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Quantifying surgeon's performance: probabilistic approach

British journal of surgery, 2022-04, Vol.109 (5), p.399-400

Suhir, E

2022

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Expected life-time of an optical silica fiber intended for open space applications: Probabilistic predictive model

Acta astronautica, 2022-03, Vol.192, p.418-423

Suhir, E.

2022

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Landing on Mars: probabilistic modeling enables quantifying the last “six minutes of terror”

Acta astronautica, 2021-02, Vol.179, p.680-684

Suhir, E.

2021

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Astronaut's performance vs. his/hers human-capacity-factor and state-of-health: Application of double-exponential-probability-distribution function

Acta astronautica, 2021-01, Vol.178, p.250-256

Suhir, E.

2021

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Avoiding inelastic strains in solder joint interconnections of space electronics

Zeitschrift für angewandte Mathematik und Mechanik, 2023-02, Vol.103 (2), p.n/a

Suhir, E.

2023

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Survivability of species in different habitats: Application of multi-parametric Boltzmann-Arrhenius-Zhurkov equation

Acta astronautica, 2020-10, Vol.175, p.249-253

Suhir, E.

2020

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How accurate should sight distance measurements be?

Theoretical issues in ergonomics science, 2022-05, Vol.23 (3), p.306-312

Suhir, E.

2022

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What could and should be done differently: failure-oriented-accelerated-testing (FOAT) and its role in making an aerospace electronics device into a product

Journal of materials science. Materials in electronics, 2018-02, Vol.29 (4), p.2939-2948

Suhir, E.

2018

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Head-on railway obstruction: a probabilistic model

Theoretical issues in ergonomics science, 2021-07, Vol.22 (4), p.434-440

Suhir, E.

2021

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Static fatigue lifetime of optical fibers assessed using Boltzmann–Arrhenius–Zhurkov (BAZ) model

Journal of materials science. Materials in electronics, 2017-08, Vol.28 (16), p.11689-11694

Suhir, E.

2017

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Analytical thermal stress model for a typical flip-chip (FC) package design

Journal of materials science. Materials in electronics, 2018-02, Vol.29 (4), p.2676-2688

Suhir, E.

2018

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Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: optimized stress relief

Journal of materials science. Materials in electronics, 2016-05, Vol.27 (5), p.4816-4825

Suhir, E.

2016

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Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends

Journal of materials science. Materials in electronics, 2016-06, Vol.27 (6), p.5563-5574

Suhir, E.

2016

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Bi-material assembly subjected to thermal stress: propensity to delamination assessed using interfacial compliance model

Journal of materials science. Materials in electronics, 2016-07, Vol.27 (7), p.6779-6785

Suhir, E.

2016

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Thermal stress in through-silicon-vias: Theory-of-elasticity approach

Microelectronics and reliability, 2014-05, Vol.54 (5), p.972-977

Suhir, E.

2014

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Aerospace electronics reliability prediction: application of two advanced probabilistic techniques

Zeitschrift für angewandte Mathematik und Mechanik, 2018-05, Vol.98 (5), p.824-839

Suhir, E.

2018

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Analytical bathtub curve with application to electron device reliability

Journal of materials science. Materials in electronics, 2015-09, Vol.26 (9), p.6633-6638

Suhir, E.

2015

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Three-step concept (TSC) in modeling microelectronics reliability (MR): Boltzmann–Arrhenius–Zhurkov (BAZ) probabilistic physics-of-failure equation sandwiched between two statistical models

Microelectronics and reliability, 2014-11, Vol.54 (11), p.2594-2603

Suhir, E.

2014

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Elastic stability of a compressed cantilever beam on an elastic foundation, with application to a dual-coated fiber-optic connector

International journal of engineering science, 2014-10, Vol.83, p.85-94

Suhir, E.

2014

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Thermal stress in a bi-material assembly with a 'piecewise-continuous' bonding layer: theorem of three axial forces

Journal of physics. D, Applied physics, 2009-02, Vol.42 (4), p.045507-045507 (8)

Suhir, E

2009

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When adequate and predictable reliability is imperative

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.2342-2346

Suhir, E.

2012

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Double-exponential-probability-distribution-function and it's applications in some critical aerospace safety problems: Perspective and brief review

Microelectronics and reliability, 2024-08, Vol.159, p.115439, Article 115439

Suhir, E.

2024

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Elastic Stability of a Cantilever Beam (Rod) Supported by an Elastic Foundation, With Application to Nano-Composites

Journal of applied mechanics, 2012-01, Vol.79 (1), p.1-8

Suhir, E

2012

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Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?

Journal of applied mechanics, 2012-11, Vol.79 (6)

2012

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Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly

Journal of applied mechanics, 2013-01, Vol.80 (1), p.1-12

Suhir, E

2013

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Quantifying surgeon's performance: probabilistic approach

Expected life-time of an optical silica fiber intended for open space applications: Probabilistic predictive model

Landing on Mars: probabilistic modeling enables quantifying the last “six minutes of terror”

Astronaut's performance vs. his/hers human-capacity-factor and state-of-health: Application of double-exponential-probability-distribution function

Avoiding inelastic strains in solder joint interconnections of space electronics

Survivability of species in different habitats: Application of multi-parametric Boltzmann-Arrhenius-Zhurkov equation

How accurate should sight distance measurements be?

What could and should be done differently: failure-oriented-accelerated-testing (FOAT) and its role in making an aerospace electronics device into a product

Head-on railway obstruction: a probabilistic model

Static fatigue lifetime of optical fibers assessed using Boltzmann–Arrhenius–Zhurkov (BAZ) model

Analytical thermal stress model for a typical flip-chip (FC) package design

Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: optimized stress relief

Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends

Bi-material assembly subjected to thermal stress: propensity to delamination assessed using interfacial compliance model

Thermal stress in through-silicon-vias: Theory-of-elasticity approach

Aerospace electronics reliability prediction: application of two advanced probabilistic techniques

Analytical bathtub curve with application to electron device reliability

Three-step concept (TSC) in modeling microelectronics reliability (MR): Boltzmann–Arrhenius–Zhurkov (BAZ) probabilistic physics-of-failure equation sandwiched between two statistical models

Elastic stability of a compressed cantilever beam on an elastic foundation, with application to a dual-coated fiber-optic connector

Thermal stress in a bi-material assembly with a 'piecewise-continuous' bonding layer: theorem of three axial forces

When adequate and predictable reliability is imperative

Double-exponential-probability-distribution-function and it's applications in some critical aerospace safety problems: Perspective and brief review

Elastic Stability of a Cantilever Beam (Rod) Supported by an Elastic Foundation, With Application to Nano-Composites

Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?

Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly

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