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Development in Electronic Packaging – Moving to 3D System Configuration
Radioengineering, 2011-04, Vol.20 (1), p.214-220
2011
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Necessity for teaching of eco-design in electric engineering education
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 2010, p.458-463
2010
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Comparing of simulation and experimental results of chip power interconnection
2008 31st International Spring Seminar on Electronics Technology, 2008, p.261-263
2008
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The analysis of reliability of solder joints on SMD ceramic resistor arrays
2017 40th International Spring Seminar on Electronics Technology (ISSE), 2017, p.1-5
2017
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Planar thick film inductor characterization
18th European Microelectronics & Packaging Conference, 2011, p.1-4
2011
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Impact of solder paste drying on the solderability
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, 2014, p.198-201
2014
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Roadmap of Lead-free Soldering
2007 30th International Spring Seminar on Electronics Technology (ISSE), 2007, p.527-534
2007
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Vibration Testing as a Tool to Optimize the Configuration of the PCBs
International Symposium on Microelectronics, 2014-10, Vol.2014 (1), p.50-54
2014
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The new principle of dispensing system with the support of ultrasonic energy
2012 4th Electronic System-Integration Technology Conference, 2012, p.1-3
2012
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Possibilities of making 3D resistors in LTCC technology
2012 35th International Spring Seminar on Electronics Technology, 2012, p.50-54
2012
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Application of PERT for microelectronics technology education
26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003, 2003, p.121-126
2003
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New method for deposition of thixotropic materials with resolution under 100 μm
2013 Eurpoean Microelectronics Packaging Conference (EMPC), 2013, p.1-3
2013
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Importance of vibration testing for new technological configurations in electronics
2013 Eurpoean Microelectronics Packaging Conference (EMPC), 2013, p.1-5
2013
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Modeling of microelectronic structures and packages using ANSYS software
Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), 2011, p.354-357
2011
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Dispensing process with additional ultrasonic energy
18th European Microelectronics & Packaging Conference, 2011, p.1-4
2011
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Contribution to thick film interdigital capacitor characterization
Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), 2011, p.50-52
2011
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Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders
2012 35th International Spring Seminar on Electronics Technology, 2012, p.201-206
2012
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Contribution to modeling of stressing in microelectronic structures
33rd International Spring Seminar on Electronics Technology, ISSE 2010, 2010, p.383-385
2010
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Optimization of wire loop formation in wirebonding process using computer simulation
2012 35th International Spring Seminar on Electronics Technology, 2012, p.282-285
2012
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The Subject "Electronics Hardware" as interdisciplinary topic for the electric engineering education
Proceedings of the 2012 IEEE Global Engineering Education Conference (EDUCON), 2012, p.1-8
2012
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PAD design reliability for SMD passives
Microelectronics international, 2000-04, Vol.17 (1), p.8-12
2000
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Reliability model for assessment of lifetime of lead-free solder joints
18th European Microelectronics & Packaging Conference, 2011, p.1-5
2011
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Optimizing of PCBA cleaning process through process calibration tools
2013 Eurpoean Microelectronics Packaging Conference (EMPC), 2013, p.1-3
2013
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Bisected thermodynamic sensor as the power AC/DC transmitter
2009 European Microelectronics and Packaging Conference, 2009, p.1-5
2009
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New method for adjustment of elevation of the ceramic flatness for direct deposition
Proceedings of the 36th International Spring Seminar on Electronics Technology, 2013, p.7-10
2013
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