UB Paderborn / Katalog / Suche / in CDI

Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

Microelectronics and reliability, 2006-02, Vol.46 (2), p.589-599

2006

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Characterization of the surface morphology of electroless NiP deposited on conductive Cu film

Circuit world, 2015-11, Vol.41 (4), p.137-146

2015

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Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages

Microelectronics and reliability, 2010-04, Vol.50 (4), p.507-513

2010

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Ultrathin nanoclay films with tunable thickness as barrier layers in organic light emitting devices

Journal of materials chemistry, 2012-01, Vol.22 (16), p.7718-7723

2012

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Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging

JSME International Journal Series A Solid Mechanics and Material Engineering, 2000/10/15, Vol.43(4), pp.400-407

2000

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Reliability Verification of Hermetic Package With Nanoliter Cavity for RF-Micro Device

IEEE transactions on advanced packaging, 2010-02, Vol.33 (1), p.64-71

2010

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Wafer-level low temperature bonding with Au-In system

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.633-637

2007

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Characterization and Reliability Verification of Wafer-Level Hermetic Package with Nano-Liter Cavity for RF-MEMS Applications

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.1127-1134

2007

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Warpage Modeling and Characterization to Simulate the Fabrication Process of Wafer-Level Adhesive Bonding

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium, 2007, p.298-302

2007

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Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages : Advances in wafer level packaging

Microelectronics and reliability, 2010, Vol.50 (4), p.507-513

2010

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Measurement of thermo-mechanical deformations of wafer-level CSP assembly under thermal cycling condition

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2001, p.323-327

2001

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Ultrathin nanoclay films with tunable thickness as barrier layers in organic light emitting devicesElectronic supplementary information (ESI) available. See DOI: 10.1039/c2jm00047d

2012-03

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In-situ moire measurement of adhesive flip-chip bonded assembly under thermal cycling condition

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599), 2002, p.63-67

2002

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A study on the thermal deformation of ACF assemblies using moire interferometry and FEM

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458), 2000, p.358-363

2000

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Tryptophan-Based Hyperproduction of Bioindigo by Combinatorial Overexpression of Two Different Tryptophan Transporters

Journal of microbiology and biotechnology, 2024-04, Vol.34 (4), p.969

2024

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Pax9 is essential for granulopoiesis but dispensable for erythropoiesis in zebrafish

Biochemical and biophysical research communications, 2021-01, Vol.534, p.359-366

2021

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Enhanced production of bio-indigo in engineered Escherichia coli, reinforced by cyclopropane-fatty acid-acyl-phospholipid synthase from psychrophilic Pseudomonas sp. B14-6

Journal of biotechnology, 2023-03, Vol.366, p.1-9

2023

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Continuous production of gamma aminobutyric acid by engineered and immobilized Escherichia coli whole-cells in a small-scale reactor system

Enzyme and microbial technology, 2023-08, Vol.168, p.110258-110258, Article 110258

2023

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Tryptophan-Based Hyperproduction of Bioindigo by Combinatorial Overexpression of Two Different Tryptophan Transporters

Journal of microbiology and biotechnology, 2024-04, Vol.34 (4), p.969-977

2024

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액티브 시니어를 위한 머신 러닝 기반 거동 분석 시스템 구축

한국생산제조학회지, 2022, 31(2), , pp.108-115

2022

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Tailoring the SnO 2 Ink for Roll‐to‐Roll Manufacturing of Flexible Perovskite Solar Cells

Energy technology (Weinheim, Germany), 2024-03, Vol.12 (3)

2024

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Tailoring the SnO2 Ink for Roll‐to‐Roll Manufacturing of Flexible Perovskite Solar Cells

Energy technology (Weinheim, Germany), 2024-03, Vol.12 (3), p.n/a

2024

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Glomus tumor of the trachea. Report of a case with ultrastructural observation

Cancer, 1989-08, Vol.64 (4), p.881-886

1989

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MOF-derived Co/Zn single-atom catalysts for reversible hydrogenation and dehydrogenation of quinoline hydrogen carrier

Applied catalysis. B, Environmental, 2023-07, Vol.328, p.122482, Article 122482

2023

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Altered Renal Sodium Transporter Expression in an Animal Model of Type 2 Diabetes Mellitus

Journal of Korean medical science, 2007, Vol.22 (6), p.1034

2007

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Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

Characterization of the surface morphology of electroless NiP deposited on conductive Cu film

Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages

Ultrathin nanoclay films with tunable thickness as barrier layers in organic light emitting devices

Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging

Reliability Verification of Hermetic Package With Nanoliter Cavity for RF-Micro Device

Wafer-level low temperature bonding with Au-In system

Characterization and Reliability Verification of Wafer-Level Hermetic Package with Nano-Liter Cavity for RF-MEMS Applications

Warpage Modeling and Characterization to Simulate the Fabrication Process of Wafer-Level Adhesive Bonding

Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages : Advances in wafer level packaging

Measurement of thermo-mechanical deformations of wafer-level CSP assembly under thermal cycling condition

Ultrathin nanoclay films with tunable thickness as barrier layers in organic light emitting devicesElectronic supplementary information (ESI) available. See DOI: 10.1039/c2jm00047d

In-situ moire measurement of adhesive flip-chip bonded assembly under thermal cycling condition

A study on the thermal deformation of ACF assemblies using moire interferometry and FEM

Tryptophan-Based Hyperproduction of Bioindigo by Combinatorial Overexpression of Two Different Tryptophan Transporters

Pax9 is essential for granulopoiesis but dispensable for erythropoiesis in zebrafish

Enhanced production of bio-indigo in engineered Escherichia coli, reinforced by cyclopropane-fatty acid-acyl-phospholipid synthase from psychrophilic Pseudomonas sp. B14-6

Continuous production of gamma aminobutyric acid by engineered and immobilized Escherichia coli whole-cells in a small-scale reactor system

Tryptophan-Based Hyperproduction of Bioindigo by Combinatorial Overexpression of Two Different Tryptophan Transporters

액티브 시니어를 위한 머신 러닝 기반 거동 분석 시스템 구축

Tailoring the SnO 2 Ink for Roll‐to‐Roll Manufacturing of Flexible Perovskite Solar Cells

Tailoring the SnO2 Ink for Roll‐to‐Roll Manufacturing of Flexible Perovskite Solar Cells

Glomus tumor of the trachea. Report of a case with ultrastructural observation

MOF-derived Co/Zn single-atom catalysts for reversible hydrogenation and dehydrogenation of quinoline hydrogen carrier

Altered Renal Sodium Transporter Expression in an Animal Model of Type 2 Diabetes Mellitus

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