

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Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration

2009 IEEE International Interconnect Technology Conference, 2009, p.53-55

2009

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Wafer Thickness Sensor (WTS) for etch depth measurement of TSV

2009 IEEE International Conference on 3D System Integration, 2009, p.1-5

2009

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A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration

2009 IEEE International Conference on 3D System Integration, 2009, p.1-5

2009

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Uniform patterned synthesis of vertically-aligned carbon nanotubes on low-stress micromechanical structures

TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664), 2003, Vol.1, p.190-193 vol.1

2003

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Orchestrated Intron Retention Regulates Normal Granulocyte Differentiation

Cell, 2013-08, Vol.154 (3), p.583-595

2013

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Toward High‐Capacity Carbon Fiber Cathodes for Structural Batteries using Electrophoretic Deposition: Effects of Oxidative Surface Treatment on Carbon Fibers

Advanced engineering materials, 2023-12, Vol.25 (23), p.n/a

2023

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Pharmacists’ attitude, self‐reported knowledge and practice of dosage adjustment among chronic kidney disease patients in Malaysia

Journal of pharmacy practice and research, 2019-04, Vol.49 (2), p.179-185

2019

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Development of 3D printer for functionally graded material using fused deposition modelling method

IOP conference series. Earth and environmental science, 2019-06, Vol.268 (1), p.12019

2019

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The National Institute for Health Research: making an impact in imaging research

Clinical radiology, 2019-03, Vol.74 (3), p.242-246

2019

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Dosimetric Evaluation of the Brachial Plexus in the Treatment of Head and Neck Cancer

International journal of radiation oncology, biology, physics, 2007-11, Vol.69 (3), p.S464-S465

2007

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Cross-linked PMMA as a low-dimensional dielectric sacrificial layer

Evaluation of corneal sensitivity to mechanical and chemical stimuli after LASIK: a pilot study

Effect of low numerical-aperture femtosecond two-photon absorption on (SU-8) resist for ultrahigh-aspect-ratio microstereolithography

Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks

Corrections to "200-mm Wafer Scale Transfer of 0.18$mu$m Dual-Damascene Cu/SiO$_2$Interconnection System to Plastic Substrates"

Corrections to "200-mm Wafer Scale Transfer of 0.18 m Dual-Damascene Cu/SiO Interconnection System to Plastic Substrates"

Corrections to "200-mm Wafer Scale Transfer of 0.18 mum Dual-Damascene Cu/SiO 2Interconnection System to Plastic Substrates"

200-mm wafer-scale transfer of 0.18-[micro]m dual-damascene Cu/SiO2 interconnection system to plastic substrates

200-mm wafer-scale transfer of 0.18-/spl mu/m dual-damascene Cu/SiO/sub 2/ interconnection system to plastic substrates

200 mm wafer-scale epitaxial transfer of single crystal Si on glass by anodic bonding of silicon-on-insulator wafers

200-mm wafer-scale transfer of 0.18-μm dual-damascene Cu/SiO2 interconnection system to plastic substrates

Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature

Etching control of benzocyclobutene in CF 4 / O 2 and SF 6 / O 2 plasmas with thick photoresist and titanium masks

Investigation into performance of TaN diffusion barrier against copper diffusion using XRD

Evaluation of the performance of TaN diffusion barrier against copper diffusion using SIMS and AFM

Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration

Wafer Thickness Sensor (WTS) for etch depth measurement of TSV

A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration

Uniform patterned synthesis of vertically-aligned carbon nanotubes on low-stress micromechanical structures

Orchestrated Intron Retention Regulates Normal Granulocyte Differentiation

Toward High‐Capacity Carbon Fiber Cathodes for Structural Batteries using Electrophoretic Deposition: Effects of Oxidative Surface Treatment on Carbon Fibers

Pharmacists’ attitude, self‐reported knowledge and practice of dosage adjustment among chronic kidney disease patients in Malaysia

Development of 3D printer for functionally graded material using fused deposition modelling method

The National Institute for Health Research: making an impact in imaging research

Dosimetric Evaluation of the Brachial Plexus in the Treatment of Head and Neck Cancer

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