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High-performance heat sinking for VLSI

IEEE electron device letters, 1981-05, Vol.2 (5), p.126-129

1981

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Demonstration of high-performance silicon microchannel heat exchangers for laser diode array cooling

Applied physics letters, 1988-09, Vol.53 (12), p.1030-1032

1988

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Laser-patterned interconnect for thin-film hybrid wafer-scale circuits

IEEE electron device letters, 1987-11, Vol.8 (11), p.540-543

Tuckerman, D.B.

1987

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Planarization of gold and aluminum thin films using a pulsed laser

IEEE electron device letters, 1986-01, Vol.7 (1), p.1-4

1986

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Multichip packaging for very-high-speed digital systems

Applied surface science, 1990-12, Vol.46 (1), p.121-130

1990

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Modeling of laser planarization of thin metal films

Applied physics letters, 1989-03, Vol.54 (12), p.1109-1111

1989

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IIIB-8 implications of high performance heat sinking for electron devices

IEEE transactions on electron devices, 1981-10, Vol.28 (10), p.1230-1231

1981

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Integral decoupling capacitance reduces multichip module ground bounce

IEEE Multi-Chip Module Conference, 1993, 1993, p.79-84

1993

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Resonances in symmetric Josephson interferometers

Applied physics letters, 1980-07, Vol.37 (2), p.241-243

1980

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Analog simulator of a Josephson quantum interference device

Review of scientific instruments, 1978-06, Vol.49 (6), p.835-839

Tuckerman, David B.

1978

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Precision embedded thin film resistors for multichip modules (MCM-D)

Proceedings 1997 IEEE Multi-Chip Module Conference, 1997, p.44-49

1997

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The RTNS-II fusion materials irradiation facility

Journal of nuclear materials, 1986-11, Vol.141, p.1061-1063

1986

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Connecting the Dots in Interprofessional Quality Improvement Education

Journal of interprofessional education & practice, 2015-06, Vol.1 (2), p.74-75

2015

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Electrical Design Techniques for MCM-D

Microelectronics international, 1995-09, Vol.12 (3), p.16-22

1995

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Implementation of a Gallium Arsenide multichip digital circuit operating at 500-1000 MHz clock rates using a Si/Cu/SiO2 MCM-D technology

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1997-02, Vol.20 (1), p.17-26

1997

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Multichip packaging technology with laser-patterned interconnects

IEEE transactions on components, hybrids, and manufacturing technology, 1989-12, Vol.12 (4), p.646-649

1989

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A Josephson ultrahigh-resolution sampling system

Applied physics letters, 1980-06, Vol.36 (12), p.1008-1010

Tuckerman, David B.

1980

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Silver metallization for advanced interconnects

IEEE transactions on advanced packaging, 1999-02, Vol.22 (1), p.4-8

1999

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Void formation in pulsed laser induced via/contact hole filling

Applied physics letters, 1990-06, Vol.56 (26), p.2625-2627

1990

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Process Margins for Laser Planarization of 1 to 5 µm Gold Films

MRS proceedings, 1988, Vol.129, Article 559

1988

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The nature and transport mechanism of hydrated hydroxide ions in aqueous solution

Nature (London), 2002-06, Vol.417 (6892), p.925-929

2002

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Computational study of turbulent laminar patterns in Couette flow

Physical review letters, 2005-01, Vol.94 (1), p.014502.1-014502.4, Article 014502

2005

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Mean flow of turbulent–laminar patterns in plane Couette flow

Journal of fluid mechanics, 2007-04, Vol.576, p.109-137

2007

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Liquid Structure and Transport Properties of the Deep Eutectic Solvent Ethaline

The journal of physical chemistry. B, 2020-06, Vol.124 (25), p.5251-5264

2020

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Synthesis of Aromatic Anion Exchange Membranes by Friedel–Crafts Bromoalkylation and Cross-Linking of Polystyrene Block Copolymers

Macromolecules, 2019-03, Vol.52 (5), p.2139-2147

2019

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High-performance heat sinking for VLSI

Demonstration of high-performance silicon microchannel heat exchangers for laser diode array cooling

Laser-patterned interconnect for thin-film hybrid wafer-scale circuits

Planarization of gold and aluminum thin films using a pulsed laser

Multichip packaging for very-high-speed digital systems

Modeling of laser planarization of thin metal films

IIIB-8 implications of high performance heat sinking for electron devices

Integral decoupling capacitance reduces multichip module ground bounce

Resonances in symmetric Josephson interferometers

Analog simulator of a Josephson quantum interference device

Precision embedded thin film resistors for multichip modules (MCM-D)

The RTNS-II fusion materials irradiation facility

Connecting the Dots in Interprofessional Quality Improvement Education

Electrical Design Techniques for MCM-D

Implementation of a Gallium Arsenide multichip digital circuit operating at 500-1000 MHz clock rates using a Si/Cu/SiO2 MCM-D technology

Multichip packaging technology with laser-patterned interconnects

A Josephson ultrahigh-resolution sampling system

Silver metallization for advanced interconnects

Void formation in pulsed laser induced via/contact hole filling

Process Margins for Laser Planarization of 1 to 5 µm Gold Films

The nature and transport mechanism of hydrated hydroxide ions in aqueous solution

Computational study of turbulent laminar patterns in Couette flow

Mean flow of turbulent–laminar patterns in plane Couette flow

Liquid Structure and Transport Properties of the Deep Eutectic Solvent Ethaline

Synthesis of Aromatic Anion Exchange Membranes by Friedel–Crafts Bromoalkylation and Cross-Linking of Polystyrene Block Copolymers

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