UB Paderborn / Katalog / Suche / in CDI

Dominant component suppression with applications to spectral analysis

2008 37th IEEE Applied Imagery Pattern Recognition Workshop, 2008, p.1-7

Sweet, J.N.

2008

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Integrated test chips improve IC assembly

IEEE circuits and devices magazine, 1990-09, Vol.6 (5), p.39-45

Sweet, J.N.

1990

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The spectral similarity scale and its application to the classification of hyperspectral remote sensing data

IEEE Workshop on Advances in Techniques for Analysis of Remotely Sensed Data, 2003, 2003, p.92-99

Sweet, J.N.

2003

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Assembly test chips and circuits for detecting and measuring mechanical damage in packaged ICs

Proceedings of 1994 IEEE International Integrated Reliability Workshop (IRWS), 1994, p.30-36

Sweet, J.N.

1994

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Thermal conductivity of Inconel 718 and 304 stainless steel

International journal of thermophysics, 1987-09, Vol.8 (5), p.593-606

1987

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An evaluation of atmospheric correction techniques using the spectral similarity scale

IGARSS 2001. Scanning the Present and Resolving the Future. Proceedings. IEEE 2001 International Geoscience and Remote Sensing Symposium (Cat. No.01CH37217), 2001, Vol.5, p.2022-2024 vol.5

2001

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The Use of Special Purpose Assembly Test Chips for Evaluating Reliability in Packaged Devices

International Report on Wafer Level Reliability Workshop, 1992, p.77-82

Sweet, J.N.

1992

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Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999, p.1241-1248

1999

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High Accuracy Die Mechanical Stress Measurement with the ATC04 Assembly Test Chip

International Integrated Reliability Workshop Final Report, 1993, p.90-97

1993

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Liquid encapsulant stress variations as measured with the ATCO4 assembly test chip

1995 Proceedings. 45th Electronic Components and Technology Conference, 1995, p.300-304

1995

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Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

1997 Proceedings 47th Electronic Components and Technology Conference, 1997, p.134-143

1997

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Noise constrained hyperspectral data compression

IGARSS 2001. Scanning the Present and Resolving the Future. Proceedings. IEEE 2001 International Geoscience and Remote Sensing Symposium (Cat. No.01CH37217), 2001, Vol.1, p.94-96 vol.1

2001

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IC chip stress during plastic package molding

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.1326-1331

1998

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Short and long loop manufacturing feedback using multi-sensor assembly test chip

Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade, 1990, p.229-235

1990

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Liquid encapsulant and uniaxial calibration mechanical stress measurement with the ATC04 assembly test chip

1994 Proceedings. 44th Electronic Components and Technology Conference, 1994, p.750-757

1994

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Ion-backscattering analysis of tungsten films on heavily doped SiGe

Journal of applied physics, 1972-01, Vol.43 (9), p.3803-3808

1972

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Electrical characteristics of metal/Si-Ge contacts

Journal of applied physics, 1975-11, Vol.46 (11), p.4904-4920

1975

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Correlations between interfacial oxides and resistance changes for W contacts on heavily doped Si-Ge

Thin solid films, 1975-06, Vol.27 (2), p.263-271

1975

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Thermal resistance measurements and finite element calculations for ceramic hermetic packages

Sixth Annual IEEE Proceedings Semiconductor Thermal and Temperature Measurement Symposium, 1990, p.10-16

1990

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Evaluating plastic assembly processes for high reliability applications using HAST and assembly test chips

1994 Proceedings. 44th Electronic Components and Technology Conference, 1994, p.191-195

1994

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HAST evaluation of organic liquid IC encapsulants using Sandia's assembly test chips

1992 Proceedings 42nd Electronic Components & Technology Conference, 1992, p.951-956

1992

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Reliability of aluminum-nitride filled mold compound

1997 Proceedings 47th Electronic Components and Technology Conference, 1997, p.72-77

1997

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Demonstration of a High Heat Removal Cvd Diamond Substrate Edge-Cooled Multichip Module

Proceedings of the International Conference on Multichip Modules, 1994, p.624-630

1994

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Low-frequency photon-assisted tunneling in superconducting tunnel junctions

Solid state communications, 1970-01, Vol.8 (17), p.1341-1344

1970

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Multichip module enables for high reliability applications

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92, 1992, p.102-105

1992

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Dominant component suppression with applications to spectral analysis

Integrated test chips improve IC assembly

The spectral similarity scale and its application to the classification of hyperspectral remote sensing data

Assembly test chips and circuits for detecting and measuring mechanical damage in packaged ICs

Thermal conductivity of Inconel 718 and 304 stainless steel

An evaluation of atmospheric correction techniques using the spectral similarity scale

The Use of Special Purpose Assembly Test Chips for Evaluating Reliability in Packaged Devices

Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle

High Accuracy Die Mechanical Stress Measurement with the ATC04 Assembly Test Chip

Liquid encapsulant stress variations as measured with the ATCO4 assembly test chip

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

Noise constrained hyperspectral data compression

IC chip stress during plastic package molding

Short and long loop manufacturing feedback using multi-sensor assembly test chip

Liquid encapsulant and uniaxial calibration mechanical stress measurement with the ATC04 assembly test chip

Ion-backscattering analysis of tungsten films on heavily doped SiGe

Electrical characteristics of metal/Si-Ge contacts

Correlations between interfacial oxides and resistance changes for W contacts on heavily doped Si-Ge

Thermal resistance measurements and finite element calculations for ceramic hermetic packages

Evaluating plastic assembly processes for high reliability applications using HAST and assembly test chips

HAST evaluation of organic liquid IC encapsulants using Sandia's assembly test chips

Reliability of aluminum-nitride filled mold compound

Demonstration of a High Heat Removal Cvd Diamond Substrate Edge-Cooled Multichip Module

Low-frequency photon-assisted tunneling in superconducting tunnel junctions

Multichip module enables for high reliability applications

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