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Toward Understanding the Adsorption And Inhibition Mechanism of Cu-MBTA Passivation Film on Copper Surface: A Combined Experimental and DFT Investigation

Electronic Materials Letters, 2021, 17(1), , pp.109-118

2021

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Application of surfactant for facilitating benzotriazole removal and inhibiting copper corrosion during post-CMP cleaning

Microelectronic engineering, 2018-12, Vol.202, p.1-8

2018

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Insights into triazole derivatives as potential corrosion inhibitors in CMP process: Experimental evaluation and theoretical analysis

Applied surface science, 2022-11, Vol.602, p.154165, Article 154165

2022

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Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment

Colloids and surfaces. A, Physicochemical and engineering aspects, 2020-08, Vol.599, p.124872, Article 124872

2020

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Thermal Stability Study of GaP/High‐k Dielectrics Interfaces

Advanced materials interfaces, 2017-10, Vol.4 (20), p.n/a

2017

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Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP

Colloids and surfaces. A, Physicochemical and engineering aspects, 2020-02, Vol.586, p.124286, Article 124286

2020

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In-depth research on azole corrosion inhibitors - effect of N atoms position and quantity on copper corrosion inhibition performance in alkaline environments: Experimental evaluation and theoretical analysis

Colloids and surfaces. A, Physicochemical and engineering aspects, 2024-10, Vol.698, p.134624, Article 134624

2024

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Theoretical and electrochemical analysis on inhibition effect of benzotriazole and 1,2,4-triazole on cobalt surface

Colloids and surfaces. A, Physicochemical and engineering aspects, 2020-04, Vol.591, p.124516, Article 124516

2020

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Research progress on the application of ceria nanoparticles as abrasives in dielectric layer CMP and post cleaning: Structure, morphology, doping, and mechanism

Colloids and surfaces. A, Physicochemical and engineering aspects, 2023-12, Vol.679, p.132551, Article 132551

2023

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Experimental validation and molecular dynamics simulation of removal of PO residue on Co surface by alkaline cleaning solution with different functional groups

Colloids and surfaces. A, Physicochemical and engineering aspects, 2021-02, Vol.610, p.125932, Article 125932

2021

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Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection

Materials chemistry and physics, 2020-09, Vol.252, p.123230, Article 123230

2020

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The effect of structural properties of benzo derivative on the inhibition performance for copper corrosion in alkaline medium: Experimental and theoretical investigations

Colloids and surfaces. A, Physicochemical and engineering aspects, 2022-09, Vol.649, p.129531, Article 129531

2022

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Corrosion inhibitors in H2O2 system slurry for Ru based barrier layer Cu interconnect chemical mechanical polishing and optimization

Colloids and surfaces. A, Physicochemical and engineering aspects, 2024-11, Vol.703, p.135351, Article 135351

2024

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Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution

Colloids and surfaces. A, Physicochemical and engineering aspects, 2024-09, Vol.697, p.134428, Article 134428

2024

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Nicotinic acid as a novel inhibitor for alkaline cobalt CMP: Experiment and molecular simulation

Colloids and surfaces. A, Physicochemical and engineering aspects, 2022-11, Vol.652, p.129816, Article 129816

2022

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Effects of two mild amino acids on benzotriazole residue desorption during cobalt post-chemical mechanical polishing cleaning: Experimental and theoretical studies

Colloids and surfaces. A, Physicochemical and engineering aspects, 2024-02, Vol.683, p.133052, Article 133052

2024

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Diethylenetriamine and serine as synergists used in FA/OII based alkaline solution to realize enhanced cleaning efficiency of the organic corrosion inhibitor

Colloids and surfaces. A, Physicochemical and engineering aspects, 2023-10, Vol.674, p.131952, Article 131952

2023

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Composite complex agent based on organic amine alkali for BTA removal in post CMP cleaning of copper interconnection

Journal of electroanalytical chemistry (Lausanne, Switzerland), 2022-04, Vol.910, p.116187, Article 116187

