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Robust phosphate capture over inorganic adsorbents derived from lanthanum metal organic frameworks

Chemical engineering journal (Lausanne, Switzerland : 1996), 2017-10, Vol.326, p.1086-1094

2017

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Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu

Journal of materials science. Materials in electronics, 2020-06, Vol.31 (11), p.8258-8267

2020

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Multi-particle molecular dynamics simulation: shell thickness effects on sintering process of Cu-Ag core-shell nanoparticles

Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology, 2021, Vol.23 (1), Article 6

2021

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The fast formation of Cu-Sn intermetallic compound in Cu/Sn/Cu system by induction heating process

Materials letters, 2018-03, Vol.215, p.207-210

2018

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Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

Journal of materials science. Materials in electronics, 2014-06, Vol.25 (6), p.2627-2633

2014

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Effect of isothermal aging on the microstructure, shear behavior and hardness of the Sn58Bi/Sn3.0Ag0.5Cu/Cu solder joints

Results in physics, 2019-12, Vol.15, p.102701, Article 102701

2019

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Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints

Applied physics. A, Materials science & processing, 2020-09, Vol.126 (9), Article 735

2020

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Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes

Journal of materials processing technology, 2016-12, Vol.238, p.290-296

2016

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Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

Crystals (Basel), 2024-03, Vol.14 (3), p.269

2024

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The fast formation of full Cu3Sn solder joints in Cu/Sn/Cu system by thermal gradient bonding

Journal of materials science. Materials in electronics, 2019-02, Vol.30 (3), p.2146-2153

2019

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Sintering mechanism of Ag nanoparticle-nanoflake: a molecular dynamics simulation

Journal of materials research and technology, 2022-01, Vol.16, p.640-655

2022

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Effects of Trace Elements Ag, Bi and Ni on Solid–Liquid Electromigration Interface Diffusion in Solder Joints

Journal of electronic materials, 2021-09, Vol.50 (9), p.5312-5317

2021

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Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints

Journal of materials science. Materials in electronics, 2016-03, Vol.27 (3), p.2235-2241

2016

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Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint

Journal of materials science. Materials in electronics, 2012-09, Vol.23 (9), p.1705-1710

2012

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Study of surface quality in machining nickel-based alloy Inconel 718

International journal of advanced manufacturing technology, 2013-12, Vol.69 (9-12), p.2659-2667

2013

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Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

Results in physics, 2018-12, Vol.11, p.617-622

2018

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Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

Results in physics, 2019-03, Vol.12, p.712-717

2019

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Characterization of interfacial IMCs in low-Ag Sn–Ag–xCu–Bi–Ni solder joints

Journal of materials science. Materials in electronics, 2013, Vol.24 (1), p.290-294

2013

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Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module

IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-05, Vol.9 (5), p.963-972

2019

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Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

Journal of electronic materials, 2015-07, Vol.44 (7), p.2450-2457

2015

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Interfacial reaction, microstructure and mechanical properties of Sn58Bi solder joints on graphene-coated Cu substrate

Results in physics, 2019-06, Vol.13, p.102256, Article 102256

2019

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Thermal and mechanical effects of voids within flip chip soldering in LED packages

Microelectronics and reliability, 2014-09, Vol.54 (9-10), p.2028-2033

2014

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The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method

Journal of materials science. Materials in electronics, 2019-10, Vol.30 (20), p.18878-18884

2019

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Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-11, Vol.4 (11), p.1754-1759

2014

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Shear strength of LED solder joints using SAC-nano Cu solder pastes

Journal of semiconductors, 2017-09, Vol.38 (9), p.90-94

2017

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Robust phosphate capture over inorganic adsorbents derived from lanthanum metal organic frameworks

Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu

Multi-particle molecular dynamics simulation: shell thickness effects on sintering process of Cu-Ag core-shell nanoparticles

The fast formation of Cu-Sn intermetallic compound in Cu/Sn/Cu system by induction heating process

Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

Effect of isothermal aging on the microstructure, shear behavior and hardness of the Sn58Bi/Sn3.0Ag0.5Cu/Cu solder joints

Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints

Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

The fast formation of full Cu3Sn solder joints in Cu/Sn/Cu system by thermal gradient bonding

Sintering mechanism of Ag nanoparticle-nanoflake: a molecular dynamics simulation

Effects of Trace Elements Ag, Bi and Ni on Solid–Liquid Electromigration Interface Diffusion in Solder Joints

Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints

Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint

Study of surface quality in machining nickel-based alloy Inconel 718

Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

Characterization of interfacial IMCs in low-Ag Sn–Ag–xCu–Bi–Ni solder joints

Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module

Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

Interfacial reaction, microstructure and mechanical properties of Sn58Bi solder joints on graphene-coated Cu substrate

Thermal and mechanical effects of voids within flip chip soldering in LED packages

The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method

Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering

Shear strength of LED solder joints using SAC-nano Cu solder pastes

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