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Damage-free CMP towards 32nm-node porous low-k (k = 1.6)/Cu integration

Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004, 2004, p.68-69

2004

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Thermal desorption and infrared studies of plasma-enhanced chemical vapor deposited SiO films with tetraethylorthosilicate

Japanese Journal of Applied Physics, 1993-04, Vol.32 (4), p.1787-1793

1993

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Low-pressure CMP for reliable porous low-k/Cu integration

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695), 2003, p.86-88

2003

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Characterization of patterned low-k film delamination during CMP for the 32nm node Cu/ultra low-k (k=1.6-1.8) integration

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.239-241

2004

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Enhancement in electrical via-yield of porous low-k/Cu integration by reducing CMP pressure

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.130-132

2004

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Effect of Ti insertion between Cu and TiN layers on electromigration reliability in Cu/(Ti)/TiN/Ti layered damascene interconnects

2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059), 2000, p.333-338

2000

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Enhancement of hot-carrier induced degradation under low gate voltage stress due to hydrogen for NMOSFETs with SiN films

1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual, 1997, p.307-311

1997

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FEATURE OF EVENT-RELATED POTENTIALS IN DEVELOPING CHILDREN

Japanese Journal of Physical Fitness and Sports Medicine, 2000/04/01, Vol.49(2), pp.307-314

2000

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Studies of Corrosive Outgasses from Via Holes Using Thermal Desorption Spectroscopy

Japanese Journal of Applied Physics, 1995, Vol.34 (2B), p.1021-1025, Article 1021

1995

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Damage-free CMP towards 32nm-node porous low-k (k=1.6)/Cu integration

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Low-pressure CMP for 300-mm ultra low-k (k=1.6-1.8)/Cu integration

IEEE International Electron Devices Meeting 2003, 2003, p.6.4.1-6.4.4

2003

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Impacts of high modulus ultra low-k/Cu 300 mm-wafer integration for 65 nm technology node and beyond

2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407), 2003, p.125-126

2003

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What is learned in the cradle is carried to the grave

Yūki gōsei kagaku kyōkaishi, 2024-03, Vol.82 (3), p.288-292

Tokitoh, Norihiro

2024

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Planar Chiral Tetrasubstituted [2.2]Paracyclophane: Optical Resolution and Functionalization

Journal of the American Chemical Society, 2014-03, Vol.136 (9), p.3350-3353

2014

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Stable Heavier Carbene Analogues

Chemical reviews, 2009-08, Vol.109 (8), p.3479-3511

2009

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New Progress in the Chemistry of Stable Metallaaromatic Compounds of Heavier Group 14 Elements

Accounts of chemical research, 2004-02, Vol.37 (2), p.86-94

Tokitoh, Norihiro

2004

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Reproducible Fabrication of Efficient Perovskite-based Solar Cells: X-ray Crystallographic Studies on the Formation of CH3NH3PbI3 Layers

Chemistry letters, 2014-05, Vol.43 (5), p.711-713

2014

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Highly Bent 1,3‐Digerma‐2‐silaallene

Angewandte Chemie International Edition, 2017-08, Vol.56 (33), p.9920-9923

International ed. in English, 2017

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Stannabenzenylpotassium: The First Isolable Tin‐Containing Benzene Derivative

Chemistry : a European journal, 2018-11, Vol.24 (64), p.17039-17045

2018

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Control over Ligand-Exchange Positions of Thiolate-Protected Gold Nanoclusters Using Steric Repulsion of Protecting Ligands

Journal of the American Chemical Society, 2022-07, Vol.144 (27), p.12310-12320

2022

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Doubly bonded systems between heavier Group 15 elements

Dalton transactions : an international journal of inorganic chemistry, 2008-01 (11), p.1395-1408

2008

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A Novel Reactivity of Phosphanylalumane (>P−Al<): Reversible Addition of a Saturated Interelement Bond to Olefins

Chemistry : a European journal, 2021-08, Vol.27 (44), p.11273-11278

2021

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Fused‐Nonacyclic Multi‐Resonance Delayed Fluorescence Emitter Based on Ladder‐Thiaborin Exhibiting Narrowband Sky‐Blue Emission with Accelerated Reverse Intersystem Crossing

Angewandte Chemie International Edition, 2021-09, Vol.60 (37), p.20280-20285

International ed. in English, 2021

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Main Group Analogs of Dichalcogeniranes

European journal of inorganic chemistry, 2024-04, Vol.27 (10), p.n/a

2024

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Front Cover: Main Group Analogs of Dichalcogeniranes (Eur. J. Inorg. Chem. 10/2024)

European journal of inorganic chemistry, 2024-04, Vol.27 (10), p.n/a

2024

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Damage-free CMP towards 32nm-node porous low-k (k = 1.6)/Cu integration

Thermal desorption and infrared studies of plasma-enhanced chemical vapor deposited SiO films with tetraethylorthosilicate

Low-pressure CMP for reliable porous low-k/Cu integration

Characterization of patterned low-k film delamination during CMP for the 32nm node Cu/ultra low-k (k=1.6-1.8) integration

Enhancement in electrical via-yield of porous low-k/Cu integration by reducing CMP pressure

Effect of Ti insertion between Cu and TiN layers on electromigration reliability in Cu/(Ti)/TiN/Ti layered damascene interconnects

Enhancement of hot-carrier induced degradation under low gate voltage stress due to hydrogen for NMOSFETs with SiN films

FEATURE OF EVENT-RELATED POTENTIALS IN DEVELOPING CHILDREN

Studies of Corrosive Outgasses from Via Holes Using Thermal Desorption Spectroscopy

Damage-free CMP towards 32nm-node porous low-k (k=1.6)/Cu integration

Low-pressure CMP for 300-mm ultra low-k (k=1.6-1.8)/Cu integration

Impacts of high modulus ultra low-k/Cu 300 mm-wafer integration for 65 nm technology node and beyond

What is learned in the cradle is carried to the grave

Planar Chiral Tetrasubstituted [2.2]Paracyclophane: Optical Resolution and Functionalization

Stable Heavier Carbene Analogues

New Progress in the Chemistry of Stable Metallaaromatic Compounds of Heavier Group 14 Elements

Reproducible Fabrication of Efficient Perovskite-based Solar Cells: X-ray Crystallographic Studies on the Formation of CH3NH3PbI3 Layers

Highly Bent 1,3‐Digerma‐2‐silaallene

Stannabenzenylpotassium: The First Isolable Tin‐Containing Benzene Derivative

Control over Ligand-Exchange Positions of Thiolate-Protected Gold Nanoclusters Using Steric Repulsion of Protecting Ligands

Doubly bonded systems between heavier Group 15 elements

A Novel Reactivity of Phosphanylalumane (>P−Al<): Reversible Addition of a Saturated Interelement Bond to Olefins

Fused‐Nonacyclic Multi‐Resonance Delayed Fluorescence Emitter Based on Ladder‐Thiaborin Exhibiting Narrowband Sky‐Blue Emission with Accelerated Reverse Intersystem Crossing

Main Group Analogs of Dichalcogeniranes

Front Cover: Main Group Analogs of Dichalcogeniranes (Eur. J. Inorg. Chem. 10/2024)

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