UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Electrochemical–thermal analysis of 18650 Lithium Iron Phosphate cell

Energy conversion and management, 2013-11, Vol.75, p.162-174

2013

Volltextzugriff (PDF)

Electro-thermal analysis of Lithium Iron Phosphate battery for electric vehicles

Journal of power sources, 2014-03, Vol.249, p.231-238

2014

Volltextzugriff (PDF)

Electro-thermal analysis and integration issues of lithium ion battery for electric vehicles

Applied energy, 2014-10, Vol.131, p.97-107

2014

Volltextzugriff (PDF)

Effect of interconnect geometry on the evolution of stresses in a solar photovoltaic laminate during and after lamination

Solar energy materials and solar cells, 2018-12, Vol.187, p.241-248

2018

Volltextzugriff (PDF)

Enabling lightweight polycarbonate-polycarbonate (PC-PC) photovoltaics module technology – Enhancing integration of silicon solar cells into aesthetic design for greener building and urban structures

Solar energy, 2022-03, Vol.235, p.129-139

2022

Volltextzugriff (PDF)

Comparative study of intermittent spray cooling in single and two phase regimes

International journal of thermal sciences, 2013-12, Vol.74, p.174-182

2013

Volltextzugriff (PDF)

Thermal management of lithium-ion battery pack with liquid cooling

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015, p.298-302

2015

Volltextzugriff (PDF)

Electrochemicalathermal analysis of 18650 Lithium Iron Phosphate cell

Energy conversion and management, 2013-11, Vol.75, p.162-174

2013

Volltextzugriff (PDF)

Simulation and evaluation of capacity recovery methods for spiral-wound lithium ion batteries

Journal of power sources, 2013-12, Vol.243, p.779-789

2013

Volltextzugriff (PDF)

Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications

Thin solid films, 2006-05, Vol.504 (1), p.371-378

2006

Volltextzugriff (PDF)

Mechanical properties of nanocrystalline copper and nickel

Materials science and technology, 2004-03, Vol.20 (3), p.285-294

2004

Volltextzugriff (PDF)

Germanium n + ∕ p junction formation by laser thermal process

Applied physics letters, 2005-10, Vol.87 (17), p.173507-173507-3

2005

Volltextzugriff (PDF)

Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading

Journal of electronic packaging, 2005-09, Vol.127 (3), p.268-275

Tay, Andrew A. O.

2005

Volltextzugriff (PDF)

A new variable-order singular boundary element for calculating stress intensity factors in three-dimensional elasticity problems

International journal of solids and structures, 2005, Vol.42 (1), p.159-185

2005

Volltextzugriff (PDF)

Fractal analysis of intermetallic compounds in Sn–Ag, Sn–Ag–Bi, and Sn–Ag–Cu diffusion couples

Materials letters, 2006-04, Vol.60 (8), p.1089-1094

2006

Volltextzugriff (PDF)

Surface NH3 anneal on strained Si0.5Ge0.5 for metal-oxide-semiconductor applications with HfO2 as gate dielectric

Applied physics letters, 2006-04, Vol.88 (14)

2006

Volltextzugriff (PDF)

Modeling the stress/strain behavior of a knitted fabric-reinforced elastomer composite

Composites science and technology, 2000-04, Vol.60 (5), p.671-691

2000

Volltextzugriff (PDF)

Reactive Coupling of 4-Vinylaniline with Hydrogen-Terminated Si(100) Surfaces for Electroless Metal and “Synthetic Metal” Deposition

Langmuir, 2004-04, Vol.20 (8), p.3324-3332

2004

Volltextzugriff (PDF)

Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging

Microelectronics and reliability, 2006-05, Vol.46 (5), p.763-767

2006

Volltextzugriff (PDF)

Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low- k Large-Die Flip Chip Package

IEEE transactions on components and packaging technologies, 2009-12, Vol.32 (4), p.838-848

2009

Volltextzugriff (PDF)

