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Microelectronic engineering, 2014-04, Vol.118, p.15-19
2014
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Carbon (New York), 2002-09, Vol.40 (11), p.1919-1927
2002
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Modelling and simulation in materials science and engineering, 2011-10, Vol.19 (7), p.074009-16
2011
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International journal of fracture, 2009-08, Vol.158 (2), p.157-167
2009
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Mechanics of advanced materials and structures, 2009-01, Vol.16 (8), p.623-631
2009
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Journal of the European Ceramic Society, 1998-01, Vol.18 (13), p.1827-1833
1998
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Composites science and technology, 1996-01, Vol.56 (7), p.817-823
1996
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Ceramic Engineering and Science Proceedings, 2007, Vol.310 (5), p.65-76
2007
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2017 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), 2017, p.1-2
- Lu, C.-M V.
- Fenouillet-Beranger, C.
- Brocard, M.
- Billoint, O.
- Cibrario, G.
- Brunet, L.
- Garros, X.
- Leroux, C.
- Casse, M.
- Laurent, A.
- Toffoli, A.
- Romano, G.
- Kies, R.
- Gassilloud, R.
- Rambal, N.
- Lapras, V.
- Samson, M-P.
- Tallaron, C.
- Tabone, C.
- Previtali, B.
- Barge, D.
- Ayres, A.
- Pasini, L.
- Besombes, P.
- Andrieu, F.
- Batude, P.
- Skotnicki, T.
- Vinet, M.
2017
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1992 IEEE International Solid-State Circuits Conference Digest of Technical Papers, 1992, p.224-225
1992
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1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986, Vol.XXIX, p.174-175
1986
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