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Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices

ACS applied materials & interfaces, 2020-02, Vol.12 (7), p.8376-8384

2020

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Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices

Scripta materialia, 2018-06, Vol.150, p.148-151

2018

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Quantification of wafer bond strength under controlled atmospheres

Japanese Journal of Applied Physics, 2022-06, Vol.61 (SF), p.SF1010

2022

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High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces

ACS applied materials & interfaces, 2019-09, Vol.11 (36), p.33428-33434

2019

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Room temperature bonding of Au assisted by self-assembled monolayer

Applied physics letters, 2023-01, Vol.122 (5)

2023

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Room-temperature direct bonding of silicon and quartz glass wafers

Applied physics letters, 2017-05, Vol.110 (22)

2017

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Evidence for intermolecular forces involved in ladybird beetle tarsal setae adhesion

Scientific reports, 2021-04, Vol.11 (1), p.7729-7729, Article 7729

2021

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GaN-Si direct wafer bonding at room temperature for thin GaN device transfer after epitaxial lift off

Applied surface science, 2017-09, Vol.416, p.1007-1012

2017

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Direct wafer bonding of Ga2O3–SiC at room temperature

Ceramics international, 2019-04, Vol.45 (5), p.6552-6555

2019

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Elucidating the formation mechanisms of the parasitic channel with buffer-free GaN/Si hetero-bonding structures

Applied physics letters, 2024-05, Vol.124 (19)

2024

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Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer

Advanced materials interfaces, 2021-03, Vol.8 (5), p.n/a

2021

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Exploration of the enhanced performances for silk fibroin/sodium alginate composite coatings on biodegradable Mg−Zn−Ca alloy

Journal of magnesium and alloys, 2021-09, Vol.9 (5), p.1578-1594

2021

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Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment

Lab on a chip, 2013-03, Vol.13 (6), p.1048-1052

2013

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Surface activated bonding of GaAs and SiC wafers at room temperature for improved heat dissipation in high-power semiconductor lasers

Japanese Journal of Applied Physics, 2015-03, Vol.54 (3), p.30207-1-030207-4

2015

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Sequential plasma activation methods for hydrophilic direct bonding at sub-200 °C

Japanese Journal of Applied Physics, 2018-02, Vol.57 (2S1), p.2

2018

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Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste

Journal of materials science. Materials in electronics, 2020-04, Vol.31 (8), p.6497-6505

2020

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Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au Films

Micromachines (Basel), 2019-02, Vol.10 (2), p.119

2019

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Low temperature Cu bonding with large tolerance of surface oxidation

AIP advances, 2019-05, Vol.9 (5), p.055127-055127-5

2019

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Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process

Analytical and bioanalytical chemistry, 2012-01, Vol.402 (3), p.1011-1018

2012

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Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid

Japanese Journal of Applied Physics, 2017-04, Vol.56 (4S), p.4-04CC01

2017

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Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices

Journal of materials science & technology, 2020-06, Vol.46, p.156-167

2020

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Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere

Journal of materials science. Materials in electronics, 2022-02, Vol.33 (5), p.2582-2589

2022

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Room-temperature bonding method for polymer substrate of flexible electronics by surface activation using nano-adhesion layers

Japanese Journal of Applied Physics, 2015-10, Vol.54 (10), p.101602

2015

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Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150°C and Atmospheric Pressure

Journal of electronic materials, 2012-08, Vol.41 (8), p.2274-2280

2012

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Properties of various plasma surface treatments for low-temperature Au-Au bonding

Japanese Journal of Applied Physics, 2018-04, Vol.57 (4S), p.4

2018

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Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices

Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices

Quantification of wafer bond strength under controlled atmospheres

High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces

Room temperature bonding of Au assisted by self-assembled monolayer

Room-temperature direct bonding of silicon and quartz glass wafers

Evidence for intermolecular forces involved in ladybird beetle tarsal setae adhesion

GaN-Si direct wafer bonding at room temperature for thin GaN device transfer after epitaxial lift off

Direct wafer bonding of Ga2O3–SiC at room temperature

Elucidating the formation mechanisms of the parasitic channel with buffer-free GaN/Si hetero-bonding structures

Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer

Exploration of the enhanced performances for silk fibroin/sodium alginate composite coatings on biodegradable Mg−Zn−Ca alloy

Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment

Surface activated bonding of GaAs and SiC wafers at room temperature for improved heat dissipation in high-power semiconductor lasers

Sequential plasma activation methods for hydrophilic direct bonding at sub-200 °C

Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste

Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au Films

Low temperature Cu bonding with large tolerance of surface oxidation

Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process

Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid

Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices

Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere

Room-temperature bonding method for polymer substrate of flexible electronics by surface activation using nano-adhesion layers

Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150°C and Atmospheric Pressure

Properties of various plasma surface treatments for low-temperature Au-Au bonding

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