2022

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Experimental characterization and dynamical modeling evaluation for enhanced BTA removal by three amino acids in post-Cu-CMP cleaning

Journal of molecular liquids, 2023-07, Vol.382, p.121987, Article 121987

2023

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Synergistic effect of LABSA/JFCE combined surfactant system on the removal of particles on copper wafer surface

Materials chemistry and physics, 2021-01, Vol.257, p.123841, Article 123841

2021

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Corrosion inhibition effect of benzimidazole and two derivatives on copper in alkaline environments: Experimental and theoretical analyses

Journal of molecular liquids, 2023-11, Vol.390, p.122985, Article 122985

2023

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Effect of ethylenediamine on CMP performance of ruthenium in H2O2-based slurries

RSC advances, 2021-12, Vol.12 (1), p.228-240

2021

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A study of FTIR and XPS analysis of alkaline‐based cleaning agent for removing Cu‐BTA residue on Cu wafer

Surface and interface analysis, 2019-05, Vol.51 (5), p.566-575

2019

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Effect of complexing agent on ceria particle removal in post-STI CMP cleaning process

Colloids and surfaces. A, Physicochemical and engineering aspects, 2023-02, Vol.658, p.130668, Article 130668

2023

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Multidimensional insights into the corrosion inhibition of potassium oleate on Cu in alkaline medium: A combined Experimental and theoretical investigation

Materials science & engineering. B, Solid-state materials for advanced technology, 2021-10, Vol.272, p.115330, Article 115330

2021

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Toward Understanding the Adsorption And Inhibition Mechanism of Cu-MBTA Passivation Film on Copper Surface: A Combined Experimental and DFT Investigation

Application of surfactant for facilitating benzotriazole removal and inhibiting copper corrosion during post-CMP cleaning

Insights into triazole derivatives as potential corrosion inhibitors in CMP process: Experimental evaluation and theoretical analysis

Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment

Thermal Stability Study of GaP/High‐k Dielectrics Interfaces

Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP

In-depth research on azole corrosion inhibitors - effect of N atoms position and quantity on copper corrosion inhibition performance in alkaline environments: Experimental evaluation and theoretical analysis

Theoretical and electrochemical analysis on inhibition effect of benzotriazole and 1,2,4-triazole on cobalt surface

Research progress on the application of ceria nanoparticles as abrasives in dielectric layer CMP and post cleaning: Structure, morphology, doping, and mechanism

Experimental validation and molecular dynamics simulation of removal of PO residue on Co surface by alkaline cleaning solution with different functional groups

Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection

The effect of structural properties of benzo derivative on the inhibition performance for copper corrosion in alkaline medium: Experimental and theoretical investigations

Corrosion inhibitors in H2O2 system slurry for Ru based barrier layer Cu interconnect chemical mechanical polishing and optimization

Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution

Nicotinic acid as a novel inhibitor for alkaline cobalt CMP: Experiment and molecular simulation

Effects of two mild amino acids on benzotriazole residue desorption during cobalt post-chemical mechanical polishing cleaning: Experimental and theoretical studies

Diethylenetriamine and serine as synergists used in FA/OII based alkaline solution to realize enhanced cleaning efficiency of the organic corrosion inhibitor

Composite complex agent based on organic amine alkali for BTA removal in post CMP cleaning of copper interconnection

Experimental characterization and dynamical modeling evaluation for enhanced BTA removal by three amino acids in post-Cu-CMP cleaning

Synergistic effect of LABSA/JFCE combined surfactant system on the removal of particles on copper wafer surface

Corrosion inhibition effect of benzimidazole and two derivatives on copper in alkaline environments: Experimental and theoretical analyses

Effect of ethylenediamine on CMP performance of ruthenium in H2O2-based slurries

A study of FTIR and XPS analysis of alkaline‐based cleaning agent for removing Cu‐BTA residue on Cu wafer

Effect of complexing agent on ceria particle removal in post-STI CMP cleaning process

Multidimensional insights into the corrosion inhibition of potassium oleate on Cu in alkaline medium: A combined Experimental and theoretical investigation

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