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Austenite stability and its effect on the toughness of a high strength ultra-low carbon medium manganese steel plate

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2016-10, Vol.675, p.153-163

2016

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Prevalence of anxiety in college and university students: An umbrella review

Journal of affective disorders reports, 2023-12, Vol.14, p.100658, Article 100658

2023

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Thermal-Sensor-Based Occupancy Detection for Smart Buildings Using Machine-Learning Methods

ACM transactions on design automation of electronic systems, 2018-07, Vol.23 (4), p.1-21

2018

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PO09-MO-11 Microelement change of the Parkinson diseases movement disorder patients in China

Journal of the neurological sciences, 2009, Vol.285, p.S194-S194

2009

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PO24-TH-06 Movement disorder among new Parkinson disease patients in China

Journal of the neurological sciences, 2009, Vol.285, p.S287-S287

2009

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Injection of frozen-thawed porcine first polar bodies into enucleated oocytes results in fertilization and embryonic development

Theriogenology, 2011-03, Vol.75 (5), p.826-831

2011

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Hybrid TiO2/AgNPs/g-C3N4 nanocomposite coatings on TC4 titanium alloy for enhanced synergistic antibacterial effect under full spectrum light

Journal of materials science & technology, 2022-08, Vol.118, p.35-43

2022

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OL-039 The theory study of “All-round responsibilities system” for the control emergency public health disasters

International journal of infectious diseases, 2008, Vol.12, p.S48-S48

2008

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New insights into quantum and classical correlations in XY spin models

The European physical journal. B, Condensed matter physics, 2012-12, Vol.85 (12)

2012

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Fast and Scaled Counting-Based Stochastic Computing Divider Design

IEEE transactions on computer-aided design of integrated circuits and systems, 2024-08, Vol.43 (8), p.2277-2287

2024

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Immunisation status and determinants of left-behind children aged 12–72 months in central China

Epidemiology and infection, 2017-07, Vol.145 (9), p.1763-1772

2017

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Efficient statistical analysis method of power/ground (P/G) network

Progress in natural science, 2008, Vol.18 (2), p.189-196

2008

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Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method

IEEE transactions on very large scale integration (VLSI) systems, 2018-05, Vol.26 (5), p.969-980

2018

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Real-Time Full-Chip Thermal Tracking: A Post-Silicon, Machine Learning Perspective

IEEE transactions on computers, 2022-06, Vol.71 (6), p.1411-1424

2022

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Thermoelectric Cooler Modeling and Optimization Via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks

IEEE transactions on computer-aided design of integrated circuits and systems, 2023-11, Vol.42 (11), p.1-1

2023

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Hot-Trim: Thermal and Reliability Management for Commercial Multicore Processors Considering Workload Dependent Hot Spots

IEEE transactions on computer-aided design of integrated circuits and systems, 2023-07, Vol.42 (7), p.2290-2302

2023

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Linear Time Electromigration Analysis based on Physics-informed Sparse Regression

IEEE transactions on computer-aided design of integrated circuits and systems, 2023-11, Vol.42 (11), p.1-1

2023

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Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach

IEEE transactions on computer-aided design of integrated circuits and systems, 2022-09, Vol.41 (9), p.3066-3077

2022

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A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects

IEEE transactions on computer-aided design of integrated circuits and systems, 2021-02, Vol.40 (2), p.350-363

2021

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Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling

IEEE transactions on computer-aided design of integrated circuits and systems, 2022-05, Vol.41 (5), p.1453-1466

2022

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Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks

IEEE transactions on computer-aided design of integrated circuits and systems, 2016-11, Vol.35 (11), p.1848-1861

2016

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Leakage-Aware Predictive Thermal Management for Multicore Systems Using Echo State Network

IEEE transactions on computer-aided design of integrated circuits and systems, 2020-07, Vol.39 (7), p.1400-1413

2020

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GridNetOpt: Fast Full-Chip EM-Aware Power Grid Optimization Accelerated by Deep Neural Networks

IEEE transactions on computer-aided design of integrated circuits and systems, 2023-05, Vol.42 (5), p.1662-1675

2023

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Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging

IEEE transactions on computer-aided design of integrated circuits and systems, 2021-04, Vol.40 (4), p.694-707

2021

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Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires

IEEE transactions on computer-aided design of integrated circuits and systems, 2018-12, Vol.37 (12), p.3137-3150

2018

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Austenite stability and its effect on the toughness of a high strength ultra-low carbon medium manganese steel plate

Prevalence of anxiety in college and university students: An umbrella review

Thermal-Sensor-Based Occupancy Detection for Smart Buildings Using Machine-Learning Methods

PO09-MO-11 Microelement change of the Parkinson diseases movement disorder patients in China

PO24-TH-06 Movement disorder among new Parkinson disease patients in China

Injection of frozen-thawed porcine first polar bodies into enucleated oocytes results in fertilization and embryonic development

Hybrid TiO2/AgNPs/g-C3N4 nanocomposite coatings on TC4 titanium alloy for enhanced synergistic antibacterial effect under full spectrum light

OL-039 The theory study of “All-round responsibilities system” for the control emergency public health disasters

New insights into quantum and classical correlations in XY spin models

Fast and Scaled Counting-Based Stochastic Computing Divider Design

Immunisation status and determinants of left-behind children aged 12–72 months in central China

Efficient statistical analysis method of power/ground (P/G) network

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method

Real-Time Full-Chip Thermal Tracking: A Post-Silicon, Machine Learning Perspective

Thermoelectric Cooler Modeling and Optimization Via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks

Hot-Trim: Thermal and Reliability Management for Commercial Multicore Processors Considering Workload Dependent Hot Spots

Linear Time Electromigration Analysis based on Physics-informed Sparse Regression

Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach

A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects

Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling

Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks

Leakage-Aware Predictive Thermal Management for Multicore Systems Using Echo State Network

GridNetOpt: Fast Full-Chip EM-Aware Power Grid Optimization Accelerated by Deep Neural Networks

Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires

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