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Nondestructive Characterization of Fusion and Plasma Activated Wafer Bonding Using Mesa and Recess Structures

ECS journal of solid state science and technology, 2015-01, Vol.4 (2), p.P42-P52

2015

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A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub- \mu W RTC Mode and Programmable HF Clocks

IEEE journal of solid-state circuits, 2014-01, Vol.49 (1), p.212-222

2014

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MEMS on cavity-SOI wafers

Solid-state electronics, 2007-02, Vol.51 (2), p.328-332

2007

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Bonding of ALD Alumina for Advanced SOI Substrates

ECS transactions, 2010, Vol.33 (4), p.137-144

2010

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Fabrication of InP/SiO2/Si Substrate using Ion-Cutting Process and Selective Chemical Etching

ECS transactions, 2007, Vol.6 (1), p.99-103

2007

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Bonded thick film SOI with pre-etched cavities

Microsystem technologies : sensors, actuators, systems integration, 2006-04, Vol.12 (5), p.406-412

2006

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Chapter 7 - Thick-Film SOI Wafers: Preparation and Properties

Handbook of Silicon Based MEMS Materials and Technologies, 2016, p.206-237

Second Edition, 2016

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Chapter 29 - Silicon Direct Bonding

Handbook of Silicon Based MEMS Materials and Technologies, 2016, p.591-598

Second Edition, 2016

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Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates

MRS proceedings, 2005, Vol.867, Article W3.4

2005

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MEMS on cavity-SOl wafers

Solid-state electronics, 2007, Vol.51 (2), p.328-332

2007

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Thick-Film Silicon-on-Insulator Wafers Preparation and Properties

Handbook of Silicon Based MEMS Materials and Technologies, 2020, p.1-1

3rd Edition, 2020

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Wafer level packaging for hermetical encapsulation of MEMS resonators

2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015, p.1-6

2015

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Silicon Direct Bonding

Handbook of Silicon Based MEMS Materials and Technologies, 2020, p.2-2

3rd Edition, 2020

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Orientation and Boron Concentration Dependence of Si Layer Transfer by Mechanical Exfoliation

MRS proceedings, 2001, Vol.681, Article I9.1

2001

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Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013, p.190-193

2013

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Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005, 2005, p.5-10

2005

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Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2016, p.1-6

2016

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Bonding of ALD Alumina for Advanced SOI Substrates

Meeting abstracts (Electrochemical Society), 2010-07, Vol.MA2010-02 (27), p.1698-1698

2010

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Thick-Film SOI Wafers: Preparation and Properties

Handbook of Silicon Based MEMS Materials and Technologies, 2015, p.1-1

2nd Edition, 2015

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Silicon Direct Bonding

Handbook of Silicon Based MEMS Materials and Technologies, 2015, p.1-1

2nd Edition, 2015

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Direct Bonding of Thick Film Polysilicon to Glass Substrates

Meeting abstracts (Electrochemical Society), 2006-02, Vol.MA2005-01 (11), p.496-496

2006

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Silicon Direct Bonding

Handbook of Silicon Based MEMS Materials and Technologies, 2010, p.1-1

2010

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SOI Wafers with Buried Cavities

Meeting abstracts (Electrochemical Society), 2006-02, Vol.MA2005-01 (11), p.498-498

2006

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Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding

Meeting abstracts (Electrochemical Society), 2006-02, Vol.MA2005-01 (11), p.494-494

2006

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Validation of Cut-Points for Evaluating the Intensity of Physical Activity with Accelerometry-Based Mean Amplitude Deviation (MAD)

PloS one, 2015-08, Vol.10 (8), p.e0134813-e0134813

2015

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Nondestructive Characterization of Fusion and Plasma Activated Wafer Bonding Using Mesa and Recess Structures

A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub- \mu W RTC Mode and Programmable HF Clocks

MEMS on cavity-SOI wafers

Bonding of ALD Alumina for Advanced SOI Substrates

Fabrication of InP/SiO2/Si Substrate using Ion-Cutting Process and Selective Chemical Etching

Bonded thick film SOI with pre-etched cavities

Chapter 7 - Thick-Film SOI Wafers: Preparation and Properties

Chapter 29 - Silicon Direct Bonding

Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates

MEMS on cavity-SOl wafers

Thick-Film Silicon-on-Insulator Wafers Preparation and Properties

Wafer level packaging for hermetical encapsulation of MEMS resonators

Silicon Direct Bonding

Orientation and Boron Concentration Dependence of Si Layer Transfer by Mechanical Exfoliation

Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias

Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Bonding of ALD Alumina for Advanced SOI Substrates

Thick-Film SOI Wafers: Preparation and Properties

Silicon Direct Bonding

Direct Bonding of Thick Film Polysilicon to Glass Substrates

Silicon Direct Bonding

SOI Wafers with Buried Cavities

Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding

Validation of Cut-Points for Evaluating the Intensity of Physical Activity with Accelerometry-Based Mean Amplitude Deviation (MAD)

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