Selective Electroless Plating of Copper on (100)-Oriented Single Crystal Silicon Surface Modified by UV-Induced Coupling of 4-Vinylpyridine with the H-Terminated Silicon

The journal of physical chemistry. B, 2002-12, Vol.106 (48), p.12508-12516

2002

Volltextzugriff (PDF)

Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation

Journal of electronic packaging, 2004-03, Vol.126 (1), p.87-93

2004

Volltextzugriff (PDF)

A new variable-order singular boundary element for two-dimensional stress analysis

International journal for numerical methods in engineering, 2002-09, Vol.55 (3), p.293-316

2002

Volltextzugriff (PDF)

Surface Modification of Polyimide Films via Plasma-Enhanced Chemical Vapor Deposition of Thin Silica and Nitride Films

Langmuir, 2003-08, Vol.19 (17), p.6845-6850

2003

Volltextzugriff (PDF)

Characterization of Electrolessly Deposited Copper and Nickel Nanofilms on Modified Si(100) Surface

Langmuir, 2003-08, Vol.19 (17), p.6802-6806

2003

Volltextzugriff (PDF)

1 – 25 von 205

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(40)
Mit Volltextzugriff
(201)

Publikationsform

Sprache

Englisch
(205)

Erscheinungsjahr

n.n

Thema

Science & Technology
(202)
Technology
(199)
Engineering
(180)
Engineering, Electrical & Electronic
(172)
Engineering, Manufacturing
(138)
Computer Science
(52)
Computer Science, Hardware & Architecture
(50)
Physical Sciences
(50)
Materials Science
(46)
Electronics Packaging
(41)
Materials Science, Multidisciplinary
(39)
Temperature
(38)
Integrated Circuit Packaging
(36)
Assembly
(35)
Testing
(35)
Finite Element Methods
(34)
Thermal Stresses
(31)
Delamination
(29)
Electronic Packaging Thermal Management
(28)
Packaging
(28)

15 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Electrochemical–thermal analysis of 18650 Lithium Iron Phosphate cell

Electro-thermal analysis of Lithium Iron Phosphate battery for electric vehicles

Electro-thermal analysis and integration issues of lithium ion battery for electric vehicles

Effect of interconnect geometry on the evolution of stresses in a solar photovoltaic laminate during and after lamination

Enabling lightweight polycarbonate-polycarbonate (PC-PC) photovoltaics module technology – Enhancing integration of silicon solar cells into aesthetic design for greener building and urban structures

Comparative study of intermittent spray cooling in single and two phase regimes

Thermal management of lithium-ion battery pack with liquid cooling

Electrochemicalathermal analysis of 18650 Lithium Iron Phosphate cell

Simulation and evaluation of capacity recovery methods for spiral-wound lithium ion batteries

Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications

Mechanical properties of nanocrystalline copper and nickel

Germanium n + ∕ p junction formation by laser thermal process

Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading

A new variable-order singular boundary element for calculating stress intensity factors in three-dimensional elasticity problems

Fractal analysis of intermetallic compounds in Sn–Ag, Sn–Ag–Bi, and Sn–Ag–Cu diffusion couples

Surface NH3 anneal on strained Si0.5Ge0.5 for metal-oxide-semiconductor applications with HfO2 as gate dielectric

Modeling the stress/strain behavior of a knitted fabric-reinforced elastomer composite

Reactive Coupling of 4-Vinylaniline with Hydrogen-Terminated Si(100) Surfaces for Electroless Metal and “Synthetic Metal” Deposition

Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging

Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low- k Large-Die Flip Chip Package

Selective Electroless Plating of Copper on (100)-Oriented Single Crystal Silicon Surface Modified by UV-Induced Coupling of 4-Vinylpyridine with the H-Terminated Silicon

Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation

A new variable-order singular boundary element for two-dimensional stress analysis

Surface Modification of Polyimide Films via Plasma-Enhanced Chemical Vapor Deposition of Thin Silica and Nitride Films

Characterization of Electrolessly Deposited Copper and Nickel Nanofilms on Modified Si(100) Surface

Suchergebnisse filtern