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Quantification of wafer bond strength under controlled atmospheres

Japanese Journal of Applied Physics, 2022-06, Vol.61 (SF), p.SF1010

2022

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Room temperature bonding of Au assisted by self-assembled monolayer

Applied physics letters, 2023-01, Vol.122 (5)

2023

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Flexible and porous microneedles of PDMS for continuous glucose monitoring

Biomedical microdevices, 2020-12, Vol.22 (4), p.79-79, Article 79

2020

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Microfluidic chip to interface porous microneedles for ISF collection

Biomedical microdevices, 2019-03, Vol.21 (1), p.28-10, Article 28

2019

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Functionalized microneedles for continuous glucose monitoring

Nano Convergence, 2018, 5(28), , pp.1-10

2018

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Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer

Advanced materials interfaces, 2021-03, Vol.8 (5), p.n/a

2021

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Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere

Journal of materials science. Materials in electronics, 2022-02, Vol.33 (5), p.2582-2589

2022

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Room temperature bonding and debonding of polyimide film and glass substrate based on surface activate bonding method

Japanese Journal of Applied Physics, 2018-02, Vol.57 (2S1), p.2

2018

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Room Temperature Temporary Bonding of Glass Substrates Based on SAB Method Using Si Intermediate Layer

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-10, Vol.7 (10), p.1713-1720

2017

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Correction to: Functionalized microneedles for continuous glucose monitoring

Nano Convergence, 2018, 5(36), , pp.1-1

2018

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Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}

Scientific reports, 2024-01, Vol.14 (1), Article 1267

2024

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Room temperature wafer bonding through conversion of polysilazane into SiO2

Scientific reports, 2024-01, Vol.14 (1), p.1267

2024

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Influence of chewing time on salivary stress markers

Journal of prosthodontic research, 2014-01, Vol.58 (1), p.48-54

2014

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Room temperature wafer bonding through conversion of polysilazane into \documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\hbox {SiO}_{2}$$\end{document}SiO2

Scientific reports, 2024-01, Vol.14

2024

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Room temperature wafer bonding through conversion of polysilazane into [Formula: see text]

Scientific reports, 2024-01, Vol.14 (1), p.1267-1267

2024

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Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}$$ SiO 2

Scientific reports, 2024-01, Vol.14 (1), p.1-8

2024

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Microfluidic chip connected to porous microneedle array for continuous ISF sampling

Drug delivery and translational research, 2022-02, Vol.12 (2), p.435-443

2022

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A novel strategy for GaN-on-diamond device with a high thermal boundary conductance

Journal of alloys and compounds, 2022-06, Vol.905, p.164076, Article 164076

2022

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Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer

Japanese Journal of Applied Physics, 2018-04, Vol.57 (4S), p.4

2018

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Sequential Plasma Activation Bonding of Sapphire using SiO2 Intermediate Layer

2022 International Conference on Electronics Packaging (ICEP), 2022, p.15-16

2022

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Quantification of Wafer Bond Strength of Silicon Nitride under Controlled Atmosphere

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2021, p.9-9

2021

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Evaluation of Wafer Bond Strength under Vacuum

2021 IEEE CPMT Symposium Japan (ICSJ), 2021, p.57-60

2021

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IEEE_Xplore

Effect of Sequential Plasma Activation on Al2O3 for Low Temperature Bonding of Glass

2021 International Conference on Electronics Packaging (ICEP), 2021, p.59-60

2021

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Investigation of Plasma Gases for Polysilazane Conversion into SiO2 for Wafer Bonding

2024 International Conference on Electronics Packaging (ICEP), 2024, p.289-290

2024

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Influence of Various Plasma and UV/O3Treatments on Au Surfaces for Au-Au Surface Activated Bonding

2024 International Conference on Electronics Packaging (ICEP), 2024, p.1-2

2024

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Quantification of wafer bond strength under controlled atmospheres

Room temperature bonding of Au assisted by self-assembled monolayer

Flexible and porous microneedles of PDMS for continuous glucose monitoring

Microfluidic chip to interface porous microneedles for ISF collection

Functionalized microneedles for continuous glucose monitoring

Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer

Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere

Room temperature bonding and debonding of polyimide film and glass substrate based on surface activate bonding method

Room Temperature Temporary Bonding of Glass Substrates Based on SAB Method Using Si Intermediate Layer

Correction to: Functionalized microneedles for continuous glucose monitoring

Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}

Room temperature wafer bonding through conversion of polysilazane into SiO2

Influence of chewing time on salivary stress markers

Room temperature wafer bonding through conversion of polysilazane into [Formula: see text]

Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}$$ SiO 2

Microfluidic chip connected to porous microneedle array for continuous ISF sampling

A novel strategy for GaN-on-diamond device with a high thermal boundary conductance

Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer

Sequential Plasma Activation Bonding of Sapphire using SiO2 Intermediate Layer

Quantification of Wafer Bond Strength of Silicon Nitride under Controlled Atmosphere

Evaluation of Wafer Bond Strength under Vacuum

Effect of Sequential Plasma Activation on Al2O3 for Low Temperature Bonding of Glass

Investigation of Plasma Gases for Polysilazane Conversion into SiO2 for Wafer Bonding

Influence of Various Plasma and UV/O3Treatments on Au Surfaces for Au-Au Surface Activated Bonding

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