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Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

Experimental mechanics, 2017-04, Vol.57 (4), p.603-614

2017

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Atomistic analysis of the thermomechanical properties of Sn–Ag–Cu solder materials at the nanoscale with the MEAM potential

Journal of molecular modeling, 2019-03, Vol.25 (3), p.59-10, Article 59

2019

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Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys

Journal of electronic materials, 2011-10, Vol.40 (10), p.2093-2104

2011

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Performance Enhancement in Bipolar Junction Transistors Using Uniaxial Stress on (100) Silicon

IEEE transactions on electron devices, 2016-07, Vol.63 (7), p.2643-2649

2016

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The van der Pauw stress sensor

IEEE sensors journal, 2006-04, Vol.6 (2), p.340-356

2006

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Piezoresistive characteristics of short-channel MOSFETs on (100) silicon

IEEE transactions on electron devices, 2001-09, Vol.48 (9), p.2009-2015

2001

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CMOS stress sensors on [100] silicon

IEEE journal of solid-state circuits, 2000-01, Vol.35 (1), p.85-95

2000

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Reliability and Life Study of Hydraulic Solenoid Valve - Part 1 - A Multi-physics Finite Element Model

SAE International journal of engines, 2009-04, Vol.2 (1), p.1114-1124, Article 2009-01-1138

2009

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Characterization of residual stress levels in complementary bipolar junction transistors on (100) silicon

2015 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM, 2015, p.60-63

2015

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Model for BGA and CSP reliability in automotive underhood applications

IEEE transactions on components and packaging technologies, 2004-09, Vol.27 (3), p.585-593

2004

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Determination of Anand constants for SAC solders using stress-strain or creep data

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.910-922

2012

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CMOS Sensor Arrays for High Resolution Die Stress Mapping in Packaged Integrated Circuits

IEEE sensors journal, 2013-06, Vol.13 (6), p.2066-2076

2013

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Silicon piezoresistive stress sensors and their application in electronic packaging

IEEE sensors journal, 2001-06, Vol.1 (1), p.14-30

2001

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Die stress characterization in flip chip on laminate assemblies

IEEE transactions on components and packaging technologies, 2005-09, Vol.28 (3), p.415-429

2005

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The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability

2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, 2010, p.1-5

2010

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Effects of interlaminar stresses on damping of 0-degree unidirectional laminated composites

Polymer composites, 1999-12, Vol.20 (6), p.796-803

1999

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Reliability and life study of hydraulic solenoid valve. Part 1: A multi-physics finite element model

Engineering failure analysis, 2009-04, Vol.16 (3), p.874-887

2009

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Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-Type Silicon Using Hydrostatic Testing

IEEE sensors journal, 2008-04, Vol.8 (4), p.392-400

2008

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Evolution of the tension/compression and shear cyclic stress-strain behavior of lead-free solder subjected to isothermal aging

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.765-780

2012

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Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies

IEEE transactions on components and packaging technologies, 2008-03, Vol.31 (1), p.173-183

2008

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Thermo-mechanical reliability tradeoffs for deployment of area array packages in harsh environments

IEEE transactions on components and packaging technologies, 2005-09, Vol.28 (3), p.457-466

2005

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Measurement of the temperature dependent constitutive behavior of underfill encapsulants

IEEE transactions on components and packaging technologies, 2005-09, Vol.28 (3), p.467-476

2005

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Prognostics and Health Management of Electronic Packaging

IEEE transactions on components and packaging technologies, 2006-09, Vol.29 (3), p.666-677

2006

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Reliability and life study of hydraulic solenoid valve. Part 2: Experimental study

Engineering failure analysis, 2009-04, Vol.16 (3), p.944-963

2009

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Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

IEEE transactions on components and packaging technologies, 2008-03, Vol.31 (1), p.104-113

2008

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Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

Atomistic analysis of the thermomechanical properties of Sn–Ag–Cu solder materials at the nanoscale with the MEAM potential

Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys

Performance Enhancement in Bipolar Junction Transistors Using Uniaxial Stress on (100) Silicon

The van der Pauw stress sensor

Piezoresistive characteristics of short-channel MOSFETs on (100) silicon

CMOS stress sensors on [100] silicon

Reliability and Life Study of Hydraulic Solenoid Valve - Part 1 - A Multi-physics Finite Element Model

Characterization of residual stress levels in complementary bipolar junction transistors on (100) silicon

Model for BGA and CSP reliability in automotive underhood applications

Determination of Anand constants for SAC solders using stress-strain or creep data

CMOS Sensor Arrays for High Resolution Die Stress Mapping in Packaged Integrated Circuits

Silicon piezoresistive stress sensors and their application in electronic packaging

Die stress characterization in flip chip on laminate assemblies

The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability

Effects of interlaminar stresses on damping of 0-degree unidirectional laminated composites

Reliability and life study of hydraulic solenoid valve. Part 1: A multi-physics finite element model

Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-Type Silicon Using Hydrostatic Testing

Evolution of the tension/compression and shear cyclic stress-strain behavior of lead-free solder subjected to isothermal aging

Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies

Thermo-mechanical reliability tradeoffs for deployment of area array packages in harsh environments

Measurement of the temperature dependent constitutive behavior of underfill encapsulants

Prognostics and Health Management of Electronic Packaging

Reliability and life study of hydraulic solenoid valve. Part 2: Experimental study

Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

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